TongFu Microelectronics Co Ltd Asset Resilience Ratio

Latest as of September 2024: 0.01%

TongFu Microelectronics Co Ltd asset resilience ratio. TongFu Microelectronics Co Ltd (002156) has an Asset Resilience Ratio of 0.01% as of September 2024. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See 002156 cash and liquid assets coverage to measure how many days the company can operate on defensive assets alone.

Liquid Assets

CN¥3.82 Million
≈ $558.80K USD Cash + Short-term Investments

Total Assets

CN¥38.07 Billion
≈ $5.57 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio of TongFu Microelectronics Co Ltd (2014–2023)

Asset resilience ratio of TongFu Microelectronics Co Ltd from 2014 to 2023. This chart shows how TongFu Microelectronics Co Ltd's Asset Resilience Ratio has changed over time. Read total liabilities of TongFu Microelectronics Co Ltd for a breakdown of total debt and financial obligations.

Liquid Assets Composition Over Time

This chart breaks down TongFu Microelectronics Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see TongFu Microelectronics Co Ltd assets under control.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥3.82 Million 0.01%
Total Liquid Assets CN¥3.82 Million 0.01%

Asset Resilience Insights

  • Limited Liquidity: TongFu Microelectronics Co Ltd maintains only 0.01% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

TongFu Microelectronics Co Ltd Industry Peers by Asset Resilience Ratio

Compare TongFu Microelectronics Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
ASM International NV
AS:ASM
Semiconductor Equipment & Materials -0.06%
Anji Microelectronics Tech Co Ltd
SHG:688019
Semiconductor Equipment & Materials 5.05%
StarPower Semiconductor Ltd
SHG:603290
Semiconductor Equipment & Materials 4.48%
Jiangyin Jianghua Microelectronics Materials Co Ltd
SHG:603078
Semiconductor Equipment & Materials 13.71%
JiLin Sino-Microelectronics Co Ltd
SHG:600360
Semiconductor Equipment & Materials 8.45%
Keystone Microtech Corp
TWO:6683
Semiconductor Equipment & Materials 0.17%
Adaptive Plasma Technology Corp
KQ:089970
Semiconductor Equipment & Materials 1.49%
Bluglass Ltd
AU:BLG
Semiconductor Equipment & Materials 23.98%

TongFu Microelectronics Co Ltd Asset Resilience Ratio by Year (2014–2023)

TongFu Microelectronics Co Ltd asset resilience ratio by year from 2014 to 2023. The table below shows the annual Asset Resilience Ratio data for TongFu Microelectronics Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2023-12-31 0.01% CN¥3.61 Million
≈ $528.37K
CN¥34.88 Billion
≈ $5.10 Billion
-0.37pp
2022-12-31 0.38% CN¥136.99 Million
≈ $20.05 Million
CN¥35.63 Billion
≈ $5.21 Billion
-4.94pp
2020-12-31 5.32% CN¥1.13 Billion
≈ $165.41 Million
CN¥21.23 Billion
≈ $3.11 Billion
+4.89pp
2016-12-31 0.44% CN¥48.76 Million
≈ $7.14 Million
CN¥11.20 Billion
≈ $1.64 Billion
-8.32pp
2015-12-31 8.75% CN¥570.00 Million
≈ $83.41 Million
CN¥6.51 Billion
≈ $952.90 Million
+8.74pp
2014-12-31 0.01% CN¥537.90K
≈ $78.71K
CN¥3.96 Billion
≈ $578.75 Million
--
pp = percentage points

About TongFu Microelectronics Co Ltd

SHE:002156 China Semiconductor Equipment & Materials
Market Cap
$10.05 Billion
CN¥68.67 Billion CNY
Market Cap Rank
#2165 Global
#212 in China
Share Price
CN¥45.25
Change (1 day)
+6.90%
52-Week Range
CN¥35.25 - CN¥78.71
All Time High
CN¥78.71
About

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more