Techbond Group Bhd

KLSE:5289 Malaysia Specialty Chemicals
Market Cap
$48.01 Million
RM216.23 Million MYR
Market Cap Rank
#27028 Global
#434 in Malaysia
Share Price
RM0.29
Change (1 day)
+0.00%
52-Week Range
RM0.28 - RM0.34
All Time High
RM0.77
About

Techbond Group Berhad develops, manufactures, and trades in industrial adhesives and sealants in Malaysia, Vietnam, Indonesia, Thailand, China, and internationally. The company offers industrial adhesives, including water-based and hot melt adhesives; and industrial sealants, such as water-based, solvent-based, and modified hybrid sealants. It also provides supporting products and services, inclu… Read more

Techbond Group Bhd (5289) - Total Liabilities

Latest total liabilities as of December 2025: RM35.55 Million MYR

Based on the latest financial reports, Techbond Group Bhd (5289) has total liabilities worth RM35.55 Million MYR as of December 2025.

Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Techbond Group Bhd - Total Liabilities Trend (2015–2025)

This chart illustrates how Techbond Group Bhd's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.

Techbond Group Bhd Competitors by Total Liabilities

The table below lists competitors of Techbond Group Bhd ranked by their total liabilities.

Company Country Total Liabilities
CU Medical Systems Inc
KQ:115480
Korea ₩42.18 Billion
BeLive Holdings Ordinary Share
NASDAQ:BLIV
USA $970.07K
Camellia Metal Co Ltd
TWO:2064
Taiwan NT$1.51 Billion
Fractal Gaming Group AB
ST:FRACTL
Sweden Skr230.10 Million
Cleanspace Holdings Ltd
AU:CSX
Australia AU$8.41 Million
Jembo Cable Company Tbk
JK:JECC
Indonesia Rp1.65 Trillion
R.P.P. Infra Projects Limited
NSE:RPPINFRA
India ₹4.26 Billion
Scope AI Corp.
OTCQB:SCPCF
USA $831.95K

Liability Composition Analysis (2015–2025)

This chart breaks down Techbond Group Bhd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 7.76 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.14 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.12 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Techbond Group Bhd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Techbond Group Bhd (2015–2025)

The table below shows the annual total liabilities of Techbond Group Bhd from 2015 to 2025.

Year Total Liabilities Change
2025-06-30 RM28.43 Million -29.37%
2024-06-30 RM40.26 Million -18.38%
2023-06-30 RM49.32 Million +172.22%
2022-06-30 RM18.12 Million +51.16%
2021-06-30 RM11.99 Million +39.63%
2020-06-30 RM8.59 Million +4.99%
2019-06-30 RM8.18 Million -27.10%
2018-06-30 RM11.22 Million +6.72%
2017-06-30 RM10.51 Million -64.43%
2016-06-30 RM29.55 Million -0.69%
2015-06-30 RM29.75 Million --