Hua Hsu Advanced Technology Co., Ltd.

TWO:6682 Taiwan Semiconductor Equipment & Materials
Market Cap
$171.40 Million
NT$5.67 Billion TWD
Market Cap Rank
#18633 Global
#868 in Taiwan
Share Price
NT$38.55
Change (1 day)
-3.50%
52-Week Range
NT$22.65 - NT$39.95
All Time High
NT$39.95
About

Hua Hsu Advanced Technology Co., Ltd. researches and develops, manufactures, and sells electroplated diamond wires. The company also provides solar silicon chip cutting services. Its products are primarily used for cutting hard and brittle materials, such as sapphire, silicon materials, magnetic materials, etc. The company was formerly known as Hua Hsu Silicon Materials Co., Ltd. and changed its … Read more

Hua Hsu Advanced Technology Co., Ltd. (6682) - Total Liabilities

Latest total liabilities as of June 2025: NT$749.39 Million TWD

Based on the latest financial reports, Hua Hsu Advanced Technology Co., Ltd. (6682) has total liabilities worth NT$749.39 Million TWD as of June 2025.

Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Hua Hsu Advanced Technology Co., Ltd. - Total Liabilities Trend (2019–2024)

This chart illustrates how Hua Hsu Advanced Technology Co., Ltd.'s total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.

Hua Hsu Advanced Technology Co., Ltd. Competitors by Total Liabilities

The table below lists competitors of Hua Hsu Advanced Technology Co., Ltd. ranked by their total liabilities.

Company Country Total Liabilities
Riverview Bancorp Inc
NASDAQ:RVSB
USA $1.35 Billion
Core Lithium Ltd
PINK:CXOXF
USA $20.49 Million
Newcore Gold Ltd
OTCQX:NCAUF
USA $6.03 Million
NOROO Paint & Coatings Co Ltd
KO:090355
Korea ₩280.30 Billion
Agfa-Gevaert NV
PINK:AFGVF
USA $1.00 Billion
AFC Energy plc
PINK:AFGYF
USA $6.05 Million
The Pinkfong Company
KQ:403850
Korea ₩19.06 Billion
Solux Co. Ltd
KQ:290690
Korea ₩44.57 Billion

Liability Composition Analysis (2019–2024)

This chart breaks down Hua Hsu Advanced Technology Co., Ltd.'s total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.69 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.96 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.44 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hua Hsu Advanced Technology Co., Ltd.'s debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hua Hsu Advanced Technology Co., Ltd. (2019–2024)

The table below shows the annual total liabilities of Hua Hsu Advanced Technology Co., Ltd. from 2019 to 2024.

Year Total Liabilities Change
2024-12-31 NT$404.62 Million -23.15%
2023-12-31 NT$526.50 Million -9.27%
2022-12-31 NT$580.31 Million -26.16%
2021-12-31 NT$785.91 Million +75.97%
2020-12-31 NT$446.63 Million +2073.37%
2019-12-31 NT$20.55 Million --