Nepes Corporation (033640) - Cash Flow Conversion Efficiency

Latest as of September 2025: 0.041x

Based on the latest financial reports, Nepes Corporation (033640) has a cash flow conversion efficiency ratio of 0.041x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩10.07 Billion ≈ $6.82 Million USD) by net assets (₩245.75 Billion ≈ $166.54 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.

Nepes Corporation - Cash Flow Conversion Efficiency Trend (2005–2024)

This chart illustrates how Nepes Corporation's cash flow conversion efficiency has evolved over time, based on yearly financial data. Read debt load of Nepes Corporation for a breakdown of total debt and financial obligations.

Nepes Corporation Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Nepes Corporation ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Yunnan Yuntou Ecology and Environment Technology Co Ltd
SHE:002200
-0.375x
Ce Link Ltd
SHE:300787
0.017x
Lavvi Empreendimentos Imobiliários S.A
SA:LAVV3
-0.003x
TFE Co. Ltd.
KQ:425420
0.015x
SVI Public Company Limited
BK:SVI
0.060x
Coca-Cola Embonor S.A
SN:EMBONOR-B
0.050x
Sjóvá-Almennar tryggingar hf
IC:SJOVA
0.045x
Sinopec Oilfield Service Corporation
F:YIZH
0.101x

Annual Cash Flow Conversion Efficiency for Nepes Corporation (2005–2024)

The table below shows the annual cash flow conversion efficiency of Nepes Corporation from 2005 to 2024. For the full company profile with market capitalisation and key ratios, see how much is Nepes Corporation worth.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2024-12-31 ₩110.15 Billion
≈ $74.65 Million
₩109.13 Billion
≈ $73.96 Million
0.991x +83.43%
2023-12-31 ₩148.04 Billion
≈ $100.32 Million
₩79.96 Billion
≈ $54.19 Million
0.540x +37.61%
2022-12-31 ₩248.63 Billion
≈ $168.49 Million
₩97.59 Billion
≈ $66.13 Million
0.393x -8.58%
2021-12-31 ₩176.80 Billion
≈ $119.82 Million
₩75.91 Billion
≈ $51.44 Million
0.429x +92.84%
2020-12-31 ₩208.07 Billion
≈ $141.01 Million
₩46.32 Billion
≈ $31.39 Million
0.223x -48.25%
2019-12-31 ₩209.02 Billion
≈ $141.65 Million
₩89.92 Billion
≈ $60.94 Million
0.430x +66.61%
2018-12-31 ₩161.48 Billion
≈ $109.43 Million
₩41.70 Billion
≈ $28.26 Million
0.258x -43.25%
2017-12-31 ₩131.22 Billion
≈ $88.92 Million
₩59.71 Billion
≈ $40.46 Million
0.455x +34.26%
2016-12-31 ₩130.83 Billion
≈ $88.66 Million
₩44.34 Billion
≈ $30.05 Million
0.339x +2.45%
2015-12-31 ₩111.55 Billion
≈ $75.59 Million
₩36.90 Billion
≈ $25.01 Million
0.331x +38.01%
2014-12-31 ₩149.44 Billion
≈ $101.27 Million
₩35.82 Billion
≈ $24.28 Million
0.240x +178.65%
2013-12-31 ₩116.59 Billion
≈ $79.01 Million
₩10.03 Billion
≈ $6.80 Million
0.086x -75.29%
2012-12-31 ₩156.83 Billion
≈ $106.28 Million
₩54.60 Billion
≈ $37.00 Million
0.348x +1061.08%
2011-12-31 ₩143.41 Billion
≈ $97.18 Million
₩4.30 Billion
≈ $2.91 Million
0.030x -91.08%
2010-12-31 ₩165.07 Billion
≈ $111.86 Million
₩55.50 Billion
≈ $37.61 Million
0.336x +57.95%
2009-12-31 ₩144.47 Billion
≈ $97.90 Million
₩30.75 Billion
≈ $20.84 Million
0.213x -9.05%
2008-12-31 ₩120.68 Billion
≈ $81.78 Million
₩28.24 Billion
≈ $19.14 Million
0.234x +21.26%
2007-12-31 ₩122.60 Billion
≈ $83.08 Million
₩23.66 Billion
≈ $16.04 Million
0.193x +120.38%
2006-12-31 ₩122.16 Billion
≈ $82.79 Million
₩10.70 Billion
≈ $7.25 Million
0.088x -70.76%
2005-12-31 ₩103.04 Billion
≈ $69.83 Million
₩30.87 Billion
≈ $20.92 Million
0.300x --

About Nepes Corporation

KQ:033640 Korea Semiconductor Equipment & Materials
Market Cap
$500.06 Million
₩737.89 Billion KRW
Market Cap Rank
#12534 Global
#403 in Korea
Share Price
₩32000.00
Change (1 day)
+0.47%
52-Week Range
₩6830.00 - ₩34650.00
All Time High
₩47150.00
About

Nepes Corporation engages in the semiconductor, chemical, and energy businesses in South Korea. It offers turnkey solutions for flip chip bumping, wafer-level packaging, fan-out wafer level packaging, panel level packaging, and fan-out wafer level system in packaging solutions, as well as semiconductor back-end processing and electric tests. The company also develops and supplies artificial intel… Read more