China Chippacking Technology Co. Ltd. A (688216) - Total Liabilities
Based on the latest financial reports, China Chippacking Technology Co. Ltd. A (688216) has total liabilities worth CN¥1.26 Billion CNY (≈ $184.07 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
China Chippacking Technology Co. Ltd. A - Total Liabilities Trend (2019–2024)
This chart illustrates how China Chippacking Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See China Chippacking Technology Co. Ltd. A working capital to net assets to evaluate short-term liquidity relative to the company's equity base.
China Chippacking Technology Co. Ltd. A Competitors by Total Liabilities
The table below lists competitors of China Chippacking Technology Co. Ltd. A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Minami Acoustics Ltd. A
SHE:301383
|
China | CN¥553.42 Million |
|
Shandong Xiantan Co Ltd
SHE:002746
|
China | CN¥3.57 Billion |
|
RVRC Holding AB
ST:RVRC
|
Sweden | Skr371.00 Million |
|
Hubeiyichang Transportation Group Co Ltd
SHE:002627
|
China | CN¥589.26 Million |
|
Attacq
JSE:ATT
|
South Africa | ZAC9.24 Billion |
|
Invesco Municipal Opportunity Trust
NYSE:VMO
|
USA | $393.53 Million |
|
Dogu Aras Enerji Yatirimlari AS
IS:ARASE
|
Turkey | TL8.69 Billion |
|
AGF Management Limited
F:A3J
|
Germany | €504.67 Million |
Liability Composition Analysis (2019–2024)
This chart breaks down China Chippacking Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see how much is China Chippacking Technology Co. Ltd. A worth.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.41 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 2.11 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.67 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how China Chippacking Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for China Chippacking Technology Co. Ltd. A (2019–2024)
The table below shows the annual total liabilities of China Chippacking Technology Co. Ltd. A from 2019 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥1.32 Billion ≈ $192.73 Million |
+17.61% |
| 2023-12-31 | CN¥1.12 Billion ≈ $163.87 Million |
+24.66% |
| 2022-12-31 | CN¥898.30 Million ≈ $131.45 Million |
+6.47% |
| 2021-12-31 | CN¥843.68 Million ≈ $123.46 Million |
+69.85% |
| 2020-12-31 | CN¥496.71 Million ≈ $72.68 Million |
+31.49% |
| 2019-12-31 | CN¥377.75 Million ≈ $55.28 Million |
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About China Chippacking Technology Co. Ltd. A
China Chippacking Technology Co.,Ltd. engages in the integrated circuit packaging and testing business in China. It provides packaging technology solutions. The company offers CPC, ECPC, DFN/QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, SOT, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS, FC, 5G gallium nitride RF device plastic packaging, CQFN/CDFN, and PDFN packaging forms that are used in c… Read more