Aspocomp Group Oyj (ACG1V) - Total Assets
Based on the latest financial reports, Aspocomp Group Oyj (ACG1V) holds total assets worth €26.29 Million EUR (≈ $30.74 Million USD) as of September 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. See ACG1V book value for net asset value and shareholders' equity analysis.
Aspocomp Group Oyj - Total Assets Trend (1999–2024)
This chart illustrates how Aspocomp Group Oyj's total assets have evolved over time, based on quarterly financial data.
Aspocomp Group Oyj - Asset Composition Analysis
Current Asset Composition (December 2024)
Aspocomp Group Oyj's total assets of €26.29 Million consist of 50.7% current assets and 49.3% non-current assets.
| Asset Category | Amount (EUR) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | €0.00 | 4.9% |
| Accounts Receivable | €7.29 Million | 25.7% |
| Inventory | €5.73 Million | 20.2% |
| Property, Plant & Equipment | €5.25 Million | 18.5% |
| Intangible Assets | €266.00K | 0.9% |
| Goodwill | €3.00 Million | 10.6% |
Asset Composition Trend (1999–2024)
This chart illustrates how Aspocomp Group Oyj's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see ACG1V market cap.
Key Asset Composition Facts
- Current vs. Non-Current Assets: Aspocomp Group Oyj's current assets represent 50.7% of total assets in 2024, an increase from 38.6% in 1999.
- Cash Position: Cash and equivalents constituted 4.9% of total assets in 2024, up from 1.5% in 1999.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 10.0% of total assets, an increase from 2.0% in 1999.
- Asset Diversification: The largest asset category is accounts receivable at 25.7% of total assets.
Aspocomp Group Oyj Competitors by Total Assets
Key competitors of Aspocomp Group Oyj based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
Elite Material Co Ltd
TW:2383
|
Taiwan | NT$107.91 Billion |
|
Avary Holding Shenzhen Co Ltd Class A
SHE:002938
|
China | CN¥47.93 Billion |
|
WT Microelectronics Co Ltd
TW:3036
|
Taiwan | NT$527.56 Billion |
|
Shenzhen Sunway Communication
SHE:300136
|
China | CN¥13.57 Billion |
|
Shenzhen Everwin Precision Tech
SHE:300115
|
China | CN¥22.57 Billion |
|
TDG Holding Co Ltd
SHG:600330
|
China | CN¥11.61 Billion |
|
Guizhou Space Appliance Co Ltd
SHE:002025
|
China | CN¥12.10 Billion |
|
Poco Holding Co Ltd
SHE:300811
|
China | CN¥3.80 Billion |
Aspocomp Group Oyj - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 2.57 | 2.16 | 2.23 |
| Quick Ratio | 1.49 | 1.25 | 1.67 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | €7.89 Million | €6.54 Million | €6.42 Million |
Aspocomp Group Oyj - Advanced Valuation Insights
This section examines the relationship between Aspocomp Group Oyj's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 2.49 |
| Latest Market Cap to Assets Ratio | 1.35 |
| Asset Growth Rate (YoY) | 8.5% |
| Total Assets | €28.41 Million |
| Market Capitalization | $38.22 Million USD |
Valuation Analysis
Above Book Valuation: The market values Aspocomp Group Oyj's assets above their book value (1.35x), reflecting positive investor sentiment about the company's future prospects.
Positive Asset Growth: Aspocomp Group Oyj's assets grew by 8.5% over the past year, showing continued investment in the company's operational capacity.
Annual Total Assets for Aspocomp Group Oyj (1999–2024)
The table below shows the annual total assets of Aspocomp Group Oyj from 1999 to 2024.
| Year | Total Assets | Change |
|---|---|---|
| 2024-12-31 | €28.41 Million ≈ $33.21 Million |
+8.46% |
| 2023-12-31 | €26.19 Million ≈ $30.62 Million |
-16.67% |
| 2022-12-31 | €31.43 Million ≈ $36.75 Million |
-0.24% |
| 2021-12-31 | €31.51 Million ≈ $36.84 Million |
+16.90% |
| 2020-12-31 | €26.95 Million ≈ $31.51 Million |
-8.72% |
| 2019-12-31 | €29.53 Million ≈ $34.52 Million |
+14.30% |
| 2018-12-31 | €25.83 Million ≈ $30.20 Million |
+48.34% |
| 2017-12-31 | €17.41 Million ≈ $20.36 Million |
+10.61% |
| 2016-12-31 | €15.74 Million ≈ $18.41 Million |
+14.12% |
| 2015-12-31 | €13.80 Million ≈ $16.13 Million |
-7.62% |
| 2014-12-31 | €14.93 Million ≈ $17.46 Million |
-16.15% |
| 2013-12-31 | €17.81 Million ≈ $20.82 Million |
-9.09% |
| 2012-12-31 | €19.59 Million ≈ $22.90 Million |
+19.53% |
| 2011-12-31 | €16.39 Million ≈ $19.16 Million |
-51.62% |
| 2010-12-31 | €33.88 Million ≈ $39.60 Million |
+7.93% |
| 2009-12-31 | €31.39 Million ≈ $36.69 Million |
-9.55% |
| 2008-12-31 | €34.70 Million ≈ $40.57 Million |
-49.69% |
| 2007-12-31 | €68.97 Million ≈ $80.64 Million |
-62.67% |
| 2006-12-31 | €184.78 Million ≈ $216.02 Million |
-0.45% |
| 2005-12-31 | €185.61 Million ≈ $217.00 Million |
-6.84% |
| 2004-12-31 | €199.25 Million ≈ $232.94 Million |
-6.99% |
| 2003-12-31 | €214.23 Million ≈ $250.45 Million |
-3.57% |
| 2002-12-31 | €222.16 Million ≈ $259.73 Million |
-23.94% |
| 2001-12-31 | €292.07 Million ≈ $341.46 Million |
+16.61% |
| 2000-12-31 | €250.46 Million ≈ $292.81 Million |
+59.17% |
| 1999-12-31 | €157.35 Million ≈ $183.96 Million |
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About Aspocomp Group Oyj
Aspocomp Group Oyj manufactures and sells printed circuit boards (PCBs) in Finland, Europe, and internationally. The company offers high speed digital, advanced high density interconnection, high layer count multilayer, heavy copper, and high frequency PCBs, as well as PCBs with component cooling for thermal management. It also provides quick turn around, design support, logistics, and global sup… Read more