Winbond Electronics Corp Asset Resilience Ratio
Winbond Electronics Corp asset resilience ratio. Winbond Electronics Corp (2344) has an Asset Resilience Ratio of 13.01% as of June 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Winbond Electronics Corp (2344) liquidity interval to measure how many days the company can operate on defensive assets alone.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio of Winbond Electronics Corp (2000–2025)
Asset resilience ratio of Winbond Electronics Corp from 2000 to 2025. This chart shows how Winbond Electronics Corp's Asset Resilience Ratio has changed over time. Read Winbond Electronics Corp total liabilities for a breakdown of total debt and financial obligations.
Liquid Assets Composition Over Time
This chart breaks down Winbond Electronics Corp's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see balance sheet size of Winbond Electronics Corp.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$38.12 Billion | 13.01% |
| Total Liquid Assets | NT$38.12 Billion | 13.01% |
Asset Resilience Insights
- Moderate Liquidity: Winbond Electronics Corp has 13.01% of assets in liquid form.
- While adequate for normal operations, this level may limit flexibility during economic stress.
- The company has significant short-term investments, indicating active treasury management.
Winbond Electronics Corp Industry Peers by Asset Resilience Ratio
Compare Winbond Electronics Corp's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
SK Square Co Ltd
KO:402340 |
Semiconductors | 1.99% |
|
United Microelectronics
NYSE:UMC |
Semiconductors | 4.21% |
|
Realtek Semiconductor Corp
TW:2379 |
Semiconductors | 38.13% |
|
Maxscend Microelectronics Co Ltd
SHE:300782 |
Semiconductors | 0.01% |
|
FADU Inc.
KQ:440110 |
Semiconductors | 0.47% |
|
Motorcomm Electronic Technology Co. Ltd. A
SHG:688515 |
Semiconductors | 24.81% |
|
Actions Technology Co Ltd
SHG:688049 |
Semiconductors | 18.63% |
|
Wuxi Chipown Micro-electronics Ltd
SHG:688508 |
Semiconductors | 57.54% |
Winbond Electronics Corp Asset Resilience Ratio by Year (2000–2025)
Winbond Electronics Corp asset resilience ratio by year from 2000 to 2025. The table below shows the annual Asset Resilience Ratio data for Winbond Electronics Corp.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 6.94% | NT$13.35 Billion ≈ $420.50 Million |
NT$192.19 Billion ≈ $6.06 Billion |
+2.15pp |
| 2024-12-31 | 4.79% | NT$8.52 Billion ≈ $268.43 Million |
NT$177.78 Billion ≈ $5.60 Billion |
-2.11pp |
| 2023-12-31 | 6.90% | NT$13.17 Billion ≈ $414.90 Million |
NT$190.79 Billion ≈ $6.01 Billion |
-1.14pp |
| 2022-12-31 | 8.04% | NT$14.81 Billion ≈ $466.64 Million |
NT$184.16 Billion ≈ $5.80 Billion |
+0.71pp |
| 2021-12-31 | 7.33% | NT$11.19 Billion ≈ $352.66 Million |
NT$152.74 Billion ≈ $4.81 Billion |
+0.28pp |
| 2020-12-31 | 7.05% | NT$8.89 Billion ≈ $280.05 Million |
NT$126.04 Billion ≈ $3.97 Billion |
+0.09pp |
| 2019-12-31 | 6.97% | NT$7.30 Billion ≈ $230.02 Million |
NT$104.80 Billion ≈ $3.30 Billion |
+0.45pp |
| 2018-12-31 | 6.52% | NT$6.26 Billion ≈ $197.15 Million |
NT$96.04 Billion ≈ $3.03 Billion |
-0.90pp |
| 2017-12-31 | 7.42% | NT$6.54 Billion ≈ $205.90 Million |
NT$88.12 Billion ≈ $2.78 Billion |
+0.81pp |
| 2016-12-31 | 6.61% | NT$4.49 Billion ≈ $141.54 Million |
NT$67.99 Billion ≈ $2.14 Billion |
+2.45pp |
| 2015-12-31 | 4.15% | NT$2.60 Billion ≈ $81.93 Million |
NT$62.60 Billion ≈ $1.97 Billion |
-0.32pp |
| 2014-12-31 | 4.47% | NT$2.90 Billion ≈ $91.45 Million |
NT$64.89 Billion ≈ $2.04 Billion |
+1.26pp |
| 2013-12-31 | 3.22% | NT$1.79 Billion ≈ $56.40 Million |
NT$55.68 Billion ≈ $1.75 Billion |
+1.53pp |
| 2012-12-31 | 1.68% | NT$946.98 Million ≈ $29.84 Million |
NT$56.22 Billion ≈ $1.77 Billion |
-0.03pp |
| 2011-12-31 | 1.72% | NT$1.05 Billion ≈ $32.94 Million |
NT$60.92 Billion ≈ $1.92 Billion |
-1.25pp |
| 2010-12-31 | 2.97% | NT$1.98 Billion ≈ $62.28 Million |
NT$66.58 Billion ≈ $2.10 Billion |
-0.55pp |
| 2009-12-31 | 3.52% | NT$2.37 Billion ≈ $74.81 Million |
NT$67.44 Billion ≈ $2.12 Billion |
+0.51pp |
| 2008-12-31 | 3.02% | NT$2.28 Billion ≈ $71.83 Million |
NT$75.61 Billion ≈ $2.38 Billion |
+2.09pp |
| 2007-12-31 | 0.93% | NT$886.70 Million ≈ $27.94 Million |
NT$95.44 Billion ≈ $3.01 Billion |
+0.62pp |
| 2006-12-31 | 0.31% | NT$288.04 Million ≈ $9.07 Million |
NT$93.00 Billion ≈ $2.93 Billion |
-0.68pp |
| 2005-12-31 | 0.99% | NT$807.96 Million ≈ $25.46 Million |
NT$81.81 Billion ≈ $2.58 Billion |
-1.24pp |
| 2004-12-31 | 2.23% | NT$1.48 Billion ≈ $46.53 Million |
NT$66.37 Billion ≈ $2.09 Billion |
-1.25pp |
| 2003-12-31 | 3.48% | NT$2.47 Billion ≈ $77.97 Million |
NT$71.19 Billion ≈ $2.24 Billion |
+2.29pp |
| 2002-12-31 | 1.19% | NT$910.26 Million ≈ $28.68 Million |
NT$76.77 Billion ≈ $2.42 Billion |
-12.40pp |
| 2001-12-31 | 13.59% | NT$12.49 Billion ≈ $393.56 Million |
NT$91.93 Billion ≈ $2.90 Billion |
+5.14pp |
| 2000-12-31 | 8.45% | NT$8.90 Billion ≈ $280.50 Million |
NT$105.40 Billion ≈ $3.32 Billion |
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About Winbond Electronics Corp
Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other ser… Read more