Winstek Semiconductor Co Ltd (3265) - Total Liabilities

Latest as of December 2025: NT$2.83 Billion TWD ≈ $89.10 Million USD

Based on the latest financial reports, Winstek Semiconductor Co Ltd (3265) has total liabilities worth NT$2.83 Billion TWD (≈ $89.10 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Winstek Semiconductor Co Ltd - Total Liabilities Trend (2017–2025)

This chart illustrates how Winstek Semiconductor Co Ltd's total liabilities have evolved over time, based on quarterly financial data. Check financial resilience of Winstek Semiconductor Co Ltd to evaluate the company's liquid asset resilience ratio.

Winstek Semiconductor Co Ltd Competitors by Total Liabilities

The table below lists competitors of Winstek Semiconductor Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Hosken Consolidated Investments Ltd
JSE:HCI
South Africa ZAC24.63 Billion
Media and Games Invest PLC
F:M8G
Germany €746.49 Million
Velocity Financial Llc
NYSE:VEL
USA $6.32 Billion
Anhui Huilong Agricultural Means of Production Co Ltd
SHE:002556
China CN¥7.74 Billion
International Tower Hill Mines Ltd
TO:ITH
Canada CA$485.31K
First Hi-tec Enterprise Co Ltd
TWO:5439
Taiwan NT$7.77 Billion
Meorient
SHE:300795
China CN¥208.64 Million
Zhongyin Babi Food Co. Ltd.
SHG:605338
China CN¥482.41 Million

Liability Composition Analysis (2017–2025)

This chart breaks down Winstek Semiconductor Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see balance sheet size of Winstek Semiconductor Co Ltd.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.43 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.44 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.31 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Winstek Semiconductor Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Winstek Semiconductor Co Ltd (2017–2025)

The table below shows the annual total liabilities of Winstek Semiconductor Co Ltd from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 NT$2.83 Billion
≈ $89.10 Million
+109.73%
2024-12-31 NT$1.35 Billion
≈ $42.48 Million
-17.24%
2023-12-31 NT$1.63 Billion
≈ $51.34 Million
+1.84%
2022-12-31 NT$1.60 Billion
≈ $50.41 Million
+9.41%
2021-12-31 NT$1.46 Billion
≈ $46.07 Million
+51.76%
2020-12-31 NT$963.57 Million
≈ $30.36 Million
-36.90%
2019-12-31 NT$1.53 Billion
≈ $48.11 Million
+26.66%
2018-12-31 NT$1.21 Billion
≈ $37.98 Million
-30.41%
2017-12-31 NT$1.73 Billion
≈ $54.58 Million
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About Winstek Semiconductor Co Ltd

TWO:3265 Taiwan Semiconductors
Market Cap
$706.20 Million
NT$22.42 Billion TWD
Market Cap Rank
#10549 Global
#359 in Taiwan
Share Price
NT$164.50
Change (1 day)
+7.17%
52-Week Range
NT$88.30 - NT$193.50
All Time High
NT$193.50
About

Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the testing of integrated circuits and chip bumping and wafer packaging services in Taiwan. It operates in three segments: Test Business, Packaging Business, and Factory Development. The company offers test services, such as wafer sort, final and post-test, engineering support, and test platforms services; and bump servic… Read more