Aspocomp Group Oyj - Asset Resilience Ratio

Latest as of September 2022: 7.39%

Aspocomp Group Oyj (ACG1V) has an Asset Resilience Ratio of 7.39% as of September 2022. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See ACG1V net working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

€2.37 Million
≈ $2.77 Million USD Cash + Short-term Investments

Total Assets

€32.03 Million
≈ $37.45 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2000–2020)

This chart shows how Aspocomp Group Oyj's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see total assets of Aspocomp Group Oyj.

Liquid Assets Composition Over Time

This chart breaks down Aspocomp Group Oyj's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Explore ACG1V long-term investment intensity to see how much of total assets are deployed in long-term investments.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents €2.37 Million 7.39%
Short-term Investments €0.00 0%
Total Liquid Assets €2.37 Million 7.39%

Asset Resilience Insights

  • Limited Liquidity: Aspocomp Group Oyj maintains only 7.39% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company primarily holds liquidity in cash and equivalents rather than short-term investments.

Aspocomp Group Oyj Industry Peers by Asset Resilience Ratio

Compare Aspocomp Group Oyj's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Gold Circuit Electronics Ltd
TW:2368
Electronic Components 0.52%
Shennan Circuits Co Ltd Class A
SHE:002916
Electronic Components 1.57%
Goldenmax International Technology Ltd
SHE:002636
Electronic Components 2.56%
LG Innotek Co Ltd
KO:011070
Electronic Components 0.01%
Shanghai Wanye Enterprises Co Ltd
SHG:600641
Electronic Components 0.06%
Suzhou HYC Technology Co Ltd
SHG:688001
Electronic Components 0.06%
Co-Tech Development
TWO:8358
Electronic Components 0.16%
Long Young Electronic (Kunshan) Co. Ltd. A
SHE:301389
Electronic Components 27.28%

Annual Asset Resilience Ratio for Aspocomp Group Oyj (2000–2020)

The table below shows the annual Asset Resilience Ratio data for Aspocomp Group Oyj.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2020-12-31 10.39% €2.80 Million
≈ $3.27 Million
€26.95 Million
≈ $31.51 Million
+41.94pp
2018-12-31 -31.55% €-8.15 Million
≈ $-9.53 Million
€25.83 Million
≈ $30.20 Million
-33.76pp
2017-12-31 2.20% €384.00K
≈ $448.94K
€17.41 Million
≈ $20.36 Million
+2.20pp
2015-12-31 0.01% €1.00K
≈ $1.17K
€13.80 Million
≈ $16.13 Million
+0.01pp
2013-12-31 -0.01% €-1.00K
≈ $-1.17K
€17.81 Million
≈ $20.82 Million
+5.60pp
2005-12-31 -5.61% €-10.41 Million
≈ $-12.17 Million
€185.61 Million
≈ $217.00 Million
-18.17pp
2004-12-31 12.56% €25.03 Million
≈ $29.26 Million
€199.25 Million
≈ $232.94 Million
+2.83pp
2003-12-31 9.73% €20.84 Million
≈ $24.36 Million
€214.23 Million
≈ $250.45 Million
-1.89pp
2000-12-31 11.62% €29.10 Million
≈ $34.02 Million
€250.46 Million
≈ $292.81 Million
--
pp = percentage points

About Aspocomp Group Oyj

HE:ACG1V Finland Electronic Components
Market Cap
$47.85 Million
€40.92 Million EUR
Market Cap Rank
#22995 Global
#116 in Finland
Share Price
€5.44
Change (1 day)
+1.12%
52-Week Range
€4.42 - €6.06
All Time High
€8.02
About

Aspocomp Group Oyj manufactures and sells printed circuit boards (PCBs) in Finland, Europe, and internationally. The company offers high speed digital, advanced high density interconnection, high layer count multilayer, heavy copper, and high frequency PCBs, as well as PCBs with component cooling for thermal management. It also provides quick turn around, design support, logistics, and global sup… Read more