Techwing Inc (089030) - Total Liabilities
Based on the latest financial reports, Techwing Inc (089030) has total liabilities worth ₩421.58 Billion KRW (≈ $285.70 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Techwing Inc - Total Liabilities Trend (2013–2025)
This chart illustrates how Techwing Inc's total liabilities have evolved over time, based on quarterly financial data. See Techwing Inc current assets vs equity to evaluate short-term liquidity relative to the company's equity base.
Techwing Inc Competitors by Total Liabilities
The table below lists competitors of Techwing Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
DXC Technology Co
NYSE:DXC
|
USA | $9.68 Billion |
|
Uniqure NV
NASDAQ:QURE
|
USA | $659.64 Million |
|
RPC Inc
NYSE:RES
|
USA | $384.66 Million |
|
Tega Industries Limited
NSE:TEGA
|
India | Rs6.74 Billion |
|
Piper Sandler Companies
NYSE:PIPR
|
USA | $-1.46 Billion |
|
Wuhan Tianyuan Environmental Protection Co.LTD
SHE:301127
|
China | CN¥5.33 Billion |
|
CPT Technology Group Co Ltd
SHE:000536
|
China | CN¥4.62 Billion |
|
Leggett & Platt Incorporated
NYSE:LEG
|
USA | $2.48 Billion |
Liability Composition Analysis (2013–2025)
This chart breaks down Techwing Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Techwing Inc market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.72 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.96 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.67 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Techwing Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Techwing Inc (2013–2025)
The table below shows the annual total liabilities of Techwing Inc from 2013 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | ₩421.58 Billion ≈ $285.70 Million |
+32.61% |
| 2024-12-31 | ₩317.92 Billion ≈ $215.45 Million |
+17.62% |
| 2023-12-31 | ₩270.30 Billion ≈ $183.18 Million |
+5.32% |
| 2022-12-31 | ₩256.64 Billion ≈ $173.92 Million |
-11.98% |
| 2021-12-31 | ₩291.56 Billion ≈ $197.59 Million |
+36.51% |
| 2020-12-31 | ₩213.58 Billion ≈ $144.74 Million |
+4.71% |
| 2019-12-31 | ₩203.98 Billion ≈ $138.23 Million |
+18.33% |
| 2018-12-31 | ₩172.38 Billion ≈ $116.82 Million |
-9.96% |
| 2017-12-31 | ₩191.45 Billion ≈ $129.74 Million |
+21.06% |
| 2016-12-31 | ₩158.14 Billion ≈ $107.17 Million |
+37.62% |
| 2015-12-31 | ₩114.91 Billion ≈ $77.87 Million |
+16.47% |
| 2014-12-31 | ₩98.66 Billion ≈ $66.86 Million |
+15.97% |
| 2013-12-31 | ₩85.07 Billion ≈ $57.65 Million |
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About Techwing Inc
Techwing, Inc., together with its subsidiaries, develops, manufactures, sells, and services semiconductor inspection equipment in South Korea and internationally. The company offers wafer probing system, a device that tests the electrical properties of chips formed on wafer; cube probers, a die level cube prober machines; memory and SOC handler, an equipment used in the test process in the final … Read more