Sigurd Microelectronics Corporation, together with its subsidiaries, engages in the design, processing, testing, burn-in treatment, manufacture, and trading of integrated circuits (ICs) in Taiwan, Singapore, America, China, and internationally. It operates through Packaging and Testing, and Trading segments. The company provides advance packages; and test services, including wafer sort chip probing, final test, and test engineering services. It also offers die process services, such as wafer grinding, laser cutting and printing, sawing, tape and reel, direct shipping, wafer back cover lamination, wafer back laser printing, 100% automatic optical inspection after wafer cutting, roll-to-roll sorting, reconstruction, 6-sided die inspection, and other process integrations; backend services, including lead scan, inspection, baking, marking, packing, and drop ship; and other services, such as wafer bumping and assembly; and system level test, burn in services, and laser repair. In addition, the company is involved in the production and sale of recorders and their accessories, copiers, chips testers, televisions, medical equipment and electronic components; integrated circuit development and pollution testing; investments; and electronic information provision services. Its products are used in various applications comprising the metaverse, high-performance computing, wireless communication, mobile devices, automotive, medical, satellite, computers, IoT, artificial intelligence, consumer electronics, and multimedia products. The company serves semiconductor design companies, integrated device manufacturers, and wafer foundries. Sigurd Microelectronics Corporation was incorporated in 1988 and is based in Hsinchu City, Taiwan.