DAP Corporation (066900) - Total Liabilities

Latest as of June 2026: ₩135.71 Billion KRW ≈ $91.97 Million USD

Based on the latest financial reports, DAP Corporation (066900) has total liabilities worth ₩135.71 Billion KRW (≈ $91.97 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore DAP Corporation (066900) investment intensity to see how much of total assets are deployed in long-term investments.

DAP Corporation - Total Liabilities Trend (2014–2025)

This chart illustrates how DAP Corporation's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see DAP Corporation (066900) total assets.

DAP Corporation Competitors by Total Liabilities

The table below lists competitors of DAP Corporation ranked by their total liabilities.

Company Country Total Liabilities
Signet Industries Limited
NSE:SIGIND
India Rs7.13 Billion
Blossom M&C Co. Ltd
KQ:263920
Korea ₩19.82 Billion
APPIA RARE EARTH+U O.N.
F:A0I0
Germany €3.85 Million
Elevation Oncology Inc
NASDAQ:ELEV
USA $35.49 Million
Point Mobile Co. Ltd
KQ:318020
Korea ₩43.69 Billion
TMK Energy Ltd
AU:TMK
Australia AU$532.78K
Hermana Holding ASA
OL:HERMA
Norway Nkr700.00K
Cobalt Blue Holdings Limited
F:COH
Germany €6.76 Million

Liability Composition Analysis (2014–2025)

This chart breaks down DAP Corporation's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See DAP Corporation balance sheet independence to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.93 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.43 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.59 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how DAP Corporation's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for DAP Corporation (2014–2025)

The table below shows the annual total liabilities of DAP Corporation from 2014 to 2025.

Year Total Liabilities Change
2025-12-31 ₩576.20 Billion
≈ $390.48 Million
+93.15%
2024-12-31 ₩298.32 Billion
≈ $202.17 Million
+28.73%
2023-12-31 ₩231.73 Billion
≈ $157.04 Million
+69.26%
2022-12-31 ₩136.91 Billion
≈ $92.78 Million
+24.07%
2021-12-31 ₩110.35 Billion
≈ $74.78 Million
-7.07%
2020-12-31 ₩118.74 Billion
≈ $80.47 Million
-5.14%
2019-12-31 ₩125.18 Billion
≈ $84.83 Million
+7.38%
2018-12-31 ₩116.58 Billion
≈ $79.00 Million
-13.43%
2017-12-31 ₩134.66 Billion
≈ $91.26 Million
-9.88%
2016-12-31 ₩149.42 Billion
≈ $101.26 Million
-9.01%
2015-12-31 ₩164.22 Billion
≈ $111.29 Million
-19.67%
2014-12-31 ₩204.44 Billion
≈ $138.54 Million
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About DAP Corporation

KQ:066900 Korea Semiconductors & Semiconductor Equipment
Market Cap
$21.63 Million
₩31.91 Billion KRW
Market Cap Rank
#24941 Global
#1813 in Korea
Share Price
₩1725.00
Change (1 day)
-1.60%
52-Week Range
₩1358.00 - ₩2245.00
All Time High
₩5440.00
About

DAP Corporation provides printed circuit boards South Korea and internationally. Its products are used in mobile phones, tablet PCs, wearables, and automobiles. The company also provides construction equipment, such as CNC drill, laser drill, router, oxide, lay-up, hot press, desmear, chemical plating, electrolytic plating, exposure, etching, AOI, photo solder resist, electroness nikel immersion … Read more