ACM Research Shanghai Inc Total Liabilities

Latest as of September 2025: CN¥4.93 Billion CNY ≈ $721.77 Million USD

ACM Research Shanghai Inc total liabilities. Based on the latest financial reports, ACM Research Shanghai Inc (688082) has total liabilities worth CN¥4.93 Billion CNY (≈ $721.77 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check ACM Research Shanghai Inc liquid asset ratio to evaluate the company's liquid asset resilience ratio.

Total Liabilities of ACM Research Shanghai Inc (2017–2024)

Total liabilities of ACM Research Shanghai Inc from 2017 to 2024. This chart illustrates how ACM Research Shanghai Inc's total liabilities have evolved over time, based on quarterly financial data.

ACM Research Shanghai Inc Competitors by Total Liabilities

The table below lists competitors of ACM Research Shanghai Inc ranked by their total liabilities.

Company Country Total Liabilities
Sichuan Road & Bridge Group Co Ltd
SHG:600039
China CN¥202.34 Billion
ZTO Express (Cayman) Inc
NYSE:ZTO
USA $34.90 Billion
BUDWEISER BREW.UNSP.ADR/4
F:4BB1
Germany €4.45 Billion
Graco Inc
NYSE:GGG
USA $607.76 Million
IONQ Inc
NYSE:IONQ
USA $1.70 Billion
Inspur Electronic Info Industr
SHE:000977
China CN¥87.92 Billion
Dayforce Inc.
NYSE:DAY
USA $5.98 Billion
Eurofins Scientific SE
F:ESF0
Germany €6.41 Billion

Liability Composition Analysis (2017–2024)

This chart breaks down ACM Research Shanghai Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see ACM Research Shanghai Inc assets under control.

Liquidity & Leverage Metrics

ACM Research Shanghai Inc Total Liabilities Ratios Explained

ACM Research Shanghai Inc total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 4.21 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.37 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.27 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how ACM Research Shanghai Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for ACM Research Shanghai Inc (2017–2024)

The table below shows the annual total liabilities of ACM Research Shanghai Inc from 2017 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥4.46 Billion
≈ $653.05 Million
+35.42%
2023-12-31 CN¥3.30 Billion
≈ $482.24 Million
+24.29%
2022-12-31 CN¥2.65 Billion
≈ $388.00 Million
+74.16%
2021-12-31 CN¥1.52 Billion
≈ $222.78 Million
+91.54%
2020-12-31 CN¥794.85 Million
≈ $116.31 Million
+66.26%
2019-12-31 CN¥478.07 Million
≈ $69.96 Million
-2.63%
2018-12-31 CN¥490.98 Million
≈ $71.85 Million
+80.13%
2017-12-31 CN¥272.56 Million
≈ $39.88 Million
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About ACM Research Shanghai Inc

SHG:688082 China Semiconductor Equipment & Materials
Market Cap
$11.20 Billion
CN¥76.54 Billion CNY
Market Cap Rank
#1987 Global
#177 in China
Share Price
CN¥159.40
Change (1 day)
-5.86%
52-Week Range
CN¥139.74 - CN¥447.95
All Time High
CN¥447.95
About

ACM Research (Shanghai), Inc. engages in the research, development, production, and sale of semiconductor equipment in China. The company offers cleaning equipment; plating system and panel level packaging; furnace system; track systems; PECVD systems; and stress free polishing systems. It serves IC and compound semi manufacturing, wafer-level and panel level packaging, and wafer manufacturing an… Read more