Unisem M Bhd (5005) - Cash Flow Conversion Efficiency
Based on the latest financial reports, Unisem M Bhd (5005) has a cash flow conversion efficiency ratio of 0.042x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (RM89.63 Million ≈ $22.50 Million USD) by net assets (RM2.14 Billion ≈ $537.53 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. Also see Unisem M Bhd market cap and net worth for the company's overall valuation and market capitalisation.
Unisem M Bhd - Cash Flow Conversion Efficiency Trend (2006–2024)
This chart illustrates how Unisem M Bhd's cash flow conversion efficiency has evolved over time, based on yearly financial data.
Unisem M Bhd Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of Unisem M Bhd ranked by their cash flow conversion efficiency. Explore Unisem M Bhd cash flow quality index to measure how well operating cash flow supports reported net income.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
LeMaitre Vascular Inc
NASDAQ:LMAT
|
0.037x |
|
Grupo Gigante S. A. B. de C. V
MX:GIGANTE
|
0.046x |
|
Outokumpu Oyj
HE:OUT1V
|
0.015x |
|
Mercuries Life Insurance Co Ltd
TW:2867
|
-0.072x |
|
SmartStop Self Storage REIT, Inc.
NYSE:SMA
|
0.019x |
|
Suzhou Douson Drilling & Production Equipment Co Ltd
SHG:603800
|
-0.049x |
|
Rendong Holdings Co Ltd
SHE:002647
|
0.057x |
|
Bank of Zhengzhou Co Ltd Class A
SHE:002936
|
-0.063x |
Annual Cash Flow Conversion Efficiency for Unisem M Bhd (2006–2024)
The table below shows the annual cash flow conversion efficiency of Unisem M Bhd from 2006 to 2024. View current stock price of Unisem M Bhd for real-time trading data and today's change.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2024-12-31 | RM2.25 Billion ≈ $564.30 Million |
RM262.61 Million ≈ $65.93 Million |
0.117x | -23.44% |
| 2023-12-31 | RM2.39 Billion ≈ $598.84 Million |
RM364.01 Million ≈ $91.39 Million |
0.153x | -8.82% |
| 2022-12-31 | RM2.42 Billion ≈ $606.68 Million |
RM404.46 Million ≈ $101.55 Million |
0.167x | +7.40% |
| 2021-12-31 | RM2.17 Billion ≈ $543.84 Million |
RM337.58 Million ≈ $84.76 Million |
0.156x | -6.59% |
| 2020-12-31 | RM1.77 Billion ≈ $445.09 Million |
RM295.77 Million ≈ $74.26 Million |
0.167x | +40.50% |
| 2019-12-31 | RM1.36 Billion ≈ $340.26 Million |
RM160.93 Million ≈ $40.40 Million |
0.119x | -27.96% |
| 2018-12-31 | RM1.44 Billion ≈ $361.07 Million |
RM237.05 Million ≈ $59.51 Million |
0.165x | -28.87% |
| 2017-12-31 | RM1.46 Billion ≈ $367.25 Million |
RM338.95 Million ≈ $85.10 Million |
0.232x | -6.19% |
| 2016-12-31 | RM1.42 Billion ≈ $356.27 Million |
RM350.51 Million ≈ $88.00 Million |
0.247x | +1.94% |
| 2015-12-31 | RM1.36 Billion ≈ $340.48 Million |
RM328.60 Million ≈ $82.50 Million |
0.242x | +12.35% |
| 2014-12-31 | RM1.03 Billion ≈ $259.14 Million |
RM222.61 Million ≈ $55.89 Million |
0.216x | -1.51% |
| 2013-12-31 | RM968.14 Million ≈ $243.07 Million |
RM212.00 Million ≈ $53.23 Million |
0.219x | +33.04% |
| 2012-12-31 | RM1.04 Billion ≈ $260.98 Million |
RM171.09 Million ≈ $42.96 Million |
0.165x | -19.27% |
| 2011-12-31 | RM1.10 Billion ≈ $276.62 Million |
RM224.65 Million ≈ $56.40 Million |
0.204x | -18.05% |
| 2010-12-31 | RM1.07 Billion ≈ $269.28 Million |
RM266.85 Million ≈ $67.00 Million |
0.249x | +1.56% |
| 2009-12-31 | RM961.56 Million ≈ $241.42 Million |
RM235.55 Million ≈ $59.14 Million |
0.245x | -12.70% |
| 2008-12-31 | RM848.84 Million ≈ $213.12 Million |
RM238.17 Million ≈ $59.80 Million |
0.281x | +9.00% |
| 2007-12-31 | RM822.92 Million ≈ $206.61 Million |
RM211.83 Million ≈ $53.18 Million |
0.257x | +34.42% |
| 2006-12-31 | RM744.16 Million ≈ $186.83 Million |
RM142.50 Million ≈ $35.78 Million |
0.191x | -- |
About Unisem M Bhd
Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more