Shenzhen Fastprint Circuit Tech Co Ltd - Asset Resilience Ratio
Shenzhen Fastprint Circuit Tech Co Ltd (002436) has an Asset Resilience Ratio of 2.10% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check Shenzhen Fastprint Circuit Tech Co Ltd strategic asset allocation index to assess the company's strategic physical and investment asset allocation.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2018–2025)
This chart shows how Shenzhen Fastprint Circuit Tech Co Ltd's Asset Resilience Ratio has changed over time. See Shenzhen Fastprint Circuit Tech Co Ltd net asset quality index to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Shenzhen Fastprint Circuit Tech Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see how much is Shenzhen Fastprint Circuit Tech Co Ltd worth.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥329.41 Million | 2.1% |
| Total Liquid Assets | CN¥329.41 Million | 2.10% |
Asset Resilience Insights
- Limited Liquidity: Shenzhen Fastprint Circuit Tech Co Ltd maintains only 2.10% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Shenzhen Fastprint Circuit Tech Co Ltd Industry Peers by Asset Resilience Ratio
Compare Shenzhen Fastprint Circuit Tech Co Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Lingyi iTech Guangdong Co
SHE:002600 |
Electronic Components | 1.79% |
|
Olympic Circuit Technology Co Ltd
SHG:603920 |
Electronic Components | 23.19% |
|
Shanghai Wanye Enterprises Co Ltd
SHG:600641 |
Electronic Components | 0.15% |
|
XiaMen HongXin Electron-tech Co Ltd
SHE:300657 |
Electronic Components | 0.35% |
|
FangDa Carbon New Material Co Ltd
SHG:600516 |
Electronic Components | 4.27% |
|
Shanghai Yct Electronics Group Co.Ltd
SHE:301099 |
Electronic Components | 1.10% |
|
Shenzhen Qingyi Photomask Ltd
SHG:688138 |
Electronic Components | 0.33% |
|
Fujian Furi Electronics Co Ltd
SHG:600203 |
Electronic Components | 0.04% |
Annual Asset Resilience Ratio for Shenzhen Fastprint Circuit Tech Co Ltd (2018–2025)
The table below shows the annual Asset Resilience Ratio data for Shenzhen Fastprint Circuit Tech Co Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 2.02% | CN¥304.81 Million ≈ $44.60 Million |
CN¥15.08 Billion ≈ $2.21 Billion |
+0.07pp |
| 2024-12-31 | 1.95% | CN¥266.74 Million ≈ $39.03 Million |
CN¥13.67 Billion ≈ $2.00 Billion |
+0.54pp |
| 2023-12-31 | 1.41% | CN¥210.20 Million ≈ $30.76 Million |
CN¥14.94 Billion ≈ $2.19 Billion |
-0.34pp |
| 2022-12-31 | 1.75% | CN¥208.36 Million ≈ $30.49 Million |
CN¥11.90 Billion ≈ $1.74 Billion |
+0.39pp |
| 2021-12-31 | 1.36% | CN¥113.20 Million ≈ $16.56 Million |
CN¥8.30 Billion ≈ $1.21 Billion |
+0.69pp |
| 2020-12-31 | 0.67% | CN¥41.78 Million ≈ $6.11 Million |
CN¥6.19 Billion ≈ $906.26 Million |
-0.12pp |
| 2019-12-31 | 0.80% | CN¥41.52 Million ≈ $6.08 Million |
CN¥5.20 Billion ≈ $761.07 Million |
+4.20pp |
| 2018-12-31 | -3.40% | CN¥-161.70 Million ≈ $-23.66 Million |
CN¥4.76 Billion ≈ $696.38 Million |
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About Shenzhen Fastprint Circuit Tech Co Ltd
Shenzhen Fastprint Circuit Tech Co.,Ltd., together with its subsidiaries, designs, produces, purchases, and sells printed circuit boards in China and internationally. The company offers PCB, including HDI, high-frequency, and high-speed products; IC substrate, such as CSP, FC0CSP, SiP, FMC, and PBGA; FPC comprising rigid-flex and flexible board; and semiconductor test board which includes load bo… Read more