China Chippacking Technology Co. Ltd. A Total Liabilities

Latest as of June 2025: CN¥1.26 Billion CNY ≈ $184.07 Million USD

China Chippacking Technology Co. Ltd. A total liabilities. Based on the latest financial reports, China Chippacking Technology Co. Ltd. A (688216) has total liabilities worth CN¥1.26 Billion CNY (≈ $184.07 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check 688216 financial resilience to evaluate the company's liquid asset resilience ratio.

Total Liabilities of China Chippacking Technology Co. Ltd. A (2019–2024)

Total liabilities of China Chippacking Technology Co. Ltd. A from 2019 to 2024. This chart illustrates how China Chippacking Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data.

China Chippacking Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of China Chippacking Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
China United Travel Co Ltd
SHG:600358
China CN¥382.26 Million
Shanghai Fudan Forward S&T Co Ltd
SHG:600624
China CN¥828.67 Million
Burstone Group Limited
JSE:BTN
South Africa ZAC9.09 Billion
Tianjin Pengling Rubber Hose Co Ltd
SHE:300375
China CN¥1.42 Billion
Nuveen Variable Rate Preferred & Income Fund
NYSE:NPFD
USA $280.45 Million
United Faith Auto-Engineering Co. Ltd.
SHE:301112
China CN¥416.72 Million
Torpol SA
WAR:TOR
Poland zł579.50 Million
Fastned B.V.
AS:FAST
Netherlands €362.97 Million

Liability Composition Analysis (2019–2024)

This chart breaks down China Chippacking Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see 688216 total assets.

Liquidity & Leverage Metrics

China Chippacking Technology Co. Ltd. A Total Liabilities Ratios Explained

China Chippacking Technology Co. Ltd. A total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 0.41 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 2.11 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.67 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how China Chippacking Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for China Chippacking Technology Co. Ltd. A (2019–2024)

The table below shows the annual total liabilities of China Chippacking Technology Co. Ltd. A from 2019 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥1.32 Billion
≈ $192.73 Million
+17.61%
2023-12-31 CN¥1.12 Billion
≈ $163.87 Million
+24.66%
2022-12-31 CN¥898.30 Million
≈ $131.45 Million
+6.47%
2021-12-31 CN¥843.68 Million
≈ $123.46 Million
+69.85%
2020-12-31 CN¥496.71 Million
≈ $72.68 Million
+31.49%
2019-12-31 CN¥377.75 Million
≈ $55.28 Million
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About China Chippacking Technology Co. Ltd. A

SHG:688216 China Semiconductors
Market Cap
$411.16 Million
CN¥2.81 Billion CNY
Market Cap Rank
#12902 Global
#3767 in China
Share Price
CN¥24.48
Change (1 day)
-6.13%
52-Week Range
CN¥20.87 - CN¥51.30
All Time High
CN¥72.22
About

China Chippacking Technology Co.,Ltd. engages in the integrated circuit packaging and testing business in China. It provides packaging technology solutions. The company offers CPC, ECPC, DFN/QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, SOT, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS, FC, 5G gallium nitride RF device plastic packaging, CQFN/CDFN, and PDFN packaging forms that are used in c… Read more