Tong Hsing Electronic Industries Ltd (6271) - Total Liabilities
Based on the latest financial reports, Tong Hsing Electronic Industries Ltd (6271) has total liabilities worth NT$8.69 Billion TWD (≈ $273.69 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 6271 strategic capital deployment ratio to see how much of total assets are deployed in long-term investments.
Tong Hsing Electronic Industries Ltd - Total Liabilities Trend (2003–2025)
This chart illustrates how Tong Hsing Electronic Industries Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see total assets of Tong Hsing Electronic Industries Ltd.
Tong Hsing Electronic Industries Ltd Competitors by Total Liabilities
The table below lists competitors of Tong Hsing Electronic Industries Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Jinlongyu Group Co Ltd Class A
SHE:002882
|
China | CN¥2.52 Billion |
|
YGSOFT Inc
SHE:002063
|
China | CN¥658.01 Million |
|
IReader Technology Co Ltd
SHG:603533
|
China | CN¥572.63 Million |
|
Fila Holdings Corp
KO:081660
|
Korea | ₩2.75 Trillion |
|
Coursera Inc
NYSE:COUR
|
USA | $368.70 Million |
|
Suzhou SLAC Precision Equipment Co Ltd
SHE:300382
|
China | CN¥3.18 Billion |
|
Fengzhushou Co. Ltd. A
SHE:301382
|
China | CN¥1.75 Billion |
|
Proeduca Altus S.A.
MC:PRO
|
Spain | €275.33 Million |
Liability Composition Analysis (2003–2025)
This chart breaks down Tong Hsing Electronic Industries Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Tong Hsing Electronic Industries Ltd balance sheet quality to measure how much of total assets are equity-financed.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.60 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.32 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.24 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Tong Hsing Electronic Industries Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Tong Hsing Electronic Industries Ltd (2003–2025)
The table below shows the annual total liabilities of Tong Hsing Electronic Industries Ltd from 2003 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$7.62 Billion ≈ $240.09 Million |
-13.23% |
| 2024-12-31 | NT$8.78 Billion ≈ $276.70 Million |
-4.75% |
| 2023-12-31 | NT$9.22 Billion ≈ $290.51 Million |
-5.32% |
| 2022-12-31 | NT$9.74 Billion ≈ $306.82 Million |
+113.81% |
| 2021-12-31 | NT$4.55 Billion ≈ $143.50 Million |
+7.74% |
| 2020-12-31 | NT$4.23 Billion ≈ $133.19 Million |
+88.22% |
| 2019-12-31 | NT$2.25 Billion ≈ $70.76 Million |
+11.49% |
| 2018-12-31 | NT$2.01 Billion ≈ $63.47 Million |
-21.00% |
| 2017-12-31 | NT$2.55 Billion ≈ $80.35 Million |
-50.50% |
| 2016-12-31 | NT$5.15 Billion ≈ $162.33 Million |
-0.71% |
| 2015-12-31 | NT$5.19 Billion ≈ $163.49 Million |
-6.76% |
| 2014-12-31 | NT$5.57 Billion ≈ $175.36 Million |
+135.59% |
| 2013-12-31 | NT$2.36 Billion ≈ $74.43 Million |
+58.62% |
| 2012-12-31 | NT$1.49 Billion ≈ $46.92 Million |
+8.69% |
| 2011-12-31 | NT$1.37 Billion ≈ $43.17 Million |
-10.82% |
| 2010-12-31 | NT$1.54 Billion ≈ $48.41 Million |
+60.73% |
| 2009-12-31 | NT$955.96 Million ≈ $30.12 Million |
+33.17% |
| 2008-12-31 | NT$717.87 Million ≈ $22.62 Million |
-7.49% |
| 2007-12-31 | NT$776.01 Million ≈ $24.45 Million |
+13.50% |
| 2006-12-31 | NT$683.73 Million ≈ $21.54 Million |
+7.81% |
| 2005-12-31 | NT$634.20 Million ≈ $19.98 Million |
+41.75% |
| 2004-12-31 | NT$447.42 Million ≈ $14.10 Million |
+0.33% |
| 2003-12-31 | NT$445.94 Million ≈ $14.05 Million |
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About Tong Hsing Electronic Industries Ltd
Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, an… Read more