China Chippacking Technology Co. Ltd. A (688216) - Total Liabilities

Latest as of June 2025: CN¥1.26 Billion CNY ≈ $184.07 Million USD

Based on the latest financial reports, China Chippacking Technology Co. Ltd. A (688216) has total liabilities worth CN¥1.26 Billion CNY (≈ $184.07 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 688216 cash flow conversion to assess how effectively this company generates cash.

China Chippacking Technology Co. Ltd. A - Total Liabilities Trend (2019–2024)

This chart illustrates how China Chippacking Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. Check China Chippacking Technology Co. Ltd. A (688216) asset resilience to evaluate the company's liquid asset resilience ratio.

China Chippacking Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of China Chippacking Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Beihai Gofar Marine Biological Industry Co Ltd
SHG:600538
China CN¥179.09 Million
Great Lakes Dredge & Dock
NASDAQ:GLDD
USA $765.63 Million
Hunan Hansen Pharmaceutical Co Ltd
SHE:002412
China CN¥301.66 Million
Nanjing University Environmental
SHE:300864
China CN¥512.23 Million
ADLINK Technology Inc
TW:6166
Taiwan NT$7.22 Billion
Changchun Gas Co Ltd
SHG:600333
China CN¥4.72 Billion
United States Cellular Corporation
NYSE:USM
USA $2.38 Billion

Liability Composition Analysis (2019–2024)

This chart breaks down China Chippacking Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see how much is China Chippacking Technology Co. Ltd. A worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.41 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 2.11 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.67 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how China Chippacking Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for China Chippacking Technology Co. Ltd. A (2019–2024)

The table below shows the annual total liabilities of China Chippacking Technology Co. Ltd. A from 2019 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥1.32 Billion
≈ $192.73 Million
+17.61%
2023-12-31 CN¥1.12 Billion
≈ $163.87 Million
+24.66%
2022-12-31 CN¥898.30 Million
≈ $131.45 Million
+6.47%
2021-12-31 CN¥843.68 Million
≈ $123.46 Million
+69.85%
2020-12-31 CN¥496.71 Million
≈ $72.68 Million
+31.49%
2019-12-31 CN¥377.75 Million
≈ $55.28 Million
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About China Chippacking Technology Co. Ltd. A

SHG:688216 China Semiconductors
Market Cap
$514.63 Million
CN¥3.52 Billion CNY
Market Cap Rank
#12390 Global
#3849 in China
Share Price
CN¥30.64
Change (1 day)
+6.43%
52-Week Range
CN¥18.46 - CN¥35.00
All Time High
CN¥72.22
About

China Chippacking Technology Co.,Ltd. engages in the integrated circuit packaging and testing business in China. It provides packaging technology solutions. The company offers CPC, ECPC, DFN/QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, SOT, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS, FC, 5G gallium nitride RF device plastic packaging, CQFN/CDFN, and PDFN packaging forms that are used in c… Read more