Unisem M Bhd - Asset Resilience Ratio
Unisem M Bhd (5005) has an Asset Resilience Ratio of 6.17% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See working capital to net assets of Unisem M Bhd to evaluate short-term liquidity relative to the company's equity base.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2012–2024)
This chart shows how Unisem M Bhd's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see 5005 current and non-current assets.
Liquid Assets Composition Over Time
This chart breaks down Unisem M Bhd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Read 5005 total liabilities for a breakdown of total debt and financial obligations.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | RM188.48 Million | 6.17% |
| Short-term Investments | RM0.00 | 0% |
| Total Liquid Assets | RM188.48 Million | 6.17% |
Asset Resilience Insights
- Limited Liquidity: Unisem M Bhd maintains only 6.17% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company primarily holds liquidity in cash and equivalents rather than short-term investments.
Unisem M Bhd Industry Peers by Asset Resilience Ratio
Compare Unisem M Bhd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Goke Microelectronics Co Ltd
SHE:300672 |
Semiconductors | 27.13% |
|
SK Hynix Inc. American Depositary Shares
NASDAQ:SKHY |
Semiconductors | 17.34% |
|
Sanan Optoelectronics Co Ltd
SHG:600703 |
Semiconductors | 0.04% |
|
Shanghai Fudan Microelectronics Group Co Ltd
SHG:688385 |
Semiconductors | 1.73% |
|
Taiwan Surface Mounting Technology Corp
TW:6278 |
Semiconductors | 13.65% |
|
Ningbo Kangqiang Electronics Co Ltd
SHE:002119 |
Semiconductors | 0.38% |
|
GlobalWafers Co Ltd
TWO:6488 |
Semiconductors | 20.19% |
|
Shenzhen China Micro Semicon Co. Ltd. A
SHG:688380 |
Semiconductors | 20.92% |
Annual Asset Resilience Ratio for Unisem M Bhd (2012–2024)
The table below shows the annual Asset Resilience Ratio data for Unisem M Bhd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 2.86% | RM82.64 Million ≈ $20.75 Million |
RM2.89 Billion ≈ $725.94 Million |
-9.02pp |
| 2023-12-31 | 11.88% | RM354.80 Million ≈ $89.08 Million |
RM2.99 Billion ≈ $750.13 Million |
-18.47pp |
| 2022-12-31 | 30.34% | RM915.94 Million ≈ $229.96 Million |
RM3.02 Billion ≈ $757.92 Million |
+15.22pp |
| 2021-12-31 | 15.12% | RM420.83 Million ≈ $105.66 Million |
RM2.78 Billion ≈ $698.71 Million |
-4.50pp |
| 2020-12-31 | 19.62% | RM445.74 Million ≈ $111.91 Million |
RM2.27 Billion ≈ $570.31 Million |
+8.19pp |
| 2019-12-31 | 11.43% | RM202.65 Million ≈ $50.88 Million |
RM1.77 Billion ≈ $445.01 Million |
+5.59pp |
| 2018-12-31 | 5.84% | RM105.32 Million ≈ $26.44 Million |
RM1.80 Billion ≈ $452.82 Million |
-2.85pp |
| 2017-12-31 | 8.69% | RM160.35 Million ≈ $40.26 Million |
RM1.85 Billion ≈ $463.23 Million |
+0.09pp |
| 2016-12-31 | 8.60% | RM153.62 Million ≈ $38.57 Million |
RM1.79 Billion ≈ $448.45 Million |
+5.80pp |
| 2015-12-31 | 2.80% | RM47.34 Million ≈ $11.89 Million |
RM1.69 Billion ≈ $424.49 Million |
+2.60pp |
| 2014-12-31 | 0.20% | RM3.00 Million ≈ $753.20K |
RM1.48 Billion ≈ $372.58 Million |
+0.01pp |
| 2013-12-31 | 0.19% | RM3.00 Million ≈ $753.20K |
RM1.57 Billion ≈ $394.88 Million |
+0.02pp |
| 2012-12-31 | 0.17% | RM3.00 Million ≈ $753.20K |
RM1.78 Billion ≈ $446.44 Million |
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About Unisem M Bhd
Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more