Shenzhen Fastprint Circuit Tech Co Ltd - Asset Resilience Ratio

Latest as of September 2025: 1.71%

Shenzhen Fastprint Circuit Tech Co Ltd (002436) has an Asset Resilience Ratio of 1.71% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read how much debt does Shenzhen Fastprint Circuit Tech Co Ltd carry for a breakdown of total debt and financial obligations.

Liquid Assets

CN¥255.65 Million
≈ $37.41 Million USD Cash + Short-term Investments

Total Assets

CN¥14.98 Billion
≈ $2.19 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2018–2024)

This chart shows how Shenzhen Fastprint Circuit Tech Co Ltd's Asset Resilience Ratio has changed over time. See 002436 net asset value for net asset value and shareholders' equity analysis.

Liquid Assets Composition Over Time

This chart breaks down Shenzhen Fastprint Circuit Tech Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see how much is Shenzhen Fastprint Circuit Tech Co Ltd worth.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥255.65 Million 1.71%
Total Liquid Assets CN¥255.65 Million 1.71%

Asset Resilience Insights

  • Limited Liquidity: Shenzhen Fastprint Circuit Tech Co Ltd maintains only 1.71% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Shenzhen Fastprint Circuit Tech Co Ltd Industry Peers by Asset Resilience Ratio

Compare Shenzhen Fastprint Circuit Tech Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Gold Circuit Electronics Ltd
TW:2368
Electronic Components 0.59%
Lingyi iTech Guangdong Co
SHE:002600
Electronic Components 2.76%
Shenzhen Sunway Communication
SHE:300136
Electronic Components 0.03%
Taiwan Union Technology
TWO:6274
Electronic Components 13.68%
Joulwatt Technology Co. Ltd. A
SHG:688141
Electronic Components 1.92%
TDG Holding Co Ltd
SHG:600330
Electronic Components 1.67%
Goldenmax International Technology Ltd
SHE:002636
Electronic Components 3.58%
Xiamen Faratronic Co Ltd
SHG:600563
Electronic Components 21.92%

Annual Asset Resilience Ratio for Shenzhen Fastprint Circuit Tech Co Ltd (2018–2024)

The table below shows the annual Asset Resilience Ratio data for Shenzhen Fastprint Circuit Tech Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 1.95% CN¥266.74 Million
≈ $39.03 Million
CN¥13.67 Billion
≈ $2.00 Billion
+0.19pp
2023-12-31 1.77% CN¥263.83 Million
≈ $38.61 Million
CN¥14.94 Billion
≈ $2.19 Billion
+0.01pp
2022-12-31 1.75% CN¥208.36 Million
≈ $30.49 Million
CN¥11.89 Billion
≈ $1.74 Billion
+0.39pp
2021-12-31 1.36% CN¥113.20 Million
≈ $16.56 Million
CN¥8.30 Billion
≈ $1.21 Billion
+0.69pp
2020-12-31 0.68% CN¥41.78 Million
≈ $6.11 Million
CN¥6.16 Billion
≈ $901.96 Million
-0.12pp
2019-12-31 0.80% CN¥41.52 Million
≈ $6.08 Million
CN¥5.20 Billion
≈ $761.07 Million
+4.22pp
2018-12-31 -3.42% CN¥-161.70 Million
≈ $-23.66 Million
CN¥4.73 Billion
≈ $692.16 Million
--
pp = percentage points

About Shenzhen Fastprint Circuit Tech Co Ltd

SHE:002436 China Electronic Components
Market Cap
$6.89 Billion
CN¥47.10 Billion CNY
Market Cap Rank
#2891 Global
#383 in China
Share Price
CN¥27.71
Change (1 day)
+0.91%
52-Week Range
CN¥11.26 - CN¥29.23
All Time High
CN¥29.23
About

Shenzhen Fastprint Circuit Tech Co.,Ltd., together with its subsidiaries, designs, produces, and sells printed circuit boards in China and internationally. The company offers double-sided, multi-layer, HDI, high frequency, and high-speed PCB products; IC packaging substrates, such as CSP, FC-CSP, SiP, FMC, and PBGA; rigid-flex and flexible boards FPC products; and semiconductor test boards, inclu… Read more