TongFu Microelectronics Co Ltd - Asset Resilience Ratio

Latest as of September 2024: 0.01%

TongFu Microelectronics Co Ltd (002156) has an Asset Resilience Ratio of 0.01% as of September 2024. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See working capital to net assets of TongFu Microelectronics Co Ltd to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

CN¥3.82 Million
≈ $558.80K USD Cash + Short-term Investments

Total Assets

CN¥38.07 Billion
≈ $5.57 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2014–2023)

This chart shows how TongFu Microelectronics Co Ltd's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see 002156 total assets.

Liquid Assets Composition Over Time

This chart breaks down TongFu Microelectronics Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Explore 002156 strategic capital deployment ratio to see how much of total assets are deployed in long-term investments.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥3.82 Million 0.01%
Total Liquid Assets CN¥3.82 Million 0.01%

Asset Resilience Insights

  • Limited Liquidity: TongFu Microelectronics Co Ltd maintains only 0.01% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

TongFu Microelectronics Co Ltd Industry Peers by Asset Resilience Ratio

Compare TongFu Microelectronics Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Ferrotec (Anhui) Technology Development Co. Ltd. A
SHE:301297
Semiconductor Equipment & Materials 7.65%
Shanghai Originaldow Advanced
SHG:603991
Semiconductor Equipment & Materials 4.04%
SDI Corp
TW:2351
Semiconductor Equipment & Materials 0.62%
LandMark Optoelectronics
TWO:3081
Semiconductor Equipment & Materials 18.04%
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401
Semiconductor Equipment & Materials 4.11%
Bluglass Ltd
AU:BLG
Semiconductor Equipment & Materials 23.98%
Spectra7 Microsystems Inc
V:SEV
Semiconductor Equipment & Materials 29.72%
NAURA Technology Group Co Ltd
SHE:002371
Semiconductor Equipment & Materials 0.04%

Annual Asset Resilience Ratio for TongFu Microelectronics Co Ltd (2014–2023)

The table below shows the annual Asset Resilience Ratio data for TongFu Microelectronics Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2023-12-31 0.01% CN¥3.61 Million
≈ $528.37K
CN¥34.88 Billion
≈ $5.10 Billion
-0.37pp
2022-12-31 0.38% CN¥136.99 Million
≈ $20.05 Million
CN¥35.63 Billion
≈ $5.21 Billion
-4.94pp
2020-12-31 5.32% CN¥1.13 Billion
≈ $165.41 Million
CN¥21.23 Billion
≈ $3.11 Billion
+4.89pp
2016-12-31 0.44% CN¥48.76 Million
≈ $7.14 Million
CN¥11.20 Billion
≈ $1.64 Billion
-8.32pp
2015-12-31 8.75% CN¥570.00 Million
≈ $83.41 Million
CN¥6.51 Billion
≈ $952.90 Million
+8.74pp
2014-12-31 0.01% CN¥537.90K
≈ $78.71K
CN¥3.96 Billion
≈ $578.75 Million
--
pp = percentage points

About TongFu Microelectronics Co Ltd

SHE:002156 China Semiconductor Equipment & Materials
Market Cap
$13.63 Billion
CN¥93.15 Billion CNY
Market Cap Rank
#1763 Global
#168 in China
Share Price
CN¥61.38
Change (1 day)
+5.26%
52-Week Range
CN¥34.29 - CN¥78.71
All Time High
CN¥78.71
About

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more