China Chippacking Technology Co. Ltd. A (688216) - Total Liabilities

Latest as of June 2025: CN¥1.26 Billion CNY ≈ $184.07 Million USD

Based on the latest financial reports, China Chippacking Technology Co. Ltd. A (688216) has total liabilities worth CN¥1.26 Billion CNY (≈ $184.07 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check financial resilience of China Chippacking Technology Co. Ltd. A to evaluate the company's liquid asset resilience ratio.

China Chippacking Technology Co. Ltd. A - Total Liabilities Trend (2019–2024)

This chart illustrates how China Chippacking Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see China Chippacking Technology Co. Ltd. A assets under control.

China Chippacking Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of China Chippacking Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
New Trend International Logis-Tech Co Ltd
SHE:300532
China CN¥3.74 Billion
Shenzhen Hirisun Technology Inc
SHE:300277
China CN¥176.80 Million
Shanghai Kinetic Medical Co
SHE:300326
China CN¥495.68 Million
Cosonic Intelligent Tech Co Ltd
SHE:300793
China CN¥1.41 Billion
Hanwha Investment&Securities Co Ltd
KO:003530
Korea ₩17.01 Trillion
ZJAMP Group Co Ltd
SHE:002758
China CN¥18.80 Billion
Papa John's International Inc
NASDAQ:PZZA
USA $1.25 Billion
Sri Trang Agro-Industry Public Company Limited
BK:STA-R
Thailand ฿40.18 Billion

Liability Composition Analysis (2019–2024)

This chart breaks down China Chippacking Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See net asset quality index of China Chippacking Technology Co. Ltd. A to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.41 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 2.11 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.67 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how China Chippacking Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for China Chippacking Technology Co. Ltd. A (2019–2024)

The table below shows the annual total liabilities of China Chippacking Technology Co. Ltd. A from 2019 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥1.32 Billion
≈ $192.73 Million
+17.61%
2023-12-31 CN¥1.12 Billion
≈ $163.87 Million
+24.66%
2022-12-31 CN¥898.30 Million
≈ $131.45 Million
+6.47%
2021-12-31 CN¥843.68 Million
≈ $123.46 Million
+69.85%
2020-12-31 CN¥496.71 Million
≈ $72.68 Million
+31.49%
2019-12-31 CN¥377.75 Million
≈ $55.28 Million
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About China Chippacking Technology Co. Ltd. A

SHG:688216 China Semiconductors
Market Cap
$651.51 Million
CN¥4.45 Billion CNY
Market Cap Rank
#11008 Global
#3064 in China
Share Price
CN¥38.79
Change (1 day)
+2.54%
52-Week Range
CN¥20.87 - CN¥51.30
All Time High
CN¥72.22
About

China Chippacking Technology Co.,Ltd. engages in the integrated circuit packaging and testing business in China. It provides packaging technology solutions. The company offers CPC, ECPC, DFN/QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, SOT, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS, FC, 5G gallium nitride RF device plastic packaging, CQFN/CDFN, and PDFN packaging forms that are used in c… Read more