Zen Voce (3581) - Total Liabilities
Based on the latest financial reports, Zen Voce (3581) has total liabilities worth NT$968.32 Million TWD (≈ $30.51 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Zen Voce cash flow conversion to assess how effectively this company generates cash.
Zen Voce - Total Liabilities Trend (2008–2024)
This chart illustrates how Zen Voce's total liabilities have evolved over time, based on quarterly financial data. Check Zen Voce (3581) asset resilience to evaluate the company's liquid asset resilience ratio.
Zen Voce Competitors by Total Liabilities
The table below lists competitors of Zen Voce ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Intracom Holdings S.A.
AT:INTRK
|
Greece | €100.73 Million |
|
Voxel S.A.
WAR:VOX
|
Poland | zł286.16 Million |
|
Plum Acquisition Corp. IV Unit
NASDAQ:PLMKU
|
USA | $7.35 Million |
|
Global Indemnity Group, LLC Class A Common Stock
NASDAQ:GBLI
|
USA | $1.01 Billion |
|
Orbit Technologies Ltd
TA:ORBI
|
Israel | ILA45.96 Million |
|
Surya Permata Andalan Tbk PT
JK:NATO
|
Indonesia | Rp3.60 Billion |
Liability Composition Analysis (2008–2024)
This chart breaks down Zen Voce's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Zen Voce (3581) total market value.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.81 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.16 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.49 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Zen Voce's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Zen Voce (2008–2024)
The table below shows the annual total liabilities of Zen Voce from 2008 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | NT$1.00 Billion ≈ $31.55 Million |
+1.68% |
| 2023-12-31 | NT$984.96 Million ≈ $31.03 Million |
-10.06% |
| 2022-12-31 | NT$1.10 Billion ≈ $34.50 Million |
+14.18% |
| 2021-12-31 | NT$959.17 Million ≈ $30.22 Million |
+25.52% |
| 2020-12-31 | NT$764.15 Million ≈ $24.07 Million |
+51185.17% |
| 2019-12-31 | NT$1.49 Million ≈ $46.94K |
-99.79% |
| 2018-12-31 | NT$710.43 Million ≈ $22.38 Million |
+1.43% |
| 2017-12-31 | NT$700.40 Million ≈ $22.07 Million |
+2.08% |
| 2016-12-31 | NT$686.11 Million ≈ $21.62 Million |
+218.51% |
| 2015-12-31 | NT$215.41 Million ≈ $6.79 Million |
-35.29% |
| 2014-12-31 | NT$332.90 Million ≈ $10.49 Million |
+30.20% |
| 2013-12-31 | NT$255.69 Million ≈ $8.06 Million |
-36.19% |
| 2012-12-31 | NT$400.73 Million ≈ $12.63 Million |
+15.67% |
| 2011-12-31 | NT$346.44 Million ≈ $10.91 Million |
+9.68% |
| 2010-12-31 | NT$315.86 Million ≈ $9.95 Million |
+9.16% |
| 2009-12-31 | NT$289.35 Million ≈ $9.12 Million |
+5.39% |
| 2008-12-31 | NT$274.56 Million ≈ $8.65 Million |
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About Zen Voce
Zen Voce Corporation manufactures, processes, maintains, and sells semiconductor packaging and testing equipment and fixtures in Taiwan, the United States, China, Singapore, and internationally. The company engages in the design and manufacturing of equipment, including IC packaging machines and bumping products, wafer cutting and cleaning machines, and board cutting and cleaning machines; and te… Read more