Winbond Electronics Corp (2344) - Total Liabilities
Based on the latest financial reports, Winbond Electronics Corp (2344) has total liabilities worth NT$106.92 Billion TWD (≈ $3.37 Billion USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Winbond Electronics Corp - Total Liabilities Trend (2000–2025)
This chart illustrates how Winbond Electronics Corp's total liabilities have evolved over time, based on quarterly financial data. See Winbond Electronics Corp current assets vs equity to evaluate short-term liquidity relative to the company's equity base.
Winbond Electronics Corp Competitors by Total Liabilities
The table below lists competitors of Winbond Electronics Corp ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
FTAI Aviation Ltd.
NASDAQ:FTAI
|
USA | $4.04 Billion |
|
Otis Worldwide Corp
NYSE:OTIS
|
USA | $16.06 Billion |
|
Atmos Energy Corporation
NYSE:ATO
|
USA | $4.44 Billion |
|
China Life Insurance Company Limited
F:CHL
|
Germany | €7.10 Trillion |
|
DENSO CORP. ADR 4
F:DNOA
|
Germany | €2.94 Trillion |
|
FIRSTRAND ADR/ 10 RC -01
F:FSR
|
Germany | €2.43 Trillion |
|
Caseys General Stores Inc
NASDAQ:CASY
|
USA | $4.73 Billion |
|
Trip.com Group Limited
F:CLV
|
Germany | €94.79 Billion |
Liability Composition Analysis (2000–2025)
This chart breaks down Winbond Electronics Corp's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of Winbond Electronics Corp.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.47 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.92 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.47 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Winbond Electronics Corp's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Winbond Electronics Corp (2000–2025)
The table below shows the annual total liabilities of Winbond Electronics Corp from 2000 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$78.06 Billion ≈ $2.46 Billion |
-0.72% |
| 2024-12-31 | NT$78.62 Billion ≈ $2.48 Billion |
-12.96% |
| 2023-12-31 | NT$90.33 Billion ≈ $2.85 Billion |
+10.93% |
| 2022-12-31 | NT$81.43 Billion ≈ $2.57 Billion |
+29.86% |
| 2021-12-31 | NT$62.71 Billion ≈ $1.98 Billion |
+13.09% |
| 2020-12-31 | NT$55.45 Billion ≈ $1.75 Billion |
+35.42% |
| 2019-12-31 | NT$40.95 Billion ≈ $1.29 Billion |
+27.36% |
| 2018-12-31 | NT$32.15 Billion ≈ $1.01 Billion |
+21.38% |
| 2017-12-31 | NT$26.49 Billion ≈ $834.55 Million |
+16.34% |
| 2016-12-31 | NT$22.77 Billion ≈ $717.34 Million |
+1.20% |
| 2015-12-31 | NT$22.50 Billion ≈ $708.85 Million |
-12.08% |
| 2014-12-31 | NT$25.59 Billion ≈ $806.28 Million |
+29.31% |
| 2013-12-31 | NT$19.79 Billion ≈ $623.51 Million |
-8.21% |
| 2012-12-31 | NT$21.56 Billion ≈ $679.30 Million |
-11.99% |
| 2011-12-31 | NT$24.50 Billion ≈ $771.87 Million |
-12.53% |
| 2010-12-31 | NT$28.01 Billion ≈ $882.44 Million |
-15.18% |
| 2009-12-31 | NT$33.02 Billion ≈ $1.04 Billion |
-11.60% |
| 2008-12-31 | NT$37.36 Billion ≈ $1.18 Billion |
-16.18% |
| 2007-12-31 | NT$44.57 Billion ≈ $1.40 Billion |
+23.64% |
| 2006-12-31 | NT$36.04 Billion ≈ $1.14 Billion |
+35.63% |
| 2005-12-31 | NT$26.57 Billion ≈ $837.26 Million |
+336.24% |
| 2004-12-31 | NT$6.09 Billion ≈ $191.93 Million |
-48.59% |
| 2003-12-31 | NT$11.85 Billion ≈ $373.31 Million |
-24.65% |
| 2002-12-31 | NT$15.73 Billion ≈ $495.45 Million |
-37.52% |
| 2001-12-31 | NT$25.17 Billion ≈ $792.97 Million |
-7.76% |
| 2000-12-31 | NT$27.29 Billion ≈ $859.65 Million |
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About Winbond Electronics Corp
Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other ser… Read more