Shenzhen Vital New Material Co. Ltd. (301319) - Total Liabilities
Based on the latest financial reports, Shenzhen Vital New Material Co. Ltd. (301319) has total liabilities worth CN¥299.17 Million CNY (≈ $43.78 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Shenzhen Vital New Material Co. Ltd. (301319) cash flow conversion to assess how effectively this company generates cash.
Shenzhen Vital New Material Co. Ltd. - Total Liabilities Trend (2019–2024)
This chart illustrates how Shenzhen Vital New Material Co. Ltd.'s total liabilities have evolved over time, based on quarterly financial data. Check Shenzhen Vital New Material Co. Ltd. liquidity resilience to evaluate the company's liquid asset resilience ratio.
Shenzhen Vital New Material Co. Ltd. Competitors by Total Liabilities
The table below lists competitors of Shenzhen Vital New Material Co. Ltd. ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Shaanxi Provincial Natural Gas Co Ltd
SHE:002267
|
China | CN¥7.07 Billion |
|
Savers Value Village, Inc.
NYSE:SVV
|
USA | $1.58 Billion |
|
China Resources Boya Bio pharmaceutical Group Co Ltd
SHE:300294
|
China | CN¥1.05 Billion |
|
Forestar Group Inc
NYSE:FOR
|
USA | $1.39 Billion |
|
Jiangsu Zhenjiang New Energy Equipment Co Ltd Class A
SHG:603507
|
China | CN¥5.38 Billion |
|
Kernel Holding SA
F:0KE
|
Germany | €1.19 Billion |
|
Grupo Televisa S.A.B.
F:TLV
|
Germany | €124.64 Billion |
Liability Composition Analysis (2019–2024)
This chart breaks down Shenzhen Vital New Material Co. Ltd.'s total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see how much is Shenzhen Vital New Material Co. Ltd. worth.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 4.40 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.26 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.21 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Shenzhen Vital New Material Co. Ltd.'s debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Shenzhen Vital New Material Co. Ltd. (2019–2024)
The table below shows the annual total liabilities of Shenzhen Vital New Material Co. Ltd. from 2019 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥240.52 Million ≈ $35.20 Million |
+61.60% |
| 2023-12-31 | CN¥148.84 Million ≈ $21.78 Million |
+6.56% |
| 2022-12-31 | CN¥139.67 Million ≈ $20.44 Million |
-49.46% |
| 2021-12-31 | CN¥276.36 Million ≈ $40.44 Million |
+64.10% |
| 2020-12-31 | CN¥168.41 Million ≈ $24.64 Million |
+44.43% |
| 2019-12-31 | CN¥116.60 Million ≈ $17.06 Million |
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About Shenzhen Vital New Material Co. Ltd.
Shenzhen Vital New Material Co., Ltd. engages in the research, development, production, and sale of electronic materials in China and internationally. It offers microelectronic welding materials, including solder paste, tin bars, tin wires, and tin sheets, and microelectronic auxiliary welding materials. The company's products are used in assembly and interconnection of electronic devices in mult… Read more