BSL Corp Bhd (7221) - Total Liabilities
Based on the latest financial reports, BSL Corp Bhd (7221) has total liabilities worth RM41.28 Million MYR (≈ $10.37 Million USD) as of August 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore how efficiently does BSL Corp Bhd generate cash to assess how effectively this company generates cash.
BSL Corp Bhd - Total Liabilities Trend (2012–2025)
This chart illustrates how BSL Corp Bhd's total liabilities have evolved over time, based on quarterly financial data. Check 7221 asset resilience ratio to evaluate the company's liquid asset resilience ratio.
BSL Corp Bhd Competitors by Total Liabilities
The table below lists competitors of BSL Corp Bhd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Cyabra, Inc. Common Stock
NASDAQ:CYAB
|
USA | $26.23 Million |
|
FUTURE METALS NL
F:3R10
|
Germany | €381.80K |
|
Lupaka Gold Corp.
V:LPK
|
Canada | CA$408.58K |
|
Sanginita Chemicals Limited
NSE:SANGINITA
|
India | Rs301.74 Million |
|
Zwahlen et Mayr SA
SW:ZWM
|
Switzerland | CHF20.55 Million |
|
Baijiayun Group Ltd
NASDAQ:RTC
|
USA | $47.11 Million |
|
Lohilo Foods AB
ST:LOHILO
|
Sweden | Skr57.59 Million |
|
Asuransi Bina Dana Arta Tbk
JK:ABDA
|
Indonesia | Rp1.17 Trillion |
Liability Composition Analysis (2012–2025)
This chart breaks down BSL Corp Bhd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 7221 stock market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 4.23 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.21 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.18 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how BSL Corp Bhd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for BSL Corp Bhd (2012–2025)
The table below shows the annual total liabilities of BSL Corp Bhd from 2012 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-08-31 | RM43.63 Million ≈ $10.95 Million |
-16.37% |
| 2024-08-31 | RM52.17 Million ≈ $13.10 Million |
-11.25% |
| 2023-08-31 | RM58.78 Million ≈ $14.76 Million |
-13.24% |
| 2022-08-31 | RM67.76 Million ≈ $17.01 Million |
+32.28% |
| 2021-08-31 | RM51.22 Million ≈ $12.86 Million |
+14.12% |
| 2020-08-31 | RM44.88 Million ≈ $11.27 Million |
-2.72% |
| 2019-08-31 | RM46.14 Million ≈ $11.58 Million |
-11.44% |
| 2018-08-31 | RM52.10 Million ≈ $13.08 Million |
-4.17% |
| 2017-08-31 | RM54.37 Million ≈ $13.65 Million |
+45.34% |
| 2016-08-31 | RM37.41 Million ≈ $9.39 Million |
-6.48% |
| 2015-08-31 | RM40.00 Million ≈ $10.04 Million |
+8.11% |
| 2014-08-31 | RM37.00 Million ≈ $9.29 Million |
-9.76% |
| 2013-08-31 | RM41.00 Million ≈ $10.29 Million |
-8.89% |
| 2012-08-31 | RM45.00 Million ≈ $11.30 Million |
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About BSL Corp Bhd
BSL Corporation Berhad, an investment holding company, engages in the stamping and manufacturing of precision metal parts, and fabrication of tools and dies in Malaysia. The company operates through Investment Holding; Precision Stamping and Tooling; Printed Circuit Board and Module Assembly; and Others segments. It is involved in fabrication and forging of base metal components. The company also… Read more