Tianjin Printronics Circuit Corp - Asset Resilience Ratio

Latest as of June 2022: 4.04%

Tianjin Printronics Circuit Corp (002134) has an Asset Resilience Ratio of 4.04% as of June 2022. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read Tianjin Printronics Circuit Corp (002134) total liabilities for a breakdown of total debt and financial obligations.

Liquid Assets

CN¥30.00 Million
≈ $4.39 Million USD Cash + Short-term Investments

Total Assets

CN¥742.95 Million
≈ $108.72 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2013–2021)

This chart shows how Tianjin Printronics Circuit Corp's Asset Resilience Ratio has changed over time. See Tianjin Printronics Circuit Corp net assets for net asset value and shareholders' equity analysis.

Liquid Assets Composition Over Time

This chart breaks down Tianjin Printronics Circuit Corp's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Tianjin Printronics Circuit Corp market capitalisation.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥30.00 Million 4.04%
Total Liquid Assets CN¥30.00 Million 4.04%

Asset Resilience Insights

  • Limited Liquidity: Tianjin Printronics Circuit Corp maintains only 4.04% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Tianjin Printronics Circuit Corp Industry Peers by Asset Resilience Ratio

Compare Tianjin Printronics Circuit Corp's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
NVIDIA Corporation
NASDAQ:NVDA
Semiconductors 25.12%
Broadcom Inc
NASDAQ:AVGO
Semiconductors 0.00%
MediaTek Inc
TW:2454
Semiconductors 1.67%
Shannon Semiconductor Technology Co Ltd
SHE:300475
Semiconductors 1.74%
Sitime Corporation
NASDAQ:SITM
Semiconductors 61.15%
Shanghai V-Test Semiconductor Tech Co. Ltd. A
SHG:688372
Semiconductors 5.23%
Airoha Technology Corp
TW:6526
Semiconductors 0.08%
Melexis NV
BR:MELE
Semiconductors 0.04%

Annual Asset Resilience Ratio for Tianjin Printronics Circuit Corp (2013–2021)

The table below shows the annual Asset Resilience Ratio data for Tianjin Printronics Circuit Corp.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2021-12-31 0.00% CN¥31.98K
≈ $4.68K
CN¥787.91 Million
≈ $115.30 Million
--
2020-12-31 0.00% CN¥0.00
≈ $0.00
CN¥595.06 Million
≈ $87.08 Million
--
2019-12-31 -0.15% CN¥-893.40K
≈ $-130.73K
CN¥581.68 Million
≈ $85.12 Million
-1.71pp
2018-12-31 1.55% CN¥9.10 Million
≈ $1.33 Million
CN¥585.44 Million
≈ $85.67 Million
--
2017-12-31 0.00% CN¥0.00
≈ $0.00
CN¥634.25 Million
≈ $92.81 Million
--
2016-12-31 -0.01% CN¥-70.41K
≈ $-10.30K
CN¥618.88 Million
≈ $90.56 Million
0.00pp
2015-12-31 -0.01% CN¥-72.44K
≈ $-10.60K
CN¥718.13 Million
≈ $105.09 Million
0.00pp
2014-12-31 -0.01% CN¥-74.46K
≈ $-10.90K
CN¥815.83 Million
≈ $119.38 Million
+0.00pp
2013-12-31 -0.01% CN¥-76.49K
≈ $-11.19K
CN¥804.67 Million
≈ $117.75 Million
--
pp = percentage points

About Tianjin Printronics Circuit Corp

SHE:002134 China Semiconductors
Market Cap
$913.46 Million
CN¥6.24 Billion CNY
Market Cap Rank
#9506 Global
#2634 in China
Share Price
CN¥25.32
Change (1 day)
+0.80%
52-Week Range
CN¥18.00 - CN¥28.17
All Time High
CN¥28.17
About

Tianjin Printronics Circuit Corporation engaged in the research and development, production and sales of printed circuit boards (PCBs) in the People's Republic of China and internationally. The company offers step board, immersion silver surface, immersion tin surface, multi-layer PCB with different solder mask colors, multi-layer board with black solder mask, 1 step HDI, rigid flex board, 1-side… Read more