ThinTech Materials Technology Co Ltd (3663) - Total Liabilities

Latest as of June 2025: NT$1.83 Billion TWD ≈ $57.74 Million USD

Based on the latest financial reports, ThinTech Materials Technology Co Ltd (3663) has total liabilities worth NT$1.83 Billion TWD (≈ $57.74 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore cash efficiency ratio of ThinTech Materials Technology Co Ltd to assess how effectively this company generates cash.

ThinTech Materials Technology Co Ltd - Total Liabilities Trend (2017–2024)

This chart illustrates how ThinTech Materials Technology Co Ltd's total liabilities have evolved over time, based on quarterly financial data. Check financial resilience of ThinTech Materials Technology Co Ltd to evaluate the company's liquid asset resilience ratio.

ThinTech Materials Technology Co Ltd Competitors by Total Liabilities

The table below lists competitors of ThinTech Materials Technology Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
RGC Resources Inc
NASDAQ:RGCO
USA $224.61 Million
E-Lead Electronic Co Ltd
TW:2497
Taiwan NT$1.98 Billion
Copper Fox Metals Inc.
V:CUU
Canada CA$1.22 Million
STP&I Public Company Limited
BK:STPI
Thailand ฿5.97 Billion
Zalaris ASA
OL:ZAL
Norway Nkr1.01 Billion
Dogus Gayrimenkul Yatirim Ortakligi AS
IS:DGGYO
Turkey TL5.82 Billion
Appen Ltd
AU:APX
Australia AU$57.90 Million

Liability Composition Analysis (2017–2024)

This chart breaks down ThinTech Materials Technology Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 3663 market cap overview.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.48 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.08 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.46 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how ThinTech Materials Technology Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for ThinTech Materials Technology Co Ltd (2017–2024)

The table below shows the annual total liabilities of ThinTech Materials Technology Co Ltd from 2017 to 2024.

Year Total Liabilities Change
2024-12-31 NT$1.92 Billion
≈ $60.43 Million
+205.54%
2023-12-31 NT$627.79 Million
≈ $19.78 Million
-1.53%
2022-12-31 NT$637.57 Million
≈ $20.09 Million
+24.49%
2021-12-31 NT$512.13 Million
≈ $16.13 Million
-14.54%
2020-12-31 NT$599.24 Million
≈ $18.88 Million
+18.22%
2019-12-31 NT$506.88 Million
≈ $15.97 Million
+3.77%
2018-12-31 NT$488.45 Million
≈ $15.39 Million
+220.07%
2017-12-31 NT$152.61 Million
≈ $4.81 Million
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About ThinTech Materials Technology Co Ltd

TWO:3663 Taiwan Metal Fabrication
Market Cap
$226.97 Million
NT$7.20 Billion TWD
Market Cap Rank
#16065 Global
#747 in Taiwan
Share Price
NT$66.40
Change (1 day)
+0.15%
52-Week Range
NT$40.35 - NT$77.40
All Time High
NT$110.50
About

ThinTech Materials Technology Co., Ltd. designs, manufactures, and sells alloys and optoelectronics materials in Taiwan and internationally. The company offers sputtering targets for flat panel display planar, optical data storage, decorative and functional coating, passive component, optical element, semi-conductive, flat panel display rotary, and nickel alloy c-hook for coil wire pickling; and … Read more