Kyobo 3 SPAC - Asset Resilience Ratio

Latest as of March 2025: 6.53%

Kyobo 3 SPAC (208710) has an Asset Resilience Ratio of 6.53% as of March 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Kyobo 3 SPAC working capital to net assets to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

₩5.60 Billion
≈ $3.79 Million USD Cash + Short-term Investments

Total Assets

₩85.79 Billion
≈ $58.14 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2015–2024)

This chart shows how Kyobo 3 SPAC's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see 208710 total asset value.

Liquid Assets Composition Over Time

This chart breaks down Kyobo 3 SPAC's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Explore long-term investment intensity of Kyobo 3 SPAC to see how much of total assets are deployed in long-term investments.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents ₩5.60 Billion 6.53%
Short-term Investments ₩-1.05K -0.0%
Total Liquid Assets ₩5.60 Billion 6.53%

Asset Resilience Insights

  • Limited Liquidity: Kyobo 3 SPAC maintains only 6.53% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company primarily holds liquidity in cash and equivalents rather than short-term investments.

Kyobo 3 SPAC Industry Peers by Asset Resilience Ratio

Compare Kyobo 3 SPAC's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Gold Circuit Electronics Ltd
TW:2368
Electronic Components 0.52%
Shennan Circuits Co Ltd Class A
SHE:002916
Electronic Components 1.57%
Goldenmax International Technology Ltd
SHE:002636
Electronic Components 2.56%
LG Innotek Co Ltd
KO:011070
Electronic Components 0.01%
Shanghai Wanye Enterprises Co Ltd
SHG:600641
Electronic Components 0.06%
Suzhou HYC Technology Co Ltd
SHG:688001
Electronic Components 0.06%
Co-Tech Development
TWO:8358
Electronic Components 0.16%
Long Young Electronic (Kunshan) Co. Ltd. A
SHE:301389
Electronic Components 27.28%

Annual Asset Resilience Ratio for Kyobo 3 SPAC (2015–2024)

The table below shows the annual Asset Resilience Ratio data for Kyobo 3 SPAC.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 8.03% ₩7.94 Billion
≈ $5.38 Million
₩98.90 Billion
≈ $67.02 Million
-0.18pp
2023-12-31 8.21% ₩8.87 Billion
≈ $6.01 Million
₩108.15 Billion
≈ $73.29 Million
+4.82pp
2022-12-31 3.39% ₩2.92 Billion
≈ $1.98 Million
₩86.05 Billion
≈ $58.32 Million
-7.16pp
2021-12-31 10.55% ₩10.95 Billion
≈ $7.42 Million
₩103.77 Billion
≈ $70.32 Million
+6.40pp
2020-12-31 4.15% ₩4.20 Billion
≈ $2.85 Million
₩101.14 Billion
≈ $68.54 Million
-3.25pp
2019-12-31 7.41% ₩6.58 Billion
≈ $4.46 Million
₩88.92 Billion
≈ $60.26 Million
-0.64pp
2018-12-31 8.04% ₩6.16 Billion
≈ $4.17 Million
₩76.55 Billion
≈ $51.88 Million
-11.44pp
2017-12-31 19.48% ₩12.45 Billion
≈ $8.44 Million
₩63.92 Billion
≈ $43.32 Million
+14.13pp
2016-12-31 5.35% ₩2.82 Billion
≈ $1.91 Million
₩52.64 Billion
≈ $35.67 Million
+4.56pp
2015-12-31 0.79% ₩335.00 Million
≈ $227.02K
₩42.36 Billion
≈ $28.71 Million
--
pp = percentage points

About Kyobo 3 SPAC

KQ:208710 Korea Electronic Components
Market Cap
$24.91 Million
₩36.76 Billion KRW
Market Cap Rank
#24489 Global
#1752 in Korea
Share Price
₩2790.00
Change (1 day)
-1.59%
52-Week Range
₩1800.00 - ₩4605.00
All Time High
₩6260.00
About

Photon Co., Ltd. engages in the manufacture and sale of camera module parts for smart phones in China and internationally. It offers AF/OIS (optical image stabilization) FPCB assy, folded zoom FPCB assy, SUB assy, ISM, winding coils, etc. The company was formerly known as Biolog Device Co., Ltd. and changed its name to Photon Co., Ltd. in April 2025. The company was founded in 2008 and is headqua… Read more