Unisem M Bhd - Asset Resilience Ratio
Unisem M Bhd (5005) has an Asset Resilience Ratio of 6.17% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check how strategically is Unisem M Bhd's equity deployed to assess the company's strategic physical and investment asset allocation.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2012–2024)
This chart shows how Unisem M Bhd's Asset Resilience Ratio has changed over time. See 5005 equity financing ratio to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Unisem M Bhd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 5005 stock market capitalisation.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | RM188.48 Million | 6.17% |
| Short-term Investments | RM0.00 | 0% |
| Total Liquid Assets | RM188.48 Million | 6.17% |
Asset Resilience Insights
- Limited Liquidity: Unisem M Bhd maintains only 6.17% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company primarily holds liquidity in cash and equivalents rather than short-term investments.
Unisem M Bhd Industry Peers by Asset Resilience Ratio
Compare Unisem M Bhd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Sitime Corporation
NASDAQ:SITM |
Semiconductors | 22.45% |
|
Ingenic Semiconductor
SHE:300223 |
Semiconductors | 11.50% |
|
Dosilicon Co Ltd
SHG:688110 |
Semiconductors | 14.90% |
|
SmartSens Technology (Shanghai) Co. Ltd. A
SHG:688213 |
Semiconductors | 0.56% |
|
Shanghai Fullhan Microelectronics Co Ltd
SHE:300613 |
Semiconductors | 6.54% |
|
Zbit Semiconductor Inc. A
SHG:688416 |
Semiconductors | 27.75% |
|
Suzhou Oriental Semiconductor Co. Ltd. A
SHG:688261 |
Semiconductors | 34.42% |
|
SILEX Systems Ltd
AU:SLX |
Semiconductors | 62.86% |
Annual Asset Resilience Ratio for Unisem M Bhd (2012–2024)
The table below shows the annual Asset Resilience Ratio data for Unisem M Bhd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 2.86% | RM82.64 Million ≈ $20.75 Million |
RM2.89 Billion ≈ $725.94 Million |
-9.02pp |
| 2023-12-31 | 11.88% | RM354.80 Million ≈ $89.08 Million |
RM2.99 Billion ≈ $750.13 Million |
-18.47pp |
| 2022-12-31 | 30.34% | RM915.94 Million ≈ $229.96 Million |
RM3.02 Billion ≈ $757.92 Million |
+15.22pp |
| 2021-12-31 | 15.12% | RM420.83 Million ≈ $105.66 Million |
RM2.78 Billion ≈ $698.71 Million |
-4.50pp |
| 2020-12-31 | 19.62% | RM445.74 Million ≈ $111.91 Million |
RM2.27 Billion ≈ $570.31 Million |
+8.19pp |
| 2019-12-31 | 11.43% | RM202.65 Million ≈ $50.88 Million |
RM1.77 Billion ≈ $445.01 Million |
+5.59pp |
| 2018-12-31 | 5.84% | RM105.32 Million ≈ $26.44 Million |
RM1.80 Billion ≈ $452.82 Million |
-2.85pp |
| 2017-12-31 | 8.69% | RM160.35 Million ≈ $40.26 Million |
RM1.85 Billion ≈ $463.23 Million |
+0.09pp |
| 2016-12-31 | 8.60% | RM153.62 Million ≈ $38.57 Million |
RM1.79 Billion ≈ $448.45 Million |
+5.80pp |
| 2015-12-31 | 2.80% | RM47.34 Million ≈ $11.89 Million |
RM1.69 Billion ≈ $424.49 Million |
+2.60pp |
| 2014-12-31 | 0.20% | RM3.00 Million ≈ $753.20K |
RM1.48 Billion ≈ $372.58 Million |
+0.01pp |
| 2013-12-31 | 0.19% | RM3.00 Million ≈ $753.20K |
RM1.57 Billion ≈ $394.88 Million |
+0.02pp |
| 2012-12-31 | 0.17% | RM3.00 Million ≈ $753.20K |
RM1.78 Billion ≈ $446.44 Million |
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About Unisem M Bhd
Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more