Winstek Semiconductor Co Ltd (3265) - Total Liabilities
Based on the latest financial reports, Winstek Semiconductor Co Ltd (3265) has total liabilities worth NT$2.83 Billion TWD (≈ $89.10 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Winstek Semiconductor Co Ltd - Total Liabilities Trend (2017–2025)
This chart illustrates how Winstek Semiconductor Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See 3265 working capital efficiency to evaluate short-term liquidity relative to the company's equity base.
Winstek Semiconductor Co Ltd Competitors by Total Liabilities
The table below lists competitors of Winstek Semiconductor Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Shanghai Xinhua Media Co Ltd
SHG:600825
|
China | CN¥1.42 Billion |
|
Guangdong Mingzhu Group Co Ltd
SHG:600382
|
China | CN¥580.64 Million |
|
Greencoat Renewables PLC
IR:GRP
|
Ireland | €1.28 Billion |
|
Rastar Group
SHE:300043
|
China | CN¥2.51 Billion |
|
Hangzhou Biotest Biotech Co Ltd
SHG:688767
|
China | CN¥121.73 Million |
|
Maravai Lifesciences Holdings Inc
NASDAQ:MRVI
|
USA | $417.33 Million |
|
E&R Engineering
TWO:8027
|
Taiwan | NT$1.49 Billion |
|
Bichamp Cutting Technology Hunan Co Ltd
SHE:002843
|
China | CN¥1.08 Billion |
Liability Composition Analysis (2017–2025)
This chart breaks down Winstek Semiconductor Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Winstek Semiconductor Co Ltd stock valuation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 3.43 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.44 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.31 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Winstek Semiconductor Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Winstek Semiconductor Co Ltd (2017–2025)
The table below shows the annual total liabilities of Winstek Semiconductor Co Ltd from 2017 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$2.83 Billion ≈ $89.10 Million |
+109.73% |
| 2024-12-31 | NT$1.35 Billion ≈ $42.48 Million |
-17.24% |
| 2023-12-31 | NT$1.63 Billion ≈ $51.34 Million |
+1.84% |
| 2022-12-31 | NT$1.60 Billion ≈ $50.41 Million |
+9.41% |
| 2021-12-31 | NT$1.46 Billion ≈ $46.07 Million |
+51.76% |
| 2020-12-31 | NT$963.57 Million ≈ $30.36 Million |
-36.90% |
| 2019-12-31 | NT$1.53 Billion ≈ $48.11 Million |
+26.66% |
| 2018-12-31 | NT$1.21 Billion ≈ $37.98 Million |
-30.41% |
| 2017-12-31 | NT$1.73 Billion ≈ $54.58 Million |
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About Winstek Semiconductor Co Ltd
Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the testing of integrated circuits and chip bumping and wafer packaging services in Taiwan. It operates in three segments: Test Business, Packaging Business, and Factory Development. The company offers test services, such as wafer sort, final and post-test, engineering support, and test platforms services; and bump servic… Read more