All Ring Tech Co Ltd - Asset Resilience Ratio

Latest as of December 2025: 1.20%

All Ring Tech Co Ltd (6187) has an Asset Resilience Ratio of 1.20% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check 6187 strategic assets to equity ratio to assess the company's strategic physical and investment asset allocation.

Liquid Assets

NT$115.18 Million
≈ $3.63 Million USD Cash + Short-term Investments

Total Assets

NT$9.61 Billion
≈ $302.75 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2019–2025)

This chart shows how All Ring Tech Co Ltd's Asset Resilience Ratio has changed over time. See debt-free asset ratio of All Ring Tech Co Ltd to measure how much of total assets are equity-financed.

Liquid Assets Composition Over Time

This chart breaks down All Ring Tech Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see market cap of All Ring Tech Co Ltd.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents NT$0.00 0%
Short-term Investments NT$115.18 Million 1.2%
Total Liquid Assets NT$115.18 Million 1.20%

Asset Resilience Insights

  • Limited Liquidity: All Ring Tech Co Ltd maintains only 1.20% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

All Ring Tech Co Ltd Industry Peers by Asset Resilience Ratio

Compare All Ring Tech Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Beijing Roborock Technology Co Ltd
SHG:688169
Specialty Industrial Machinery 30.88%
Nidec Corporation
F:NIB1
Specialty Industrial Machinery 0.08%
Kaori Heat Treatment Co Ltd
TW:8996
Specialty Industrial Machinery 0.61%
Suzhou TZTEK Technology Co Ltd
SHG:688003
Specialty Industrial Machinery 0.78%
Ningbo Haitian Precision Machinery Co Ltd
SHG:601882
Specialty Industrial Machinery 3.38%
Suzhou Shijia Science & Technology Inc
SHE:002796
Specialty Industrial Machinery 3.53%
Jiangsu Guomao Reducer Co Ltd
SHG:603915
Specialty Industrial Machinery 29.22%
Shanghai Taisheng Wind Power
SHE:300129
Specialty Industrial Machinery 1.66%

Annual Asset Resilience Ratio for All Ring Tech Co Ltd (2019–2025)

The table below shows the annual Asset Resilience Ratio data for All Ring Tech Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 1.20% NT$115.18 Million
≈ $3.63 Million
NT$9.61 Billion
≈ $302.75 Million
+0.48pp
2024-12-31 0.71% NT$62.80 Million
≈ $1.98 Million
NT$8.80 Billion
≈ $277.12 Million
-3.84pp
2023-12-31 4.56% NT$204.51 Million
≈ $6.44 Million
NT$4.49 Billion
≈ $141.41 Million
+3.53pp
2022-12-31 1.03% NT$42.92 Million
≈ $1.35 Million
NT$4.16 Billion
≈ $131.21 Million
+0.22pp
2021-12-31 0.81% NT$29.04 Million
≈ $915.01K
NT$3.58 Billion
≈ $112.74 Million
-0.27pp
2020-12-31 1.08% NT$29.07 Million
≈ $915.71K
NT$2.69 Billion
≈ $84.63 Million
-0.41pp
2019-12-31 1.49% NT$32.42 Million
≈ $1.02 Million
NT$2.17 Billion
≈ $68.34 Million
--
pp = percentage points

About All Ring Tech Co Ltd

TWO:6187 Taiwan Specialty Industrial Machinery
Market Cap
$3.52 Billion
NT$111.60 Billion TWD
Market Cap Rank
#4551 Global
#135 in Taiwan
Share Price
NT$1155.00
Change (1 day)
+1.32%
52-Week Range
NT$314.50 - NT$1390.00
All Time High
NT$1390.00
About

All Ring Tech Co., Ltd. engages in the design, manufacture, and assembly of automation machines in Taiwan and China. The company offers semiconductor dispensing equipment series, including wafer level underfill dispensing machine, underfill dispensing machine, and dispensing machine; bonding series comprising FPC, PSA, optical, and ACF mounter; AOI machines for microchip insertion, solder balling… Read more