Amkor Technology Inc (AMKR) - Total Liabilities

Latest as of March 2026: $3.73 Billion USD

Based on the latest financial reports, Amkor Technology Inc (AMKR) has total liabilities worth $3.73 Billion USD as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Amkor Technology Inc - Total Liabilities Trend (1997–2025)

This chart illustrates how Amkor Technology Inc's total liabilities have evolved over time, based on quarterly financial data. See how liquid is Amkor Technology Inc's working capital to evaluate short-term liquidity relative to the company's equity base.

Amkor Technology Inc Competitors by Total Liabilities

The table below lists competitors of Amkor Technology Inc ranked by their total liabilities.

Company Country Total Liabilities
RBC Bearings Incorporated
NYSE:RBC
USA $1.88 Billion
Korea Shipbuilding & Offshore Engineering Co Ltd
KO:009540
Korea ₩22.63 Trillion
Industrias Peñoles S.A.B. de C.V
MX:PE&OLES
Mexico MX$5.78 Billion
Viatris Inc
NASDAQ:VTRS
USA $22.18 Billion
Centrais Electricas Brasileiras SA
NYSE:EBR
USA $157.16 Billion
RB Global Inc.
NYSE:RBA
USA $6.32 Billion
Repsol S.A.
MC:REP
Spain €34.12 Billion
Bayan Resources Tbk
JK:BYAN
Indonesia Rp10.00 Trillion

Liability Composition Analysis (1997–2025)

This chart breaks down Amkor Technology Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see AMKR company net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.01 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.82 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.45 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Amkor Technology Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Amkor Technology Inc (1997–2025)

The table below shows the annual total liabilities of Amkor Technology Inc from 1997 to 2025.

Year Total Liabilities Change
2025-12-31 $3.63 Billion +31.47%
2024-12-31 $2.76 Billion -0.54%
2023-12-31 $2.78 Billion -11.08%
2022-12-31 $3.12 Billion +1.83%
2021-12-31 $3.07 Billion +14.90%
2020-12-31 $2.67 Billion -1.37%
2019-12-31 $2.71 Billion +2.49%
2018-12-31 $2.64 Billion -6.75%
2017-12-31 $2.83 Billion +5.28%
2016-12-31 $2.69 Billion -4.16%
2015-12-31 $2.81 Billion +12.02%
2014-12-31 $2.50 Billion +1.71%
2013-12-31 $2.46 Billion +5.39%
2012-12-31 $2.34 Billion +12.78%
2011-12-31 $2.07 Billion -1.35%
2010-12-31 $2.10 Billion +2.79%
2009-12-31 $2.04 Billion -4.56%
2008-12-31 $2.14 Billion -15.41%
2007-12-31 $2.53 Billion -4.23%
2006-12-31 $2.64 Billion -3.08%
2005-12-31 $2.73 Billion +5.32%
2004-12-31 $2.59 Billion +19.34%
2003-12-31 $2.17 Billion -6.34%
2002-12-31 $2.32 Billion +4.97%
2001-12-31 $2.21 Billion +6.18%
2000-12-31 $2.08 Billion +104.30%
1999-12-31 $1.02 Billion +98.22%
1998-12-31 $513.24 Million -32.06%
1997-12-31 $755.43 Million --

About Amkor Technology Inc

NASDAQ:AMKR USA Semiconductor Equipment & Materials
Market Cap
$20.52 Billion
Market Cap Rank
#1349 Global
#549 in USA
Share Price
$82.78
Change (1 day)
+8.71%
52-Week Range
$20.16 - $82.78
All Time High
$82.78
About

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones… Read more