ACM Research Shanghai Inc (688082) - Total Liabilities

Latest as of September 2025: CN¥4.93 Billion CNY ≈ $721.77 Million USD

Based on the latest financial reports, ACM Research Shanghai Inc (688082) has total liabilities worth CN¥4.93 Billion CNY (≈ $721.77 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore ACM Research Shanghai Inc annual equity growth to track the company's year-over-year net asset growth rate.

ACM Research Shanghai Inc - Total Liabilities Trend (2017–2024)

This chart illustrates how ACM Research Shanghai Inc's total liabilities have evolved over time, based on quarterly financial data. See cash generation quality of ACM Research Shanghai Inc to measure how efficiently the company converts operating cash flow to free cash.

ACM Research Shanghai Inc Competitors by Total Liabilities

The table below lists competitors of ACM Research Shanghai Inc ranked by their total liabilities.

Company Country Total Liabilities
Bank of Hangzhou Co Ltd
SHG:600926
China CN¥2.27 Trillion
Amundi SA
PA:AMUN
France €26.04 Billion
Hong Kong Land Holdings Ltd
LSE:HKLB
UK $8.90 Billion
Tourmaline Oil Corp.
TO:TOU
Canada CA$7.10 Billion
Twilio Inc
NYSE:TWLO
USA $1.95 Billion
EVE Energy
SHE:300014
China CN¥86.15 Billion
CH Robinson Worldwide Inc
NASDAQ:CHRW
USA $3.53 Billion
Western Midstream Partners LP
NYSE:WES
USA $11.42 Billion

Liability Composition Analysis (2017–2024)

This chart breaks down ACM Research Shanghai Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 688082 market cap.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 4.21 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.37 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.27 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how ACM Research Shanghai Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for ACM Research Shanghai Inc (2017–2024)

The table below shows the annual total liabilities of ACM Research Shanghai Inc from 2017 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥4.46 Billion
≈ $653.05 Million
+35.42%
2023-12-31 CN¥3.30 Billion
≈ $482.24 Million
+24.29%
2022-12-31 CN¥2.65 Billion
≈ $388.00 Million
+74.16%
2021-12-31 CN¥1.52 Billion
≈ $222.78 Million
+91.54%
2020-12-31 CN¥794.85 Million
≈ $116.31 Million
+66.26%
2019-12-31 CN¥478.07 Million
≈ $69.96 Million
-2.63%
2018-12-31 CN¥490.98 Million
≈ $71.85 Million
+80.13%
2017-12-31 CN¥272.56 Million
≈ $39.88 Million
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About ACM Research Shanghai Inc

SHG:688082 China Semiconductor Equipment & Materials
Market Cap
$17.37 Billion
CN¥118.67 Billion CNY
Market Cap Rank
#1443 Global
#123 in China
Share Price
CN¥247.15
Change (1 day)
-9.10%
52-Week Range
CN¥113.74 - CN¥447.95
All Time High
CN¥447.95
About

ACM Research (Shanghai), Inc. engages in the research, development, production, and sale of semiconductor equipment in China. The company offers cleaning equipment; plating system and panel level packaging; furnace system; track systems; PECVD systems; and stress free polishing systems. It serves IC and compound semi manufacturing, wafer-level and panel level packaging, and wafer manufacturing an… Read more