Tong Hsing Electronic Industries Ltd - Asset Resilience Ratio
Tong Hsing Electronic Industries Ltd (6271) has an Asset Resilience Ratio of 9.16% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2005–2025)
This chart shows how Tong Hsing Electronic Industries Ltd's Asset Resilience Ratio has changed over time. Check how strategically is Tong Hsing Electronic Industries Ltd's equity deployed to assess the company's strategic physical and investment asset allocation.
Liquid Assets Composition Over Time
This chart breaks down Tong Hsing Electronic Industries Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 6271 company net worth.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$3.19 Billion | 9.16% |
| Total Liquid Assets | NT$3.19 Billion | 9.16% |
Asset Resilience Insights
- Limited Liquidity: Tong Hsing Electronic Industries Ltd maintains only 9.16% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Tong Hsing Electronic Industries Ltd Industry Peers by Asset Resilience Ratio
Compare Tong Hsing Electronic Industries Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
TongFu Microelectronics Co Ltd
SHE:002156 |
Semiconductor Equipment & Materials | 0.01% |
|
Anji Microelectronics Tech Co Ltd
SHG:688019 |
Semiconductor Equipment & Materials | 3.14% |
|
Beijing Huafeng Test & Control Technology Co Ltd
SHG:688200 |
Semiconductor Equipment & Materials | 2.40% |
|
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401 |
Semiconductor Equipment & Materials | 4.11% |
|
JHT Design Co. Ltd. Cl A
SHG:603061 |
Semiconductor Equipment & Materials | 9.01% |
|
Adaptive Plasma Technology Corp
KQ:089970 |
Semiconductor Equipment & Materials | 1.49% |
|
Spectra7 Microsystems Inc
V:SEV |
Semiconductor Equipment & Materials | 29.72% |
|
Bluglass Ltd
AU:BLG |
Semiconductor Equipment & Materials | 23.98% |
Annual Asset Resilience Ratio for Tong Hsing Electronic Industries Ltd (2005–2025)
The table below shows the annual Asset Resilience Ratio data for Tong Hsing Electronic Industries Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 8.63% | NT$2.97 Billion ≈ $93.43 Million |
NT$34.36 Billion ≈ $1.08 Billion |
-3.01pp |
| 2024-12-31 | 11.64% | NT$4.03 Billion ≈ $126.96 Million |
NT$34.62 Billion ≈ $1.09 Billion |
+10.38pp |
| 2023-12-31 | 1.26% | NT$423.36 Million ≈ $13.34 Million |
NT$33.66 Billion ≈ $1.06 Billion |
+0.49pp |
| 2022-12-31 | 0.77% | NT$264.50 Million ≈ $8.33 Million |
NT$34.26 Billion ≈ $1.08 Billion |
-0.22pp |
| 2021-12-31 | 0.99% | NT$273.30 Million ≈ $8.61 Million |
NT$27.54 Billion ≈ $867.59 Million |
-1.57pp |
| 2020-12-31 | 2.57% | NT$652.80 Million ≈ $20.57 Million |
NT$25.44 Billion ≈ $801.41 Million |
+1.44pp |
| 2019-12-31 | 1.13% | NT$140.16 Million ≈ $4.42 Million |
NT$12.42 Billion ≈ $391.39 Million |
-0.24pp |
| 2018-12-31 | 1.37% | NT$171.02 Million ≈ $5.39 Million |
NT$12.46 Billion ≈ $392.66 Million |
+0.85pp |
| 2017-12-31 | 0.52% | NT$67.63 Million ≈ $2.13 Million |
NT$12.96 Billion ≈ $408.44 Million |
-6.41pp |
| 2016-12-31 | 6.94% | NT$1.06 Billion ≈ $33.43 Million |
NT$15.30 Billion ≈ $482.01 Million |
-0.96pp |
| 2015-12-31 | 7.89% | NT$1.21 Billion ≈ $38.11 Million |
NT$15.33 Billion ≈ $482.86 Million |
+2.43pp |
| 2014-12-31 | 5.46% | NT$851.38 Million ≈ $26.82 Million |
NT$15.59 Billion ≈ $491.26 Million |
-3.40pp |
| 2013-12-31 | 8.86% | NT$1.05 Billion ≈ $33.17 Million |
NT$11.88 Billion ≈ $374.31 Million |
+5.27pp |
| 2012-12-31 | 3.59% | NT$373.03 Million ≈ $11.75 Million |
NT$10.39 Billion ≈ $327.35 Million |
-3.72pp |
| 2011-12-31 | 7.31% | NT$691.56 Million ≈ $21.79 Million |
NT$9.46 Billion ≈ $298.05 Million |
+6.88pp |
| 2010-12-31 | 0.43% | NT$30.32 Million ≈ $955.28K |
NT$7.05 Billion ≈ $221.96 Million |
-8.17pp |
| 2009-12-31 | 8.60% | NT$396.88 Million ≈ $12.50 Million |
NT$4.62 Billion ≈ $145.45 Million |
-2.58pp |
| 2008-12-31 | 11.17% | NT$446.19 Million ≈ $14.06 Million |
NT$3.99 Billion ≈ $125.83 Million |
+6.84pp |
| 2007-12-31 | 4.33% | NT$145.40 Million ≈ $4.58 Million |
NT$3.36 Billion ≈ $105.75 Million |
+2.97pp |
| 2006-12-31 | 1.36% | NT$27.70 Million ≈ $872.83K |
NT$2.04 Billion ≈ $64.33 Million |
+0.79pp |
| 2005-12-31 | 0.56% | NT$10.00 Million ≈ $315.05K |
NT$1.78 Billion ≈ $56.02 Million |
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About Tong Hsing Electronic Industries Ltd
Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, an… Read more