Hana Microelectronics Public Company Limited - Asset Resilience Ratio
Hana Microelectronics Public Company Limited (HAA1) has an Asset Resilience Ratio of 19.53% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check HAA1 capital-intensive asset ratio to assess the company's strategic physical and investment asset allocation.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2016–2024)
This chart shows how Hana Microelectronics Public Company Limited's Asset Resilience Ratio has changed over time. See HAA1 equity financing ratio to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Hana Microelectronics Public Company Limited's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Hana Microelectronics Public Company Lim market cap and net worth.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | €0.00 | 0% |
| Short-term Investments | €6.16 Billion | 19.53% |
| Total Liquid Assets | €6.16 Billion | 19.53% |
Asset Resilience Insights
- Good Liquidity Position: Hana Microelectronics Public Company Limited maintains a healthy 19.53% of assets in liquid form.
- This level provides good financial flexibility while maintaining productive asset deployment.
- The company has significant short-term investments, indicating active treasury management.
Hana Microelectronics Public Company Limited Industry Peers by Asset Resilience Ratio
Compare Hana Microelectronics Public Company Limited's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Lens Technology Co Ltd
SHE:300433 |
Electronic Components | 1.43% |
|
Elite Material Co Ltd
TW:2383 |
Electronic Components | 0.00% |
|
FangDa Carbon New Material Co Ltd
SHG:600516 |
Electronic Components | 4.27% |
|
Holitech Technology Co Ltd
SHE:002217 |
Electronic Components | 0.87% |
|
Shenzhen Jufei Optoelectronics
SHE:300303 |
Electronic Components | 19.39% |
|
TXC Corp
TW:3042 |
Electronic Components | 6.15% |
|
Guangdong Ellington Electronics Technology Co Ltd
SHG:603328 |
Electronic Components | 4.13% |
|
Suzhou GYZ Electronic Technology Co. Ltd. A
SHG:688260 |
Electronic Components | 3.19% |
Annual Asset Resilience Ratio for Hana Microelectronics Public Company Limited (2016–2024)
The table below shows the annual Asset Resilience Ratio data for Hana Microelectronics Public Company Limited.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 12.47% | €4.06 Billion ≈ $4.74 Billion |
€32.52 Billion ≈ $38.01 Billion |
+6.98pp |
| 2023-12-31 | 5.49% | €1.94 Billion ≈ $2.27 Billion |
€35.31 Billion ≈ $41.28 Billion |
+1.47pp |
| 2022-12-31 | 4.02% | €1.19 Billion ≈ $1.39 Billion |
€29.70 Billion ≈ $34.73 Billion |
-5.59pp |
| 2021-12-31 | 9.61% | €2.68 Billion ≈ $3.13 Billion |
€27.85 Billion ≈ $32.56 Billion |
+9.59pp |
| 2020-12-31 | 0.02% | €4.27 Million ≈ $4.99 Million |
€25.18 Billion ≈ $29.44 Billion |
-14.65pp |
| 2019-12-31 | 14.67% | €3.58 Billion ≈ $4.19 Billion |
€24.43 Billion ≈ $28.56 Billion |
-2.93pp |
| 2018-12-31 | 17.60% | €4.47 Billion ≈ $5.22 Billion |
€25.37 Billion ≈ $29.66 Billion |
-2.82pp |
| 2017-12-31 | 20.42% | €4.98 Billion ≈ $5.83 Billion |
€24.40 Billion ≈ $28.53 Billion |
+6.57pp |
| 2016-12-31 | 13.85% | €3.29 Billion ≈ $3.85 Billion |
€23.78 Billion ≈ $27.80 Billion |
-- |
About Hana Microelectronics Public Company Limited
Hana Microelectronics Public Company Limited, together with its subsidiaries, engages in the manufacture and trading of electronic components. The company provides printed circuit board assemblies, chip-on-board and flex assembly and test, lamination, coil, winding, integrated circuit assemblies and tests, and LED packaging and test services. It also offers electronics manufacturing, and outsourc… Read more