Unisem M Bhd (5005) - Cash Flow Conversion Efficiency
Based on the latest financial reports, Unisem M Bhd (5005) has a cash flow conversion efficiency ratio of 0.042x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (RM89.63 Million ≈ $22.50 Million USD) by net assets (RM2.14 Billion ≈ $537.53 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.
Unisem M Bhd - Cash Flow Conversion Efficiency Trend (2006–2024)
This chart illustrates how Unisem M Bhd's cash flow conversion efficiency has evolved over time, based on yearly financial data. Read Unisem M Bhd (5005) financial obligations for a breakdown of total debt and financial obligations.
Unisem M Bhd Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of Unisem M Bhd ranked by their cash flow conversion efficiency.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Daou Tech
KO:023590
|
0.125x |
|
Shenzhen Jame Technology Corp Ltd
SHE:300868
|
0.013x |
|
Reysas Gayrimenkul Yatirim Ortakligi AS
IS:RYGYO
|
0.012x |
|
CTS Corporation
NYSE:CTS
|
0.053x |
|
Petkim Petrokimya Holding AS
IS:PETKM
|
-0.036x |
|
Beijing Cuiwei Tower Co Ltd
SHG:603123
|
-0.031x |
|
Cangzhou Mingzhu Plastic Co Ltd
SHE:002108
|
-0.008x |
|
JiangSu Jin Tong Ling Fluid Mach
SHE:300091
|
-0.207x |
Annual Cash Flow Conversion Efficiency for Unisem M Bhd (2006–2024)
The table below shows the annual cash flow conversion efficiency of Unisem M Bhd from 2006 to 2024. For the full company profile with market capitalisation and key ratios, see 5005 company net worth.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2024-12-31 | RM2.25 Billion ≈ $564.30 Million |
RM262.61 Million ≈ $65.93 Million |
0.117x | -23.44% |
| 2023-12-31 | RM2.39 Billion ≈ $598.84 Million |
RM364.01 Million ≈ $91.39 Million |
0.153x | -8.82% |
| 2022-12-31 | RM2.42 Billion ≈ $606.68 Million |
RM404.46 Million ≈ $101.55 Million |
0.167x | +7.40% |
| 2021-12-31 | RM2.17 Billion ≈ $543.84 Million |
RM337.58 Million ≈ $84.76 Million |
0.156x | -6.59% |
| 2020-12-31 | RM1.77 Billion ≈ $445.09 Million |
RM295.77 Million ≈ $74.26 Million |
0.167x | +40.50% |
| 2019-12-31 | RM1.36 Billion ≈ $340.26 Million |
RM160.93 Million ≈ $40.40 Million |
0.119x | -27.96% |
| 2018-12-31 | RM1.44 Billion ≈ $361.07 Million |
RM237.05 Million ≈ $59.51 Million |
0.165x | -28.87% |
| 2017-12-31 | RM1.46 Billion ≈ $367.25 Million |
RM338.95 Million ≈ $85.10 Million |
0.232x | -6.19% |
| 2016-12-31 | RM1.42 Billion ≈ $356.27 Million |
RM350.51 Million ≈ $88.00 Million |
0.247x | +1.94% |
| 2015-12-31 | RM1.36 Billion ≈ $340.48 Million |
RM328.60 Million ≈ $82.50 Million |
0.242x | +12.35% |
| 2014-12-31 | RM1.03 Billion ≈ $259.14 Million |
RM222.61 Million ≈ $55.89 Million |
0.216x | -1.51% |
| 2013-12-31 | RM968.14 Million ≈ $243.07 Million |
RM212.00 Million ≈ $53.23 Million |
0.219x | +33.04% |
| 2012-12-31 | RM1.04 Billion ≈ $260.98 Million |
RM171.09 Million ≈ $42.96 Million |
0.165x | -19.27% |
| 2011-12-31 | RM1.10 Billion ≈ $276.62 Million |
RM224.65 Million ≈ $56.40 Million |
0.204x | -18.05% |
| 2010-12-31 | RM1.07 Billion ≈ $269.28 Million |
RM266.85 Million ≈ $67.00 Million |
0.249x | +1.56% |
| 2009-12-31 | RM961.56 Million ≈ $241.42 Million |
RM235.55 Million ≈ $59.14 Million |
0.245x | -12.70% |
| 2008-12-31 | RM848.84 Million ≈ $213.12 Million |
RM238.17 Million ≈ $59.80 Million |
0.281x | +9.00% |
| 2007-12-31 | RM822.92 Million ≈ $206.61 Million |
RM211.83 Million ≈ $53.18 Million |
0.257x | +34.42% |
| 2006-12-31 | RM744.16 Million ≈ $186.83 Million |
RM142.50 Million ≈ $35.78 Million |
0.191x | -- |
About Unisem M Bhd
Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services for electronic companies in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip s… Read more