All Ring Tech Co Ltd (6187) - Total Liabilities

Latest as of June 2026: NT$4.75 Billion TWD ≈ $149.63 Million USD

Based on the latest financial reports, All Ring Tech Co Ltd (6187) has total liabilities worth NT$4.75 Billion TWD (≈ $149.63 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check 6187 financial resilience to evaluate the company's liquid asset resilience ratio.

All Ring Tech Co Ltd - Total Liabilities Trend (2017–2025)

This chart illustrates how All Ring Tech Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see All Ring Tech Co Ltd asset portfolio.

All Ring Tech Co Ltd Competitors by Total Liabilities

The table below lists competitors of All Ring Tech Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Cochin Shipyard Limited
NSE:COCHINSHIP
India Rs86.58 Billion
Kiniksa Pharmaceuticals Ltd
NASDAQ:KNSA
USA $241.96 Million
DMG MORI AKTIENGESELLSCHAFT
XETRA:GIL
Germany €1.06 Billion
USA Compression Partners LP
NYSE:USAC
USA $3.40 Billion
Kulicke and Soffa Industries Inc
F:KU1
Germany €407.13 Million
Kontoor Brands Inc
NYSE:KTB
USA $2.33 Billion
Otter Tail Corporation
NASDAQ:OTTR
USA $2.42 Billion
Skeena Resources Ltd
TO:SKE
Canada CA$951.63 Million

Liability Composition Analysis (2017–2025)

This chart breaks down All Ring Tech Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See 6187 net asset quality score to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.78 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.56 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.35 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how All Ring Tech Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for All Ring Tech Co Ltd (2017–2025)

The table below shows the annual total liabilities of All Ring Tech Co Ltd from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 NT$2.12 Billion
≈ $66.83 Million
-6.92%
2024-12-31 NT$2.28 Billion
≈ $71.80 Million
+13.54%
2023-12-31 NT$2.01 Billion
≈ $63.23 Million
+15.82%
2022-12-31 NT$1.73 Billion
≈ $54.59 Million
+35.80%
2021-12-31 NT$1.28 Billion
≈ $40.20 Million
+63.09%
2020-12-31 NT$782.41 Million
≈ $24.65 Million
+62.80%
2019-12-31 NT$480.60 Million
≈ $15.14 Million
-26.14%
2018-12-31 NT$650.66 Million
≈ $20.50 Million
-3.39%
2017-12-31 NT$673.52 Million
≈ $21.22 Million
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About All Ring Tech Co Ltd

TWO:6187 Taiwan Specialty Industrial Machinery
Market Cap
$3.74 Billion
NT$118.79 Billion TWD
Market Cap Rank
#4283 Global
#127 in Taiwan
Share Price
NT$1220.00
Change (1 day)
+0.41%
52-Week Range
NT$314.50 - NT$1430.00
All Time High
NT$1430.00
About

All Ring Tech Co., Ltd. engages in the design, manufacture, and assembly of automation machines in Taiwan and China. The company offers semiconductor dispensing equipment series, including wafer level underfill dispensing machine, underfill dispensing machine, and dispensing machine; bonding series comprising FPC, PSA, optical, and ACF mounter; AOI machines for microchip insertion, solder balling… Read more