All Ring Tech Co Ltd Total Liabilities

Latest as of June 2026: NT$4.75 Billion TWD ≈ $149.63 Million USD

All Ring Tech Co Ltd total liabilities. Based on the latest financial reports, All Ring Tech Co Ltd (6187) has total liabilities worth NT$4.75 Billion TWD (≈ $149.63 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check how resilient are All Ring Tech Co Ltd's assets to evaluate the company's liquid asset resilience ratio.

Total Liabilities of All Ring Tech Co Ltd (2017–2025)

Total liabilities of All Ring Tech Co Ltd from 2017 to 2025. This chart illustrates how All Ring Tech Co Ltd's total liabilities have evolved over time, based on quarterly financial data.

All Ring Tech Co Ltd Competitors by Total Liabilities

The table below lists competitors of All Ring Tech Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Topaz Energy Corp
TO:TPZ
Canada CA$697.23 Million
Organización Soriana S. A. B. de C. V
MX:SORIANAB
Mexico MX$76.03 Billion
Hiwin Technologies Corp
TW:2049
Taiwan NT$17.79 Billion
Henan Zhongfu Industrial Co Ltd
SHG:600595
China CN¥9.08 Billion
CIA EN.GER. ADR 1
F:CIDS
Germany €38.45 Billion
TELEPERFORMANCE SE ADR
F:RCF0
Germany €7.51 Billion
OSI Systems Inc
NASDAQ:OSIS
USA $1.68 Billion
Ondas Holdings Inc.
NASDAQ:ONDS
USA $1.42 Billion

Liability Composition Analysis (2017–2025)

This chart breaks down All Ring Tech Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see how large is All Ring Tech Co Ltd's balance sheet.

Liquidity & Leverage Metrics

All Ring Tech Co Ltd Total Liabilities Ratios Explained

All Ring Tech Co Ltd total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 1.78 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.56 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.35 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how All Ring Tech Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for All Ring Tech Co Ltd (2017–2025)

The table below shows the annual total liabilities of All Ring Tech Co Ltd from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 NT$2.12 Billion
≈ $66.83 Million
-6.92%
2024-12-31 NT$2.28 Billion
≈ $71.80 Million
+13.54%
2023-12-31 NT$2.01 Billion
≈ $63.23 Million
+15.82%
2022-12-31 NT$1.73 Billion
≈ $54.59 Million
+35.80%
2021-12-31 NT$1.28 Billion
≈ $40.20 Million
+63.09%
2020-12-31 NT$782.41 Million
≈ $24.65 Million
+62.80%
2019-12-31 NT$480.60 Million
≈ $15.14 Million
-26.14%
2018-12-31 NT$650.66 Million
≈ $20.50 Million
-3.39%
2017-12-31 NT$673.52 Million
≈ $21.22 Million
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About All Ring Tech Co Ltd

TWO:6187 Taiwan Specialty Industrial Machinery
Market Cap
$3.31 Billion
NT$105.15 Billion TWD
Market Cap Rank
#4489 Global
#131 in Taiwan
Share Price
NT$1080.00
Change (1 day)
-9.62%
52-Week Range
NT$314.50 - NT$1675.00
All Time High
NT$1675.00
About

All Ring Tech Co., Ltd. engages in the design, manufacture, and assembly of automation machines in Taiwan and China. The company offers semiconductor dispensing equipment series, including wafer level underfill dispensing machine, underfill dispensing machine, and dispensing machine; bonding series comprising FPC, PSA, optical, and ACF mounter; AOI machines for microchip insertion, solder balling… Read more