Unisem M Bhd (5005) - Cash Flow Conversion Efficiency

Latest as of September 2025: 0.042x

Based on the latest financial reports, Unisem M Bhd (5005) has a cash flow conversion efficiency ratio of 0.042x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (RM89.63 Million ≈ $22.50 Million USD) by net assets (RM2.14 Billion ≈ $537.53 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See Unisem M Bhd (5005) net asset quality to measure how much of total assets are equity-financed.

Unisem M Bhd - Cash Flow Conversion Efficiency Trend (2006–2024)

This chart illustrates how Unisem M Bhd's cash flow conversion efficiency has evolved over time, based on yearly financial data. Check Unisem M Bhd cash flow quality index to evaluate the quality of earnings relative to operating cash generation.

Unisem M Bhd Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Unisem M Bhd ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Ocular Therapeutix Inc
NASDAQ:OCUL
-0.113x
Shanghai Awinic Technology Co Ltd
SHG:688798
0.068x
HUTCHMED (China) Limited
F:H7T1
-0.071x
Diamond Power Infrastructure Limited
NSE:DIACABS
0.340x
Generate Biomedicines, Inc. Common Stock
NASDAQ:GENB
-0.156x
Longshine Technology Co Ltd
SHE:300682
0.021x
Jiangsu Cnano Technology Co Ltd
SHG:688116
0.024x
Anyuan Coal Industry Group Co Ltd
SHG:600397
-0.011x

Annual Cash Flow Conversion Efficiency for Unisem M Bhd (2006–2024)

The table below shows the annual cash flow conversion efficiency of Unisem M Bhd from 2006 to 2024. For the full company profile with market capitalisation and key ratios, see Unisem M Bhd (5005) market capitalisation.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2024-12-31 RM2.25 Billion
≈ $564.30 Million
RM262.61 Million
≈ $65.93 Million
0.117x -23.44%
2023-12-31 RM2.39 Billion
≈ $598.84 Million
RM364.01 Million
≈ $91.39 Million
0.153x -8.82%
2022-12-31 RM2.42 Billion
≈ $606.68 Million
RM404.46 Million
≈ $101.55 Million
0.167x +7.40%
2021-12-31 RM2.17 Billion
≈ $543.84 Million
RM337.58 Million
≈ $84.76 Million
0.156x -6.59%
2020-12-31 RM1.77 Billion
≈ $445.09 Million
RM295.77 Million
≈ $74.26 Million
0.167x +40.50%
2019-12-31 RM1.36 Billion
≈ $340.26 Million
RM160.93 Million
≈ $40.40 Million
0.119x -27.96%
2018-12-31 RM1.44 Billion
≈ $361.07 Million
RM237.05 Million
≈ $59.51 Million
0.165x -28.87%
2017-12-31 RM1.46 Billion
≈ $367.25 Million
RM338.95 Million
≈ $85.10 Million
0.232x -6.19%
2016-12-31 RM1.42 Billion
≈ $356.27 Million
RM350.51 Million
≈ $88.00 Million
0.247x +1.94%
2015-12-31 RM1.36 Billion
≈ $340.48 Million
RM328.60 Million
≈ $82.50 Million
0.242x +12.35%
2014-12-31 RM1.03 Billion
≈ $259.14 Million
RM222.61 Million
≈ $55.89 Million
0.216x -1.51%
2013-12-31 RM968.14 Million
≈ $243.07 Million
RM212.00 Million
≈ $53.23 Million
0.219x +33.04%
2012-12-31 RM1.04 Billion
≈ $260.98 Million
RM171.09 Million
≈ $42.96 Million
0.165x -19.27%
2011-12-31 RM1.10 Billion
≈ $276.62 Million
RM224.65 Million
≈ $56.40 Million
0.204x -18.05%
2010-12-31 RM1.07 Billion
≈ $269.28 Million
RM266.85 Million
≈ $67.00 Million
0.249x +1.56%
2009-12-31 RM961.56 Million
≈ $241.42 Million
RM235.55 Million
≈ $59.14 Million
0.245x -12.70%
2008-12-31 RM848.84 Million
≈ $213.12 Million
RM238.17 Million
≈ $59.80 Million
0.281x +9.00%
2007-12-31 RM822.92 Million
≈ $206.61 Million
RM211.83 Million
≈ $53.18 Million
0.257x +34.42%
2006-12-31 RM744.16 Million
≈ $186.83 Million
RM142.50 Million
≈ $35.78 Million
0.191x --

About Unisem M Bhd

KLSE:5005 Malaysia Semiconductors
Market Cap
$1.84 Billion
RM7.32 Billion MYR
Market Cap Rank
#6390 Global
#55 in Malaysia
Share Price
RM4.54
Change (1 day)
-0.44%
52-Week Range
RM2.32 - RM5.30
All Time High
RM5.30
About

Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more