VIA Technologies, Inc. engages in the programming, design, manufacture, and sale of semiconductors and PC chip sets in Taiwan, Hong Kong, and China. It offers automotive solutions, including a range of VIA Mobile360 systems and devices that use a suite of AI-powered people detection, driver safety system, and sensor fusion technologies; building solutions that consists of access control systems, video intercom systems, home automation tablets, smart doorbell, touchpad alarm systems, and video alarm systems; and industrial solutions, including plastic bag stitching inspection, wafer inspection, smoke detection, worker PPE inspection, worker PPE class 2/4 inspection, and pipeline weld inspection. The company also provides edge modules, such as VIA SOM-7000, VIA SOM-5000, and VIA SOM-3000; edge boards, such as VIA VAB-5000, VIA VAB-3000, and VIA EPIA-M930; and VIA AI Transforma Model 1 platform; and edge systems comprising the VIA ARTiGO series systems and VIA AMOS. In addition, it is involved in the manufacture and sale of communication and electronic parts; design and manufacture of CPU and licensing of microprocessor-related intellectual property; manufacture, research, development, and sale of integrated circuit chips; and sale of graphic chipsets. Further, the company offers integrated circuit chip testing and packaging; information software processing; CPU contract technical services; and sales marketing support services. VIA Technologies, Inc. was founded in 1987 and is headquartered in New Taipei City, Taiwan.