Tong Hsing Electronic Industries Ltd Asset Resilience Ratio
Tong Hsing Electronic Industries Ltd asset resilience ratio. Tong Hsing Electronic Industries Ltd (6271) has an Asset Resilience Ratio of 8.96% as of June 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See defensive interval ratio of Tong Hsing Electronic Industries Ltd to measure how many days the company can operate on defensive assets alone.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio of Tong Hsing Electronic Industries Ltd (2005–2025)
Asset resilience ratio of Tong Hsing Electronic Industries Ltd from 2005 to 2025. This chart shows how Tong Hsing Electronic Industries Ltd's Asset Resilience Ratio has changed over time. Read Tong Hsing Electronic Industries Ltd debt and liabilities for a breakdown of total debt and financial obligations.
Liquid Assets Composition Over Time
This chart breaks down Tong Hsing Electronic Industries Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see Tong Hsing Electronic Industries Ltd balance sheet assets.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$3.22 Billion | 8.96% |
| Total Liquid Assets | NT$3.22 Billion | 8.96% |
Asset Resilience Insights
- Limited Liquidity: Tong Hsing Electronic Industries Ltd maintains only 8.96% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Tong Hsing Electronic Industries Ltd Industry Peers by Asset Resilience Ratio
Compare Tong Hsing Electronic Industries Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Advanced Micro Fabrication Inc
SHG:688012 |
Semiconductor Equipment & Materials | 2.66% |
|
Skyverse Technology Co. Ltd. A
SHG:688361 |
Semiconductor Equipment & Materials | 14.49% |
|
National Silicon Industry Group Co Ltd
SHG:688126 |
Semiconductor Equipment & Materials | 4.72% |
|
TCL Zhonghuan Renewable Energy Technology Co Ltd
SHE:002129 |
Semiconductor Equipment & Materials | 0.17% |
|
JHT Design Co. Ltd. Cl A
SHG:603061 |
Semiconductor Equipment & Materials | 9.01% |
|
Hefei Chipmore Technology Co. Ltd. A
SHG:688352 |
Semiconductor Equipment & Materials | 4.46% |
|
D I Corp
KO:003160 |
Semiconductor Equipment & Materials | 0.96% |
|
Hana Materials Inc
KQ:166090 |
Semiconductor Equipment & Materials | 0.22% |
Tong Hsing Electronic Industries Ltd Asset Resilience Ratio by Year (2005–2025)
Tong Hsing Electronic Industries Ltd asset resilience ratio by year from 2005 to 2025. The table below shows the annual Asset Resilience Ratio data for Tong Hsing Electronic Industries Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 8.63% | NT$2.97 Billion ≈ $93.43 Million |
NT$34.36 Billion ≈ $1.08 Billion |
-3.01pp |
| 2024-12-31 | 11.64% | NT$4.03 Billion ≈ $126.96 Million |
NT$34.62 Billion ≈ $1.09 Billion |
+10.38pp |
| 2023-12-31 | 1.26% | NT$423.36 Million ≈ $13.34 Million |
NT$33.66 Billion ≈ $1.06 Billion |
+0.49pp |
| 2022-12-31 | 0.77% | NT$264.50 Million ≈ $8.33 Million |
NT$34.26 Billion ≈ $1.08 Billion |
-0.22pp |
| 2021-12-31 | 0.99% | NT$273.30 Million ≈ $8.61 Million |
NT$27.54 Billion ≈ $867.59 Million |
-1.57pp |
| 2020-12-31 | 2.57% | NT$652.80 Million ≈ $20.57 Million |
NT$25.44 Billion ≈ $801.41 Million |
+1.44pp |
| 2019-12-31 | 1.13% | NT$140.16 Million ≈ $4.42 Million |
NT$12.42 Billion ≈ $391.39 Million |
-0.24pp |
| 2018-12-31 | 1.37% | NT$171.02 Million ≈ $5.39 Million |
NT$12.46 Billion ≈ $392.66 Million |
+0.85pp |
| 2017-12-31 | 0.52% | NT$67.63 Million ≈ $2.13 Million |
NT$12.96 Billion ≈ $408.44 Million |
-6.41pp |
| 2016-12-31 | 6.94% | NT$1.06 Billion ≈ $33.43 Million |
NT$15.30 Billion ≈ $482.01 Million |
-0.96pp |
| 2015-12-31 | 7.89% | NT$1.21 Billion ≈ $38.11 Million |
NT$15.33 Billion ≈ $482.86 Million |
+2.43pp |
| 2014-12-31 | 5.46% | NT$851.38 Million ≈ $26.82 Million |
NT$15.59 Billion ≈ $491.26 Million |
-3.40pp |
| 2013-12-31 | 8.86% | NT$1.05 Billion ≈ $33.17 Million |
NT$11.88 Billion ≈ $374.31 Million |
+5.27pp |
| 2012-12-31 | 3.59% | NT$373.03 Million ≈ $11.75 Million |
NT$10.39 Billion ≈ $327.35 Million |
-3.72pp |
| 2011-12-31 | 7.31% | NT$691.56 Million ≈ $21.79 Million |
NT$9.46 Billion ≈ $298.05 Million |
+6.88pp |
| 2010-12-31 | 0.43% | NT$30.32 Million ≈ $955.28K |
NT$7.05 Billion ≈ $221.96 Million |
-8.17pp |
| 2009-12-31 | 8.60% | NT$396.88 Million ≈ $12.50 Million |
NT$4.62 Billion ≈ $145.45 Million |
-2.58pp |
| 2008-12-31 | 11.17% | NT$446.19 Million ≈ $14.06 Million |
NT$3.99 Billion ≈ $125.83 Million |
+6.84pp |
| 2007-12-31 | 4.33% | NT$145.40 Million ≈ $4.58 Million |
NT$3.36 Billion ≈ $105.75 Million |
+2.97pp |
| 2006-12-31 | 1.36% | NT$27.70 Million ≈ $872.83K |
NT$2.04 Billion ≈ $64.33 Million |
+0.79pp |
| 2005-12-31 | 0.56% | NT$10.00 Million ≈ $315.05K |
NT$1.78 Billion ≈ $56.02 Million |
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About Tong Hsing Electronic Industries Ltd
Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, an… Read more