Shinko Electric Industries Co., Ltd. develops, produces, and sells various semiconductor packages in Japan. The company manufactures and sells plastic laminated packages, leadframes, heat spreaders, arresters, and ceramic electrostatic chuck products; and IC assemblies. It also offers various substrates comprising flip-chip package, plastic-BGA, coreless, and 2.3D package, as well as substrate with optical waveguides; thermal management parts, such as heat spreaders and carbon nanotube thermal interface materials; ceramic electrostatic chucks for semiconductor manufacturing equipment; and motor cores and precision die parts. In addition, the company provides device embedded packages, bare die flip-chip packages, molded underfill flip-chip packages, high-heat-dissipation flip-chip packages, and optical chiplet/co-packaged optics; glass-to-metal seals for LD devices and CAN packages for high-speed optical communication; and related technology. It serves computer and networking, mobile, industrial and IoT, and automotive industries. The company was founded in 1946 and is headquartered in Nagano, Japan. Shinko Electric Industries Co., Ltd. operates as a subsidiary of Fujitsu Limited.