Eugene Technology Co.Ltd (084370) - Total Liabilities
Based on the latest financial reports, Eugene Technology Co.Ltd (084370) has total liabilities worth ₩89.22 Billion KRW (≈ $60.46 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 084370 cash flow conversion to assess how effectively this company generates cash.
Eugene Technology Co.Ltd - Total Liabilities Trend (2011–2025)
This chart illustrates how Eugene Technology Co.Ltd's total liabilities have evolved over time, based on quarterly financial data. Check 084370 asset resilience ratio to evaluate the company's liquid asset resilience ratio.
Eugene Technology Co.Ltd Competitors by Total Liabilities
The table below lists competitors of Eugene Technology Co.Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Dongfeng Automobile Co Ltd
SHG:600006
|
China | CN¥7.67 Billion |
|
SL Corp
KO:005850
|
Korea | ₩1.39 Trillion |
|
Geo Group Inc
NYSE:GEO
|
USA | $2.34 Billion |
|
El Al Israel Airlines Ltd
TA:ELAL
|
Israel | ILA3.81 Billion |
|
Carborundum Universal Limited
NSE:CARBORUNIV
|
India | Rs11.55 Billion |
|
THE BK N.T.BUTTERF.+S.NEW
F:4IK
|
Germany | €12.95 Billion |
|
Investis Holding SA
SW:IREN
|
Switzerland | CHF839.14 Million |
Liability Composition Analysis (2011–2025)
This chart breaks down Eugene Technology Co.Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 084370 market cap overview.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 6.39 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.19 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.15 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Eugene Technology Co.Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Eugene Technology Co.Ltd (2011–2025)
The table below shows the annual total liabilities of Eugene Technology Co.Ltd from 2011 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | ₩89.22 Billion ≈ $60.46 Million |
-14.01% |
| 2024-12-31 | ₩103.76 Billion ≈ $70.31 Million |
+51.44% |
| 2023-12-31 | ₩68.51 Billion ≈ $46.43 Million |
-37.57% |
| 2022-12-31 | ₩109.75 Billion ≈ $74.38 Million |
+22.82% |
| 2021-12-31 | ₩89.36 Billion ≈ $60.56 Million |
+51.37% |
| 2020-12-31 | ₩59.03 Billion ≈ $40.00 Million |
+44.69% |
| 2019-12-31 | ₩40.80 Billion ≈ $27.65 Million |
+3.52% |
| 2018-12-31 | ₩39.41 Billion ≈ $26.71 Million |
+10.01% |
| 2017-12-31 | ₩35.82 Billion ≈ $24.28 Million |
+24.52% |
| 2016-12-31 | ₩28.77 Billion ≈ $19.50 Million |
+51.85% |
| 2015-12-31 | ₩18.95 Billion ≈ $12.84 Million |
+6.58% |
| 2014-12-31 | ₩17.78 Billion ≈ $12.05 Million |
-51.00% |
| 2013-12-31 | ₩36.28 Billion ≈ $24.59 Million |
-8.04% |
| 2012-12-31 | ₩39.45 Billion ≈ $26.74 Million |
-32.93% |
| 2011-12-31 | ₩58.82 Billion ≈ $39.86 Million |
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About Eugene Technology Co.Ltd
Eugene Technology Co.,Ltd. manufactures and sells semiconductor manufacturing equipment in South Korea. It offers single thermal LPCVD and plasma treatment, thermal and plasma enhanced ALD and LPCVD, mini batch ALD, and dry cleaning systems for use in LSI, NAND, and DRAM applications. The company was founded in 2000 and is headquartered in Yongin, South Korea.