Unisem M Bhd (5005) - Cash Flow Conversion Efficiency
Based on the latest financial reports, Unisem M Bhd (5005) has a cash flow conversion efficiency ratio of 0.042x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (RM89.63 Million ≈ $22.50 Million USD) by net assets (RM2.14 Billion ≈ $537.53 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See 5005 cash and liquid assets coverage to measure how many days the company can operate on defensive assets alone.
Unisem M Bhd - Cash Flow Conversion Efficiency Trend (2006–2024)
This chart illustrates how Unisem M Bhd's cash flow conversion efficiency has evolved over time, based on yearly financial data.
Unisem M Bhd Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of Unisem M Bhd ranked by their cash flow conversion efficiency.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Yantai Zhenghai Magnetic Mat
SHE:300224
|
0.015x |
|
Jiugui Liquor Co Ltd
SHE:000799
|
-0.028x |
|
Dalian Zeus Entertainment
SHE:002354
|
-0.005x |
|
CIE Automotive India Limited
NSE:CIEINDIA
|
0.179x |
|
Suzhou Veichi Electric Co. Ltd. A
SHG:688698
|
-0.007x |
|
Stoke Therapeutics Inc
NASDAQ:STOK
|
-0.153x |
|
United Parks & Resorts Inc
NYSE:PRKS
|
-0.307x |
|
Liveramp Holdings Inc
NYSE:RAMP
|
0.070x |
Annual Cash Flow Conversion Efficiency for Unisem M Bhd (2006–2024)
The table below shows the annual cash flow conversion efficiency of Unisem M Bhd from 2006 to 2024. For the full company profile with market capitalisation and key ratios, see 5005 company net worth.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2024-12-31 | RM2.25 Billion ≈ $564.30 Million |
RM262.61 Million ≈ $65.93 Million |
0.117x | -23.44% |
| 2023-12-31 | RM2.39 Billion ≈ $598.84 Million |
RM364.01 Million ≈ $91.39 Million |
0.153x | -8.82% |
| 2022-12-31 | RM2.42 Billion ≈ $606.68 Million |
RM404.46 Million ≈ $101.55 Million |
0.167x | +7.40% |
| 2021-12-31 | RM2.17 Billion ≈ $543.84 Million |
RM337.58 Million ≈ $84.76 Million |
0.156x | -6.59% |
| 2020-12-31 | RM1.77 Billion ≈ $445.09 Million |
RM295.77 Million ≈ $74.26 Million |
0.167x | +40.50% |
| 2019-12-31 | RM1.36 Billion ≈ $340.26 Million |
RM160.93 Million ≈ $40.40 Million |
0.119x | -27.96% |
| 2018-12-31 | RM1.44 Billion ≈ $361.07 Million |
RM237.05 Million ≈ $59.51 Million |
0.165x | -28.87% |
| 2017-12-31 | RM1.46 Billion ≈ $367.25 Million |
RM338.95 Million ≈ $85.10 Million |
0.232x | -6.19% |
| 2016-12-31 | RM1.42 Billion ≈ $356.27 Million |
RM350.51 Million ≈ $88.00 Million |
0.247x | +1.94% |
| 2015-12-31 | RM1.36 Billion ≈ $340.48 Million |
RM328.60 Million ≈ $82.50 Million |
0.242x | +12.35% |
| 2014-12-31 | RM1.03 Billion ≈ $259.14 Million |
RM222.61 Million ≈ $55.89 Million |
0.216x | -1.51% |
| 2013-12-31 | RM968.14 Million ≈ $243.07 Million |
RM212.00 Million ≈ $53.23 Million |
0.219x | +33.04% |
| 2012-12-31 | RM1.04 Billion ≈ $260.98 Million |
RM171.09 Million ≈ $42.96 Million |
0.165x | -19.27% |
| 2011-12-31 | RM1.10 Billion ≈ $276.62 Million |
RM224.65 Million ≈ $56.40 Million |
0.204x | -18.05% |
| 2010-12-31 | RM1.07 Billion ≈ $269.28 Million |
RM266.85 Million ≈ $67.00 Million |
0.249x | +1.56% |
| 2009-12-31 | RM961.56 Million ≈ $241.42 Million |
RM235.55 Million ≈ $59.14 Million |
0.245x | -12.70% |
| 2008-12-31 | RM848.84 Million ≈ $213.12 Million |
RM238.17 Million ≈ $59.80 Million |
0.281x | +9.00% |
| 2007-12-31 | RM822.92 Million ≈ $206.61 Million |
RM211.83 Million ≈ $53.18 Million |
0.257x | +34.42% |
| 2006-12-31 | RM744.16 Million ≈ $186.83 Million |
RM142.50 Million ≈ $35.78 Million |
0.191x | -- |
About Unisem M Bhd
Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more