Mi Technovation Berhad, an investment holding company, engages in the design, development, manufacturing, and sales of semiconductor manufacturing equipment in Southeast Asia, Northeast Asia, and North America. It operates through Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Semiconductor Solutions Business Unit, and Others segments. The Semiconductor Equipment Business Unit segment offers assembly and packaging, vision inspection, laser assisted bonding, and power and final test equipment; provides maintenance services and technical support for the machines; and sells associated spare parts and components. The Semiconductor Material Business Unit segment provides solder spheres in various forms, such as small, ultra small, ultralow alpha solder, and copper core solder balls used in ball grid array and wafer level packaging in the semiconductor industry. The Semiconductor Solutions Business Unit segment offers high power modules and devices for wide bandgap applications in automotive and renewable energy sectors. It also involved in design, development, manufacture, and sale of wafer level chip scale packaging sorting and precision bonding machines; provision of management services; and research and development, manufacture, sale, and marketing of specific process and application in assembly and packaging solutions to customers. The company was formerly known as Mi Equipment Holdings Berhad and changed its name to Mi Technovation Berhad in December 2018. Mi Technovation Berhad was founded in 2007 and is headquartered in Bayan Lepas, Malaysia.