Winstek Semiconductor Co Ltd - Asset Resilience Ratio

Latest as of June 2025: 9.83%

Winstek Semiconductor Co Ltd (3265) has an Asset Resilience Ratio of 9.83% as of June 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read Winstek Semiconductor Co Ltd total liabilities for a breakdown of total debt and financial obligations.

Liquid Assets

NT$840.00 Million
≈ $26.46 Million USD Cash + Short-term Investments

Total Assets

NT$8.54 Billion
≈ $269.15 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2017–2024)

This chart shows how Winstek Semiconductor Co Ltd's Asset Resilience Ratio has changed over time. See 3265 total equity for net asset value and shareholders' equity analysis.

Liquid Assets Composition Over Time

This chart breaks down Winstek Semiconductor Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Winstek Semiconductor Co Ltd (3265) total market value.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents NT$0.00 0%
Short-term Investments NT$840.00 Million 9.83%
Total Liquid Assets NT$840.00 Million 9.83%

Asset Resilience Insights

  • Limited Liquidity: Winstek Semiconductor Co Ltd maintains only 9.83% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Winstek Semiconductor Co Ltd Industry Peers by Asset Resilience Ratio

Compare Winstek Semiconductor Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Henan Shijia Photons Technology Co Ltd
SHG:688313
Semiconductor Equipment & Materials 0.39%
LandMark Optoelectronics
TWO:3081
Semiconductor Equipment & Materials 25.41%
Jiangsu HHCK Advanced Materials Co. Ltd. A
SHG:688535
Semiconductor Equipment & Materials 0.01%
Daqo New Energy Corp
F:5DQ2
Semiconductor Equipment & Materials 23.11%
Hana Materials Inc
KQ:166090
Semiconductor Equipment & Materials 0.23%
Mecaro Co. Ltd
KQ:241770
Semiconductor Equipment & Materials 15.91%
Bluglass Ltd
AU:BLG
Semiconductor Equipment & Materials 23.98%
Spectra7 Microsystems Inc
V:SEV
Semiconductor Equipment & Materials 29.72%

Annual Asset Resilience Ratio for Winstek Semiconductor Co Ltd (2017–2024)

The table below shows the annual Asset Resilience Ratio data for Winstek Semiconductor Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 18.32% NT$1.41 Billion
≈ $44.51 Million
NT$7.71 Billion
≈ $242.99 Million
-9.67pp
2023-12-31 27.99% NT$2.13 Billion
≈ $67.22 Million
NT$7.62 Billion
≈ $240.18 Million
+11.43pp
2022-12-31 16.55% NT$1.23 Billion
≈ $38.87 Million
NT$7.45 Billion
≈ $234.84 Million
+3.93pp
2021-12-31 12.62% NT$800.04 Million
≈ $25.21 Million
NT$6.34 Billion
≈ $199.69 Million
-22.17pp
2020-12-31 34.80% NT$1.98 Billion
≈ $62.41 Million
NT$5.69 Billion
≈ $179.36 Million
-3.69pp
2019-12-31 38.48% NT$2.47 Billion
≈ $77.79 Million
NT$6.42 Billion
≈ $202.14 Million
+13.26pp
2018-12-31 25.23% NT$1.46 Billion
≈ $45.94 Million
NT$5.78 Billion
≈ $182.10 Million
+2.95pp
2017-12-31 22.28% NT$1.35 Billion
≈ $42.41 Million
NT$6.04 Billion
≈ $190.38 Million
--
pp = percentage points

About Winstek Semiconductor Co Ltd

TWO:3265 Taiwan Semiconductor Equipment & Materials
Market Cap
$768.45 Million
NT$24.39 Billion TWD
Market Cap Rank
#10462 Global
#349 in Taiwan
Share Price
NT$179.00
Change (1 day)
-3.24%
52-Week Range
NT$88.30 - NT$190.00
All Time High
NT$190.00
About

Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the testing of integrated circuits and chip bumping and wafer packaging services in Taiwan. It operates in three segments: Test Business, Packaging Business, and Factory Development. The company offers test services, such as wafer sort, final and post-test, engineering support, and test platforms services; and bump servic… Read more