Winbond Electronics Corp - Asset Resilience Ratio
Winbond Electronics Corp (2344) has an Asset Resilience Ratio of 15.43% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2000–2025)
This chart shows how Winbond Electronics Corp's Asset Resilience Ratio has changed over time. Check asset allocation strategy of Winbond Electronics Corp to assess the company's strategic physical and investment asset allocation.
Liquid Assets Composition Over Time
This chart breaks down Winbond Electronics Corp's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 2344 market cap.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$35.47 Billion | 15.43% |
| Total Liquid Assets | NT$35.47 Billion | 15.43% |
Asset Resilience Insights
- Good Liquidity Position: Winbond Electronics Corp maintains a healthy 15.43% of assets in liquid form.
- This level provides good financial flexibility while maintaining productive asset deployment.
- The company has significant short-term investments, indicating active treasury management.
Winbond Electronics Corp Industry Peers by Asset Resilience Ratio
Compare Winbond Electronics Corp's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
GlobalWafers Co Ltd
TWO:6488 |
Semiconductors | 20.19% |
|
Amlogic Shanghai Co Ltd
SHG:688099 |
Semiconductors | 5.29% |
|
Nexchip Semiconductor Corp. A
SHG:688249 |
Semiconductors | 3.07% |
|
Union Semiconductor (Hefei) Co. Ltd. A
SHG:688403 |
Semiconductors | 7.45% |
|
Melexis NV
BR:MELE |
Semiconductors | 0.04% |
|
Goke Microelectronics Co Ltd
SHE:300672 |
Semiconductors | 27.13% |
|
Bestechnic (Shanghai) Co. Ltd. A
SHG:688608 |
Semiconductors | 23.81% |
|
Nations Technologies Inc
SHE:300077 |
Semiconductors | 2.23% |
Annual Asset Resilience Ratio for Winbond Electronics Corp (2000–2025)
The table below shows the annual Asset Resilience Ratio data for Winbond Electronics Corp.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 6.94% | NT$13.35 Billion ≈ $420.50 Million |
NT$192.19 Billion ≈ $6.06 Billion |
+2.15pp |
| 2024-12-31 | 4.79% | NT$8.52 Billion ≈ $268.43 Million |
NT$177.78 Billion ≈ $5.60 Billion |
-2.11pp |
| 2023-12-31 | 6.90% | NT$13.17 Billion ≈ $414.90 Million |
NT$190.79 Billion ≈ $6.01 Billion |
-1.14pp |
| 2022-12-31 | 8.04% | NT$14.81 Billion ≈ $466.64 Million |
NT$184.16 Billion ≈ $5.80 Billion |
+0.71pp |
| 2021-12-31 | 7.33% | NT$11.19 Billion ≈ $352.66 Million |
NT$152.74 Billion ≈ $4.81 Billion |
+0.28pp |
| 2020-12-31 | 7.05% | NT$8.89 Billion ≈ $280.05 Million |
NT$126.04 Billion ≈ $3.97 Billion |
+0.09pp |
| 2019-12-31 | 6.97% | NT$7.30 Billion ≈ $230.02 Million |
NT$104.80 Billion ≈ $3.30 Billion |
+0.45pp |
| 2018-12-31 | 6.52% | NT$6.26 Billion ≈ $197.15 Million |
NT$96.04 Billion ≈ $3.03 Billion |
-0.90pp |
| 2017-12-31 | 7.42% | NT$6.54 Billion ≈ $205.90 Million |
NT$88.12 Billion ≈ $2.78 Billion |
+0.81pp |
| 2016-12-31 | 6.61% | NT$4.49 Billion ≈ $141.54 Million |
NT$67.99 Billion ≈ $2.14 Billion |
+2.45pp |
| 2015-12-31 | 4.15% | NT$2.60 Billion ≈ $81.93 Million |
NT$62.60 Billion ≈ $1.97 Billion |
-0.32pp |
| 2014-12-31 | 4.47% | NT$2.90 Billion ≈ $91.45 Million |
NT$64.89 Billion ≈ $2.04 Billion |
+1.26pp |
| 2013-12-31 | 3.22% | NT$1.79 Billion ≈ $56.40 Million |
NT$55.68 Billion ≈ $1.75 Billion |
+1.53pp |
| 2012-12-31 | 1.68% | NT$946.98 Million ≈ $29.84 Million |
NT$56.22 Billion ≈ $1.77 Billion |
-0.03pp |
| 2011-12-31 | 1.72% | NT$1.05 Billion ≈ $32.94 Million |
NT$60.92 Billion ≈ $1.92 Billion |
-1.25pp |
| 2010-12-31 | 2.97% | NT$1.98 Billion ≈ $62.28 Million |
NT$66.58 Billion ≈ $2.10 Billion |
-0.55pp |
| 2009-12-31 | 3.52% | NT$2.37 Billion ≈ $74.81 Million |
NT$67.44 Billion ≈ $2.12 Billion |
+0.51pp |
| 2008-12-31 | 3.02% | NT$2.28 Billion ≈ $71.83 Million |
NT$75.61 Billion ≈ $2.38 Billion |
+2.09pp |
| 2007-12-31 | 0.93% | NT$886.70 Million ≈ $27.94 Million |
NT$95.44 Billion ≈ $3.01 Billion |
+0.62pp |
| 2006-12-31 | 0.31% | NT$288.04 Million ≈ $9.07 Million |
NT$93.00 Billion ≈ $2.93 Billion |
-0.68pp |
| 2005-12-31 | 0.99% | NT$807.96 Million ≈ $25.46 Million |
NT$81.81 Billion ≈ $2.58 Billion |
-1.24pp |
| 2004-12-31 | 2.23% | NT$1.48 Billion ≈ $46.53 Million |
NT$66.37 Billion ≈ $2.09 Billion |
-1.25pp |
| 2003-12-31 | 3.48% | NT$2.47 Billion ≈ $77.97 Million |
NT$71.19 Billion ≈ $2.24 Billion |
+2.29pp |
| 2002-12-31 | 1.19% | NT$910.26 Million ≈ $28.68 Million |
NT$76.77 Billion ≈ $2.42 Billion |
-12.40pp |
| 2001-12-31 | 13.59% | NT$12.49 Billion ≈ $393.56 Million |
NT$91.93 Billion ≈ $2.90 Billion |
+5.14pp |
| 2000-12-31 | 8.45% | NT$8.90 Billion ≈ $280.50 Million |
NT$105.40 Billion ≈ $3.32 Billion |
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About Winbond Electronics Corp
Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other ser… Read more