Techwing Inc (089030) - Total Liabilities
Based on the latest financial reports, Techwing Inc (089030) has total liabilities worth ₩421.58 Billion KRW (≈ $285.70 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Techwing Inc - Total Liabilities Trend (2013–2025)
This chart illustrates how Techwing Inc's total liabilities have evolved over time, based on quarterly financial data. Explore Techwing Inc long-term investment allocation to see how much of total assets are deployed in long-term investments.
Techwing Inc Competitors by Total Liabilities
The table below lists competitors of Techwing Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Columbia Financial Inc
NASDAQ:CLBK
|
USA | $9.84 Billion |
|
Topsec Technologies Group Inc
SHE:002212
|
China | CN¥1.66 Billion |
|
Voltamp Transformers Limited
NSE:VOLTAMP
|
India | Rs2.26 Billion |
|
Certara Inc
NASDAQ:CERT
|
USA | $493.79 Million |
|
Tianjin You Fa Steel Pipe Group Stock Co Ltd
SHG:601686
|
China | CN¥19.30 Billion |
|
Aura Investments Ltd
TA:AURA
|
Israel | ILA4.21 Billion |
|
Fujian Aonong Biological Technology Group Incorporation Ltd
SHG:603363
|
China | CN¥5.36 Billion |
|
PROS Holdings Inc
NYSE:PRO
|
USA | $521.11 Million |
Liability Composition Analysis (2013–2025)
This chart breaks down Techwing Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Techwing Inc total assets.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.72 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.96 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.67 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Techwing Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Techwing Inc (2013–2025)
The table below shows the annual total liabilities of Techwing Inc from 2013 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | ₩421.58 Billion ≈ $285.70 Million |
+32.61% |
| 2024-12-31 | ₩317.92 Billion ≈ $215.45 Million |
+17.62% |
| 2023-12-31 | ₩270.30 Billion ≈ $183.18 Million |
+5.32% |
| 2022-12-31 | ₩256.64 Billion ≈ $173.92 Million |
-11.98% |
| 2021-12-31 | ₩291.56 Billion ≈ $197.59 Million |
+36.51% |
| 2020-12-31 | ₩213.58 Billion ≈ $144.74 Million |
+4.71% |
| 2019-12-31 | ₩203.98 Billion ≈ $138.23 Million |
+18.33% |
| 2018-12-31 | ₩172.38 Billion ≈ $116.82 Million |
-9.96% |
| 2017-12-31 | ₩191.45 Billion ≈ $129.74 Million |
+21.06% |
| 2016-12-31 | ₩158.14 Billion ≈ $107.17 Million |
+37.62% |
| 2015-12-31 | ₩114.91 Billion ≈ $77.87 Million |
+16.47% |
| 2014-12-31 | ₩98.66 Billion ≈ $66.86 Million |
+15.97% |
| 2013-12-31 | ₩85.07 Billion ≈ $57.65 Million |
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About Techwing Inc
Techwing, Inc., together with its subsidiaries, develops, manufactures, sells, and services semiconductor inspection equipment in South Korea and internationally. The company offers wafer probing system, a device that tests the electrical properties of chips formed on wafer; cube probers, a die level cube prober machines; memory and SOC handler, an equipment used in the test process in the final … Read more