Advanced Process Systems Corporation (265520) - Total Liabilities

Latest as of March 2026: ₩313.78 Billion KRW ≈ $212.65 Million USD

Based on the latest financial reports, Advanced Process Systems Corporation (265520) has total liabilities worth ₩313.78 Billion KRW (≈ $212.65 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check 265520 financial resilience to evaluate the company's liquid asset resilience ratio.

Advanced Process Systems Corporation - Total Liabilities Trend (2017–2025)

This chart illustrates how Advanced Process Systems Corporation's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see total assets of Advanced Process Systems Corporation.

Advanced Process Systems Corporation Competitors by Total Liabilities

The table below lists competitors of Advanced Process Systems Corporation ranked by their total liabilities.

Company Country Total Liabilities
ZHOU HEI YA HLDG -000001
F:ZHY
Germany €861.45 Million
Hillgrove Resources Ltd
AU:HGO
Australia AU$52.83 Million
Woojin
KO:105840
Korea ₩44.43 Billion
Alta Equipment Group Inc
NYSE:ALTG
USA $1.36 Billion
Bank Yudha Bhakti Tbk
JK:BBYB
Indonesia Rp14.07 Trillion
Prosafe SE
OL:PRS
Norway Nkr351.70 Million
Dafeng TV Ltd
TW:6184
Taiwan NT$3.29 Billion
Lindsay Australia Ltd
AU:LAU
Australia AU$565.43 Million

Liability Composition Analysis (2017–2025)

This chart breaks down Advanced Process Systems Corporation's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Advanced Process Systems Corporation balance sheet independence to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.77 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.84 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.46 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Advanced Process Systems Corporation's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Advanced Process Systems Corporation (2017–2025)

The table below shows the annual total liabilities of Advanced Process Systems Corporation from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 ₩313.38 Billion
≈ $212.37 Million
+19.04%
2024-12-31 ₩263.25 Billion
≈ $178.40 Million
+5.40%
2023-12-31 ₩249.76 Billion
≈ $169.26 Million
-10.13%
2022-12-31 ₩277.91 Billion
≈ $188.34 Million
+17.18%
2021-12-31 ₩237.18 Billion
≈ $160.73 Million
+1.73%
2020-12-31 ₩233.16 Billion
≈ $158.01 Million
-24.01%
2019-12-31 ₩306.84 Billion
≈ $207.94 Million
-2.46%
2018-12-31 ₩314.57 Billion
≈ $213.18 Million
-16.90%
2017-12-31 ₩378.54 Billion
≈ $256.53 Million
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About Advanced Process Systems Corporation

KQ:265520 Korea Semiconductor Equipment & Materials
Market Cap
$189.32 Million
₩279.36 Billion KRW
Market Cap Rank
#16829 Global
#645 in Korea
Share Price
₩18580.00
Change (1 day)
+2.77%
52-Week Range
₩16020.00 - ₩30200.00
All Time High
₩53815.52
About

Advanced Process Systems Corporation develops and sells semiconductors and display manufacturing equipment primarily in South Korea, China, and Vietnam. It offers semiconductor, such as rapid thermal process, sputter system, descum system, laser dicing, laser de-bonder, wafer dicing, and laser and laser ablation. The company also provides displays excimer laser annealing, laser lift-off, glass en… Read more