Winbond Electronics Corp (2344) - Total Liabilities
Based on the latest financial reports, Winbond Electronics Corp (2344) has total liabilities worth NT$106.92 Billion TWD (≈ $3.37 Billion USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore Winbond Electronics Corp annual equity growth to track the company's year-over-year net asset growth rate.
Winbond Electronics Corp - Total Liabilities Trend (2000–2025)
This chart illustrates how Winbond Electronics Corp's total liabilities have evolved over time, based on quarterly financial data. See cash generation quality of Winbond Electronics Corp to measure how efficiently the company converts operating cash flow to free cash.
Winbond Electronics Corp Competitors by Total Liabilities
The table below lists competitors of Winbond Electronics Corp ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
EDP - Energias de Portugal S.A.
LS:EDP
|
Portugal | €38.61 Billion |
|
GF Securities Co Ltd
SHE:000776
|
China | CN¥943.99 Billion |
|
COCA COLA HBC AG ADRS
F:CCKC
|
Germany | €7.66 Billion |
|
PTT Exploration and Production Public Company Limited
BK:PTTEP
|
Thailand | ฿455.09 Billion |
|
Korea Shipbuilding & Offshore Engineering Co Ltd
KO:009540
|
Korea | ₩22.63 Trillion |
|
AIB Group PLC
IR:A5G
|
Ireland | €129.99 Billion |
|
General Mills Inc
NYSE:GIS
|
USA | $23.05 Billion |
|
DSM-Firmenich AG
AS:DSFIR
|
Netherlands | €10.92 Billion |
Liability Composition Analysis (2000–2025)
This chart breaks down Winbond Electronics Corp's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Winbond Electronics Corp (2344) total market value.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.47 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.92 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.47 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Winbond Electronics Corp's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Winbond Electronics Corp (2000–2025)
The table below shows the annual total liabilities of Winbond Electronics Corp from 2000 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$78.06 Billion ≈ $2.46 Billion |
-0.72% |
| 2024-12-31 | NT$78.62 Billion ≈ $2.48 Billion |
-12.96% |
| 2023-12-31 | NT$90.33 Billion ≈ $2.85 Billion |
+10.93% |
| 2022-12-31 | NT$81.43 Billion ≈ $2.57 Billion |
+29.86% |
| 2021-12-31 | NT$62.71 Billion ≈ $1.98 Billion |
+13.09% |
| 2020-12-31 | NT$55.45 Billion ≈ $1.75 Billion |
+35.42% |
| 2019-12-31 | NT$40.95 Billion ≈ $1.29 Billion |
+27.36% |
| 2018-12-31 | NT$32.15 Billion ≈ $1.01 Billion |
+21.38% |
| 2017-12-31 | NT$26.49 Billion ≈ $834.55 Million |
+16.34% |
| 2016-12-31 | NT$22.77 Billion ≈ $717.34 Million |
+1.20% |
| 2015-12-31 | NT$22.50 Billion ≈ $708.85 Million |
-12.08% |
| 2014-12-31 | NT$25.59 Billion ≈ $806.28 Million |
+29.31% |
| 2013-12-31 | NT$19.79 Billion ≈ $623.51 Million |
-8.21% |
| 2012-12-31 | NT$21.56 Billion ≈ $679.30 Million |
-11.99% |
| 2011-12-31 | NT$24.50 Billion ≈ $771.87 Million |
-12.53% |
| 2010-12-31 | NT$28.01 Billion ≈ $882.44 Million |
-15.18% |
| 2009-12-31 | NT$33.02 Billion ≈ $1.04 Billion |
-11.60% |
| 2008-12-31 | NT$37.36 Billion ≈ $1.18 Billion |
-16.18% |
| 2007-12-31 | NT$44.57 Billion ≈ $1.40 Billion |
+23.64% |
| 2006-12-31 | NT$36.04 Billion ≈ $1.14 Billion |
+35.63% |
| 2005-12-31 | NT$26.57 Billion ≈ $837.26 Million |
+336.24% |
| 2004-12-31 | NT$6.09 Billion ≈ $191.93 Million |
-48.59% |
| 2003-12-31 | NT$11.85 Billion ≈ $373.31 Million |
-24.65% |
| 2002-12-31 | NT$15.73 Billion ≈ $495.45 Million |
-37.52% |
| 2001-12-31 | NT$25.17 Billion ≈ $792.97 Million |
-7.76% |
| 2000-12-31 | NT$27.29 Billion ≈ $859.65 Million |
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About Winbond Electronics Corp
Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other ser… Read more