DAP Corporation (066900) - Total Liabilities
Based on the latest financial reports, DAP Corporation (066900) has total liabilities worth ₩132.57 Billion KRW (≈ $89.84 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore DAP Corporation annual equity growth to track the company's year-over-year net asset growth rate.
DAP Corporation - Total Liabilities Trend (2014–2025)
This chart illustrates how DAP Corporation's total liabilities have evolved over time, based on quarterly financial data. See 066900 free cash flow to operating cash ratio to measure how efficiently the company converts operating cash flow to free cash.
DAP Corporation Competitors by Total Liabilities
The table below lists competitors of DAP Corporation ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Nara Mold & Die Co. Ltd
KQ:051490
|
Korea | ₩160.69 Billion |
|
ODTech Co. Ltd
KQ:080520
|
Korea | ₩7.53 Billion |
|
Caldwell Partners International Inc
TO:CWL
|
Canada | CA$36.43 Million |
|
Finbond Group Ltd
JSE:FGL
|
South Africa | ZAC3.93 Billion |
|
Triniti Dinamik PT Tbk
JK:TRUE
|
Indonesia | Rp536.54 Billion |
|
Castec Korea Co Ltd
KQ:071850
|
Korea | ₩145.93 Billion |
|
NETCLASS TECHNOLOGY INC Class A Ordinary Shares
NASDAQ:NTCL
|
USA | $7.83 Million |
Liability Composition Analysis (2014–2025)
This chart breaks down DAP Corporation's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of DAP Corporation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.04 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.29 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.56 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how DAP Corporation's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for DAP Corporation (2014–2025)
The table below shows the annual total liabilities of DAP Corporation from 2014 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | ₩576.20 Billion ≈ $390.48 Million |
+93.15% |
| 2024-12-31 | ₩298.32 Billion ≈ $202.17 Million |
+28.73% |
| 2023-12-31 | ₩231.73 Billion ≈ $157.04 Million |
+69.26% |
| 2022-12-31 | ₩136.91 Billion ≈ $92.78 Million |
+24.07% |
| 2021-12-31 | ₩110.35 Billion ≈ $74.78 Million |
-7.07% |
| 2020-12-31 | ₩118.74 Billion ≈ $80.47 Million |
-5.14% |
| 2019-12-31 | ₩125.18 Billion ≈ $84.83 Million |
+7.38% |
| 2018-12-31 | ₩116.58 Billion ≈ $79.00 Million |
-13.43% |
| 2017-12-31 | ₩134.66 Billion ≈ $91.26 Million |
-9.88% |
| 2016-12-31 | ₩149.42 Billion ≈ $101.26 Million |
-9.01% |
| 2015-12-31 | ₩164.22 Billion ≈ $111.29 Million |
-19.67% |
| 2014-12-31 | ₩204.44 Billion ≈ $138.54 Million |
-- |
About DAP Corporation
DAP Corporation provides printed circuit boards South Korea and internationally. Its products are used in mobile phones, tablet PCs, wearables, and automobiles. The company also provides construction equipment, such as CNC drill, laser drill, router, oxide, lay-up, hot press, desmear, chemical plating, electrolytic plating, exposure, etching, AOI, photo solder resist, electroness nikel immersion … Read more