Okins Electronics Co. Ltd - Asset Resilience Ratio
Okins Electronics Co. Ltd (080580) has an Asset Resilience Ratio of 2.14% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read 080580 liabilities breakdown for a breakdown of total debt and financial obligations.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2014–2024)
This chart shows how Okins Electronics Co. Ltd's Asset Resilience Ratio has changed over time. See 080580 book value for net asset value and shareholders' equity analysis.
Liquid Assets Composition Over Time
This chart breaks down Okins Electronics Co. Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 080580 stock market capitalisation.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | ₩0.00 | 0% |
| Short-term Investments | ₩2.11 Billion | 2.14% |
| Total Liquid Assets | ₩2.11 Billion | 2.14% |
Asset Resilience Insights
- Limited Liquidity: Okins Electronics Co. Ltd maintains only 2.14% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Okins Electronics Co. Ltd Industry Peers by Asset Resilience Ratio
Compare Okins Electronics Co. Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Applied Materials Inc
NASDAQ:AMAT |
Semiconductor Equipment & Materials | 3.43% |
|
TongFu Microelectronics Co Ltd
SHE:002156 |
Semiconductor Equipment & Materials | 0.01% |
|
Zhejiang Jingsheng Mech Electric
SHE:300316 |
Semiconductor Equipment & Materials | 3.99% |
|
LEENO Industrial Inc
KQ:058470 |
Semiconductor Equipment & Materials | 46.73% |
|
Grand Plastic Technology
TWO:3131 |
Semiconductor Equipment & Materials | 24.05% |
|
Wuxi Nce Power Co Ltd
SHG:605111 |
Semiconductor Equipment & Materials | 1.29% |
|
JiLin Sino-Microelectronics Co Ltd
SHG:600360 |
Semiconductor Equipment & Materials | 8.45% |
|
Jiangsu HHCK Advanced Materials Co. Ltd. A
SHG:688535 |
Semiconductor Equipment & Materials | 0.01% |
Annual Asset Resilience Ratio for Okins Electronics Co. Ltd (2014–2024)
The table below shows the annual Asset Resilience Ratio data for Okins Electronics Co. Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 2.33% | ₩2.03 Billion ≈ $1.37 Million |
₩87.12 Billion ≈ $59.04 Million |
-0.08pp |
| 2023-12-31 | 2.41% | ₩2.20 Billion ≈ $1.49 Million |
₩91.50 Billion ≈ $62.01 Million |
-13.48pp |
| 2022-12-31 | 15.89% | ₩13.12 Billion ≈ $8.89 Million |
₩82.56 Billion ≈ $55.95 Million |
-7.26pp |
| 2021-12-31 | 23.15% | ₩17.91 Billion ≈ $12.14 Million |
₩77.39 Billion ≈ $52.44 Million |
+14.78pp |
| 2020-12-31 | 8.37% | ₩4.88 Billion ≈ $3.31 Million |
₩58.31 Billion ≈ $39.51 Million |
-2.98pp |
| 2019-12-31 | 11.35% | ₩6.22 Billion ≈ $4.22 Million |
₩54.82 Billion ≈ $37.15 Million |
+2.35pp |
| 2018-12-31 | 9.00% | ₩4.39 Billion ≈ $2.98 Million |
₩48.79 Billion ≈ $33.07 Million |
-7.78pp |
| 2017-12-31 | 16.78% | ₩9.54 Billion ≈ $6.47 Million |
₩56.89 Billion ≈ $38.55 Million |
-2.90pp |
| 2016-12-31 | 19.68% | ₩11.32 Billion ≈ $7.67 Million |
₩57.51 Billion ≈ $38.98 Million |
+18.22pp |
| 2015-12-31 | 1.45% | ₩845.00 Million ≈ $572.64K |
₩58.15 Billion ≈ $39.41 Million |
+0.34pp |
| 2014-12-31 | 1.11% | ₩733.04 Million ≈ $496.77K |
₩65.96 Billion ≈ $44.70 Million |
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About Okins Electronics Co. Ltd
Okins Electronics Co.,Ltd. manufactures and sells semiconductor inspection sockets. It offers interconnection solutions for electrical testing of IC devices, including burn-in sockets, test sockets, memory module test sockets, SSD module sockets, spring probes/pins, and PION contacts. The company also provides semiconductor test services that comprises test development, wafer probing, and package… Read more