Inari Amertron Bhd - Asset Resilience Ratio

Inari Amertron Berhad engages in the provision of electronic manufacturing, outsourced semiconductor assembly, and testing services for radio frequency, fiber-optics transceivers, optoelectronics, memory modules, sensors, and custom integrated circuit (IC) technologies. The company offers wafer processing services covering bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection; and chip fabrication and wafer certification in fiber optic chips, such as wafer scribe and cleave, bar aligning, demount-load fixtures and facet coating, and chip on carrier. It also provides advanced system in package assembly and test services, including fine-pitch surface mount technology, high speed and accuracy flip-chip dice placement, in-line post vision, molding underfill, and post-mold oxide plating and final testing; stacked dice for memory modules; and other services, such as new product introduction services, failure analysis lab, sensor and IC package design and characterization, process customization and assembly, product testing, box build, and direct-to-end-customer dropship services. In addition, the company manufactures, assembles, and tests optoelectronic and sensor components, modules, and systems; information technology consulting, data processing, and information technology related services. Further, it manufactures electronics optical fiber and optoelectronics devices, communication chips, and die preparations and testing; designs, develops, and manufactures fiber optic products; designs, assembles, and supplies semiconductor manufacturing process tools, as well as customized semiconductor process tools and parts; and invests in properties. It operates in Malaysia, Singapore, China, the United States, Hong Kong, and internationally. Inari Amertron Berhad was founded in 2006 and is based in Petaling Jaya, Malaysia.