Unisem M Bhd - Asset Resilience Ratio

Latest as of September 2025: 6.17%

Unisem M Bhd (5005) has an Asset Resilience Ratio of 6.17% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.

Liquid Assets

RM188.48 Million
≈ $47.32 Million USD Cash + Short-term Investments

Total Assets

RM3.06 Billion
≈ $767.44 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2012–2024)

This chart shows how Unisem M Bhd's Asset Resilience Ratio has changed over time. Check Unisem M Bhd (5005) strategic asset index to assess the company's strategic physical and investment asset allocation.

Liquid Assets Composition Over Time

This chart breaks down Unisem M Bhd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see how much is Unisem M Bhd worth.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents RM188.48 Million 6.17%
Short-term Investments RM0.00 0%
Total Liquid Assets RM188.48 Million 6.17%

Asset Resilience Insights

  • Limited Liquidity: Unisem M Bhd maintains only 6.17% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company primarily holds liquidity in cash and equivalents rather than short-term investments.

Unisem M Bhd Industry Peers by Asset Resilience Ratio

Compare Unisem M Bhd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
SK Square Co Ltd
KO:402340
Semiconductors 1.99%
Shannon Semiconductor Technology Co Ltd
SHE:300475
Semiconductors 0.63%
Dosilicon Co Ltd
SHG:688110
Semiconductors 14.90%
Shanghai Friendess Electronics Tech
SHG:688188
Semiconductors 42.78%
Sai MicroElectronics Inc
SHE:300456
Semiconductors 0.24%
Bestechnic (Shanghai) Co. Ltd. A
SHG:688608
Semiconductors 23.81%
Motorcomm Electronic Technology Co. Ltd. A
SHG:688515
Semiconductors 24.81%
Suzhou Oriental Semiconductor Co. Ltd. A
SHG:688261
Semiconductors 34.42%

Annual Asset Resilience Ratio for Unisem M Bhd (2012–2024)

The table below shows the annual Asset Resilience Ratio data for Unisem M Bhd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 2.86% RM82.64 Million
≈ $20.75 Million
RM2.89 Billion
≈ $725.94 Million
-9.02pp
2023-12-31 11.88% RM354.80 Million
≈ $89.08 Million
RM2.99 Billion
≈ $750.13 Million
-18.47pp
2022-12-31 30.34% RM915.94 Million
≈ $229.96 Million
RM3.02 Billion
≈ $757.92 Million
+15.22pp
2021-12-31 15.12% RM420.83 Million
≈ $105.66 Million
RM2.78 Billion
≈ $698.71 Million
-4.50pp
2020-12-31 19.62% RM445.74 Million
≈ $111.91 Million
RM2.27 Billion
≈ $570.31 Million
+8.19pp
2019-12-31 11.43% RM202.65 Million
≈ $50.88 Million
RM1.77 Billion
≈ $445.01 Million
+5.59pp
2018-12-31 5.84% RM105.32 Million
≈ $26.44 Million
RM1.80 Billion
≈ $452.82 Million
-2.85pp
2017-12-31 8.69% RM160.35 Million
≈ $40.26 Million
RM1.85 Billion
≈ $463.23 Million
+0.09pp
2016-12-31 8.60% RM153.62 Million
≈ $38.57 Million
RM1.79 Billion
≈ $448.45 Million
+5.80pp
2015-12-31 2.80% RM47.34 Million
≈ $11.89 Million
RM1.69 Billion
≈ $424.49 Million
+2.60pp
2014-12-31 0.20% RM3.00 Million
≈ $753.20K
RM1.48 Billion
≈ $372.58 Million
+0.01pp
2013-12-31 0.19% RM3.00 Million
≈ $753.20K
RM1.57 Billion
≈ $394.88 Million
+0.02pp
2012-12-31 0.17% RM3.00 Million
≈ $753.20K
RM1.78 Billion
≈ $446.44 Million
--
pp = percentage points

About Unisem M Bhd

KLSE:5005 Malaysia Semiconductors
Market Cap
$1.84 Billion
RM7.32 Billion MYR
Market Cap Rank
#6390 Global
#55 in Malaysia
Share Price
RM4.54
Change (1 day)
-0.44%
52-Week Range
RM2.32 - RM5.30
All Time High
RM5.30
About

Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more