Foxconn Technology Co Ltd (2354) - Total Liabilities
Based on the latest financial reports, Foxconn Technology Co Ltd (2354) has total liabilities worth NT$51.82 Billion TWD as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Foxconn Technology Co Ltd - Total Liabilities Trend (2002–2025)
This chart illustrates how Foxconn Technology Co Ltd's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.
Foxconn Technology Co Ltd Competitors by Total Liabilities
The table below lists competitors of Foxconn Technology Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Genting Bhd
KLSE:3182
|
Malaysia | RM52.02 Billion |
|
AstraZeneca Pharma India Limited
NSE:ASTRAZEN
|
India | Rs8.16 Billion |
|
Shenzhen Kangtai Biological Products Co Ltd
SHE:300601
|
China | CN¥4.52 Billion |
|
Slide Insurance Holdings, Inc. Common Stock
NASDAQ:SLDE
|
USA | $1.72 Billion |
|
Bravida Holding AB
ST:BRAV
|
Sweden | Skr14.33 Billion |
|
The Andersons Inc
NASDAQ:ANDE
|
USA | $2.42 Billion |
|
Krungthai Card Public Company Limited
BK:KTC-R
|
Thailand | ฿66.51 Billion |
Liability Composition Analysis (2002–2025)
This chart breaks down Foxconn Technology Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.47 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.48 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.33 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Foxconn Technology Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Foxconn Technology Co Ltd (2002–2025)
The table below shows the annual total liabilities of Foxconn Technology Co Ltd from 2002 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$51.82 Billion | -8.54% |
| 2024-12-31 | NT$56.66 Billion | +95.84% |
| 2023-12-31 | NT$28.93 Billion | -39.63% |
| 2022-12-31 | NT$47.93 Billion | -24.37% |
| 2021-12-31 | NT$63.37 Billion | +7.70% |
| 2020-12-31 | NT$58.84 Billion | +5.13% |
| 2019-12-31 | NT$55.97 Billion | -1.76% |
| 2018-12-31 | NT$56.97 Billion | -29.55% |
| 2017-12-31 | NT$80.87 Billion | +94.84% |
| 2016-12-31 | NT$41.51 Billion | +28.06% |
| 2015-12-31 | NT$32.41 Billion | -33.77% |
| 2014-12-31 | NT$48.94 Billion | +88.43% |
| 2013-12-31 | NT$25.97 Billion | -43.99% |
| 2012-12-31 | NT$46.37 Billion | +5.94% |
| 2011-12-31 | NT$43.77 Billion | +3.74% |
| 2010-12-31 | NT$42.19 Billion | -13.03% |
| 2009-12-31 | NT$48.51 Billion | -8.37% |
| 2008-12-31 | NT$52.95 Billion | +4.20% |
| 2007-12-31 | NT$50.81 Billion | +63.52% |
| 2006-12-31 | NT$31.07 Billion | +104.00% |
| 2005-12-31 | NT$15.23 Billion | -4.42% |
| 2004-12-31 | NT$15.94 Billion | +616.81% |
| 2003-12-31 | NT$2.22 Billion | +44.77% |
| 2002-12-31 | NT$1.54 Billion | -- |
About Foxconn Technology Co Ltd
Foxconn Technology Co., Ltd. manufactures, processes, and sells cases, heat dissipation modules, and consumer electronics products. It offers 3C electronic product, modules and components. The company also engages in the research, development, manufacture, and sale of computer thermal modules, computer components, and aluminum magnesium cases; and manufacture and marketing of computer peripherals… Read more