ACM Research Shanghai Inc (688082) - Total Liabilities

Latest as of September 2025: CN¥4.93 Billion CNY ≈ $721.77 Million USD

Based on the latest financial reports, ACM Research Shanghai Inc (688082) has total liabilities worth CN¥4.93 Billion CNY (≈ $721.77 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check ACM Research Shanghai Inc liquidity resilience to evaluate the company's liquid asset resilience ratio.

ACM Research Shanghai Inc - Total Liabilities Trend (2017–2024)

This chart illustrates how ACM Research Shanghai Inc's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see ACM Research Shanghai Inc asset portfolio.

ACM Research Shanghai Inc Competitors by Total Liabilities

The table below lists competitors of ACM Research Shanghai Inc ranked by their total liabilities.

Company Country Total Liabilities
CyberArk Software Ltd
NASDAQ:CYBR
USA $2.41 Billion
Banco De Chile
NYSE:BCH
USA $48.30 Trillion
China Tungsten and Hightech Materials Co Ltd
SHE:000657
China CN¥16.94 Billion
InterGlobe Aviation Limited
NSE:INDIGO
India Rs1.29 Trillion
Industrias Peñoles S.A.B. de C.V
MX:PE&OLES
Mexico MX$4.98 Billion
Fair Isaac Corporation
NYSE:FICO
USA $6.13 Billion
China Everbright Bank Co Ltd
SHG:601818
China CN¥6.62 Trillion
Telefonica
MC:TEF
Spain €77.83 Billion

Liability Composition Analysis (2017–2024)

This chart breaks down ACM Research Shanghai Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See 688082 net asset quality index to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 4.21 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.37 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.27 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how ACM Research Shanghai Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for ACM Research Shanghai Inc (2017–2024)

The table below shows the annual total liabilities of ACM Research Shanghai Inc from 2017 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥4.46 Billion
≈ $653.05 Million
+35.42%
2023-12-31 CN¥3.30 Billion
≈ $482.24 Million
+24.29%
2022-12-31 CN¥2.65 Billion
≈ $388.00 Million
+74.16%
2021-12-31 CN¥1.52 Billion
≈ $222.78 Million
+91.54%
2020-12-31 CN¥794.85 Million
≈ $116.31 Million
+66.26%
2019-12-31 CN¥478.07 Million
≈ $69.96 Million
-2.63%
2018-12-31 CN¥490.98 Million
≈ $71.85 Million
+80.13%
2017-12-31 CN¥272.56 Million
≈ $39.88 Million
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About ACM Research Shanghai Inc

SHG:688082 China Semiconductor Equipment & Materials
Market Cap
$20.57 Billion
CN¥140.58 Billion CNY
Market Cap Rank
#1254 Global
#92 in China
Share Price
CN¥292.77
Change (1 day)
+3.65%
52-Week Range
CN¥139.74 - CN¥447.95
All Time High
CN¥447.95
About

ACM Research (Shanghai), Inc. engages in the research, development, production, and sale of semiconductor equipment in China. The company offers cleaning equipment; plating system and panel level packaging; furnace system; track systems; PECVD systems; and stress free polishing systems. It serves IC and compound semi manufacturing, wafer-level and panel level packaging, and wafer manufacturing an… Read more