ACM Research Shanghai Inc (688082) - Total Liabilities
Based on the latest financial reports, ACM Research Shanghai Inc (688082) has total liabilities worth CN¥4.93 Billion CNY (≈ $721.77 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 688082 cash flow conversion to assess how effectively this company generates cash.
ACM Research Shanghai Inc - Total Liabilities Trend (2017–2024)
This chart illustrates how ACM Research Shanghai Inc's total liabilities have evolved over time, based on quarterly financial data. Check 688082 financial resilience to evaluate the company's liquid asset resilience ratio.
ACM Research Shanghai Inc Competitors by Total Liabilities
The table below lists competitors of ACM Research Shanghai Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Grupo Aeroportuario del Pacífico S.A.B. de C.V
MX:GAPB
|
Mexico | MX$59.56 Billion |
|
Aecom Technology Corporation
NYSE:ACM
|
USA | $9.71 Billion |
|
Jiangsu Yanghe Brewery Joint-Stock Co Ltd
SHE:002304
|
China | CN¥10.84 Billion |
|
Societatea Nationala de Gaze Naturale Romgaz SA
RO:SNG
|
Romania | RON6.19 Billion |
|
Ruijie Networks Co. Ltd. A
SHE:301165
|
China | CN¥4.43 Billion |
|
Belimo Holding
SW:BEAN
|
Switzerland | CHF211.71 Million |
|
Equinox Gold Corp
TO:EQX
|
Canada | CA$4.73 Billion |
|
Applied Industrial Technologies
NYSE:AIT
|
USA | $1.28 Billion |
Liability Composition Analysis (2017–2024)
This chart breaks down ACM Research Shanghai Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see ACM Research Shanghai Inc (688082) market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 4.21 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.37 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.27 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how ACM Research Shanghai Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for ACM Research Shanghai Inc (2017–2024)
The table below shows the annual total liabilities of ACM Research Shanghai Inc from 2017 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥4.46 Billion ≈ $653.05 Million |
+35.42% |
| 2023-12-31 | CN¥3.30 Billion ≈ $482.24 Million |
+24.29% |
| 2022-12-31 | CN¥2.65 Billion ≈ $388.00 Million |
+74.16% |
| 2021-12-31 | CN¥1.52 Billion ≈ $222.78 Million |
+91.54% |
| 2020-12-31 | CN¥794.85 Million ≈ $116.31 Million |
+66.26% |
| 2019-12-31 | CN¥478.07 Million ≈ $69.96 Million |
-2.63% |
| 2018-12-31 | CN¥490.98 Million ≈ $71.85 Million |
+80.13% |
| 2017-12-31 | CN¥272.56 Million ≈ $39.88 Million |
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About ACM Research Shanghai Inc
ACM Research (Shanghai), Inc. engages in the research, development, production, and sale of semiconductor equipment in China. The company offers cleaning equipment; plating system and panel level packaging; furnace system; track systems; PECVD systems; and stress free polishing systems. It serves IC and compound semi manufacturing, wafer-level and panel level packaging, and wafer manufacturing an… Read more