TongFu Microelectronics Co Ltd - Asset Resilience Ratio

Latest as of September 2024: 0.01%

TongFu Microelectronics Co Ltd (002156) has an Asset Resilience Ratio of 0.01% as of September 2024. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check TongFu Microelectronics Co Ltd PP&E and investment ratio to assess the company's strategic physical and investment asset allocation.

Liquid Assets

CN¥3.82 Million
≈ $558.80K USD Cash + Short-term Investments

Total Assets

CN¥38.07 Billion
≈ $5.57 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2014–2023)

This chart shows how TongFu Microelectronics Co Ltd's Asset Resilience Ratio has changed over time. See net asset quality index of TongFu Microelectronics Co Ltd to measure how much of total assets are equity-financed.

Liquid Assets Composition Over Time

This chart breaks down TongFu Microelectronics Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 002156 market cap overview.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥3.82 Million 0.01%
Total Liquid Assets CN¥3.82 Million 0.01%

Asset Resilience Insights

  • Limited Liquidity: TongFu Microelectronics Co Ltd maintains only 0.01% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

TongFu Microelectronics Co Ltd Industry Peers by Asset Resilience Ratio

Compare TongFu Microelectronics Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Skyverse Technology Co. Ltd. A
SHG:688361
Semiconductor Equipment & Materials 14.49%
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401
Semiconductor Equipment & Materials 4.11%
KoMiCo Ltd
KQ:183300
Semiconductor Equipment & Materials 1.50%
D I Corp
KO:003160
Semiconductor Equipment & Materials 0.86%
Semco Technologies Sas
PA:ALSEM
Semiconductor Equipment & Materials 0.08%
Hisem Co Ltd
KQ:200470
Semiconductor Equipment & Materials 1.23%
New Power Plasma Co.Ltd
KQ:144960
Semiconductor Equipment & Materials 0.99%
Bluglass Ltd
AU:BLG
Semiconductor Equipment & Materials 23.98%

Annual Asset Resilience Ratio for TongFu Microelectronics Co Ltd (2014–2023)

The table below shows the annual Asset Resilience Ratio data for TongFu Microelectronics Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2023-12-31 0.01% CN¥3.61 Million
≈ $528.37K
CN¥34.88 Billion
≈ $5.10 Billion
-0.37pp
2022-12-31 0.38% CN¥136.99 Million
≈ $20.05 Million
CN¥35.63 Billion
≈ $5.21 Billion
-4.94pp
2020-12-31 5.32% CN¥1.13 Billion
≈ $165.41 Million
CN¥21.23 Billion
≈ $3.11 Billion
+4.89pp
2016-12-31 0.44% CN¥48.76 Million
≈ $7.14 Million
CN¥11.20 Billion
≈ $1.64 Billion
-8.32pp
2015-12-31 8.75% CN¥570.00 Million
≈ $83.41 Million
CN¥6.51 Billion
≈ $952.90 Million
+8.74pp
2014-12-31 0.01% CN¥537.90K
≈ $78.71K
CN¥3.96 Billion
≈ $578.75 Million
--
pp = percentage points

About TongFu Microelectronics Co Ltd

SHE:002156 China Semiconductor Equipment & Materials
Market Cap
$15.16 Billion
CN¥103.61 Billion CNY
Market Cap Rank
#1632 Global
#169 in China
Share Price
CN¥68.27
Change (1 day)
+1.56%
52-Week Range
CN¥24.44 - CN¥75.39
All Time High
CN¥75.39
About

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more