Zen Voce (3581) - Total Liabilities

Latest as of September 2025: NT$968.32 Million TWD ≈ $30.51 Million USD

Based on the latest financial reports, Zen Voce (3581) has total liabilities worth NT$968.32 Million TWD (≈ $30.51 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore Zen Voce net asset momentum to track the company's year-over-year net asset growth rate.

Zen Voce - Total Liabilities Trend (2008–2024)

This chart illustrates how Zen Voce's total liabilities have evolved over time, based on quarterly financial data. See Zen Voce (3581) free cash flow to measure how efficiently the company converts operating cash flow to free cash.

Zen Voce Competitors by Total Liabilities

The table below lists competitors of Zen Voce ranked by their total liabilities.

Company Country Total Liabilities
Liberty Global PLC Class B
NASDAQ:LBTYB
USA $12.43 Billion
Kian Shen Corp
TW:1525
Taiwan NT$809.83 Million
Sparebanken Ost
OL:SPOG
Norway Nkr40.78 Billion
BJC Heavy Industries Public Company Limited
BK:BJCHI
Thailand ฿274.97 Million
Nabors Energy Transition Corp. II Class A Ordinary Shares
NASDAQ:NETD
USA $14.15 Million
Jr Global Reit
KO:348950
Korea ₩1.69 Trillion
Mycenax Biotech
TWO:4726
Taiwan NT$1.69 Billion
Lan Fa Textile Co Ltd
TW:1459
Taiwan NT$1.16 Billion

Liability Composition Analysis (2008–2024)

This chart breaks down Zen Voce's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 3581 market cap overview.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.81 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.16 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.49 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Zen Voce's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Zen Voce (2008–2024)

The table below shows the annual total liabilities of Zen Voce from 2008 to 2024.

Year Total Liabilities Change
2024-12-31 NT$1.00 Billion
≈ $31.55 Million
+1.68%
2023-12-31 NT$984.96 Million
≈ $31.03 Million
-10.06%
2022-12-31 NT$1.10 Billion
≈ $34.50 Million
+14.18%
2021-12-31 NT$959.17 Million
≈ $30.22 Million
+25.52%
2020-12-31 NT$764.15 Million
≈ $24.07 Million
+51185.17%
2019-12-31 NT$1.49 Million
≈ $46.94K
-99.79%
2018-12-31 NT$710.43 Million
≈ $22.38 Million
+1.43%
2017-12-31 NT$700.40 Million
≈ $22.07 Million
+2.08%
2016-12-31 NT$686.11 Million
≈ $21.62 Million
+218.51%
2015-12-31 NT$215.41 Million
≈ $6.79 Million
-35.29%
2014-12-31 NT$332.90 Million
≈ $10.49 Million
+30.20%
2013-12-31 NT$255.69 Million
≈ $8.06 Million
-36.19%
2012-12-31 NT$400.73 Million
≈ $12.63 Million
+15.67%
2011-12-31 NT$346.44 Million
≈ $10.91 Million
+9.68%
2010-12-31 NT$315.86 Million
≈ $9.95 Million
+9.16%
2009-12-31 NT$289.35 Million
≈ $9.12 Million
+5.39%
2008-12-31 NT$274.56 Million
≈ $8.65 Million
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About Zen Voce

TWO:3581 Taiwan Semiconductors
Market Cap
$158.13 Million
NT$5.02 Billion TWD
Market Cap Rank
#17386 Global
#868 in Taiwan
Share Price
NT$98.40
Change (1 day)
+8.25%
52-Week Range
NT$33.20 - NT$280.00
All Time High
NT$280.00
About

Zen Voce Corporation manufactures, processes, maintains, and sells semiconductor packaging and testing equipment and fixtures in Taiwan, the United States, China, Singapore, and internationally. The company engages in the design and manufacturing of equipment, including IC packaging machines and bumping products, wafer cutting and cleaning machines, and board cutting and cleaning machines; and te… Read more