Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A
Telink Semiconductor(Shanghai)Co.,Ltd. engages in research, development, design, and sales of low-power wireless IoT chips. It also offers wireless communication chip products, such as low-power Bluetooth, dual-mode Bluetooth, Zigbee, Matter, WiFi, etc. Its products are used in computer peripherals, smart homes, smart hardware, smart industrial systems, smart business systems, and other fields. T… Read more
Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A (688591) - Total Liabilities
Latest total liabilities as of June 2025: CN¥118.14 Million CNY
Based on the latest financial reports, Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A (688591) has total liabilities worth CN¥118.14 Million CNY as of June 2025.
Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A - Total Liabilities Trend (2021–2024)
This chart illustrates how Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.
Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A Competitors by Total Liabilities
The table below lists competitors of Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
MATSUI SEC
MU:MTW
|
Germany | €1.10 Trillion |
|
Ecomembrane S.p.A.
F:IY0
|
Germany | €13.40 Million |
|
Mingteng International Corporation Inc. Ordinary Shares
NASDAQ:MTEN
|
USA | $5.69 Million |
|
Custodian REIT PLC
LSE:CREI
|
UK | GBX191.19 Million |
|
Magnum Goldcorp Inc
PINK:MGIDF
|
USA | $144.61K |
Liability Composition Analysis (2021–2024)
This chart breaks down Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 28.06 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.05 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.05 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A (2021–2024)
The table below shows the annual total liabilities of Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A from 2021 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥146.39 Million | +65.37% |
| 2023-12-31 | CN¥88.52 Million | +35.30% |
| 2022-12-31 | CN¥65.43 Million | -26.30% |
| 2021-12-31 | CN¥88.77 Million | -- |