Winbond Electronics Corp - Asset Resilience Ratio

Winbond Electronics Corporation engages in the design, development, manufacture, and marketing of very large scale integration integrated circuits (ICs) for various microelectronic applications in Asia, the Americas, Europe, and internationally. It operates through DRAM IC Product, Flash Memory Product, and Logic IC Product segments. The company offers Mobile Dynamic Random Access Memory (DRAM) devices, including pseudo static random access memory, HyperRAM, low power single access synchronous dynamic random access memory (SDRAM), low power double-data-rate (DDR) SDRAM, and known good die (KGD) products, as well as low power DDR1, DD2, DDR3, and DDR4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM products; code storage flash memory products comprising serial NOR, QspiNAND, OctalNAND, SLC NAND, SpiStack, and authentication flash products, as well as NAND based MCP products; TrustME secure flash memory products; and logic IC products. In addition, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6-inch wafer products; electronic commerce; provision of test, OEM, and computer software services, as well as testing, and consulting services; and wholesale business for computer, supplements, and software, as well as project sale. It markets its products through distributors and online. The company's products are used in computer, communication, consumer, automotive, and industrial electronics. Winbond Electronics Corporation was incorporated in 1987 and is headquartered in Taichung, Taiwan.