Aspocomp Group Oyj - Asset Resilience Ratio

Latest as of September 2022: 7.39%

Aspocomp Group Oyj (ACG1V) has an Asset Resilience Ratio of 7.39% as of September 2022. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check how strategically is Aspocomp Group Oyj's equity deployed to assess the company's strategic physical and investment asset allocation.

Liquid Assets

€2.37 Million
≈ $2.77 Million USD Cash + Short-term Investments

Total Assets

€32.03 Million
≈ $37.45 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2000–2020)

This chart shows how Aspocomp Group Oyj's Asset Resilience Ratio has changed over time. See ACG1V equity to assets ratio to measure how much of total assets are equity-financed.

Liquid Assets Composition Over Time

This chart breaks down Aspocomp Group Oyj's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see ACG1V company net worth.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents €2.37 Million 7.39%
Short-term Investments €0.00 0%
Total Liquid Assets €2.37 Million 7.39%

Asset Resilience Insights

  • Limited Liquidity: Aspocomp Group Oyj maintains only 7.39% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company primarily holds liquidity in cash and equivalents rather than short-term investments.

Aspocomp Group Oyj Industry Peers by Asset Resilience Ratio

Compare Aspocomp Group Oyj's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Lens Technology Co Ltd
SHE:300433
Electronic Components 1.43%
Elite Material Co Ltd
TW:2383
Electronic Components 0.00%
FangDa Carbon New Material Co Ltd
SHG:600516
Electronic Components 4.27%
Holitech Technology Co Ltd
SHE:002217
Electronic Components 0.87%
Shenzhen Jufei Optoelectronics
SHE:300303
Electronic Components 19.39%
TXC Corp
TW:3042
Electronic Components 6.15%
Guangdong Ellington Electronics Technology Co Ltd
SHG:603328
Electronic Components 4.13%
Suzhou GYZ Electronic Technology Co. Ltd. A
SHG:688260
Electronic Components 3.19%

Annual Asset Resilience Ratio for Aspocomp Group Oyj (2000–2020)

The table below shows the annual Asset Resilience Ratio data for Aspocomp Group Oyj.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2020-12-31 10.39% €2.80 Million
≈ $3.27 Million
€26.95 Million
≈ $31.51 Million
+41.94pp
2018-12-31 -31.55% €-8.15 Million
≈ $-9.53 Million
€25.83 Million
≈ $30.20 Million
-33.76pp
2017-12-31 2.20% €384.00K
≈ $448.94K
€17.41 Million
≈ $20.36 Million
+2.20pp
2015-12-31 0.01% €1.00K
≈ $1.17K
€13.80 Million
≈ $16.13 Million
+0.01pp
2013-12-31 -0.01% €-1.00K
≈ $-1.17K
€17.81 Million
≈ $20.82 Million
+5.60pp
2005-12-31 -5.61% €-10.41 Million
≈ $-12.17 Million
€185.61 Million
≈ $217.00 Million
-18.17pp
2004-12-31 12.56% €25.03 Million
≈ $29.26 Million
€199.25 Million
≈ $232.94 Million
+2.83pp
2003-12-31 9.73% €20.84 Million
≈ $24.36 Million
€214.23 Million
≈ $250.45 Million
-1.89pp
2000-12-31 11.62% €29.10 Million
≈ $34.02 Million
€250.46 Million
≈ $292.81 Million
--
pp = percentage points

About Aspocomp Group Oyj

HE:ACG1V Finland Electronic Components
Market Cap
$44.85 Million
€38.37 Million EUR
Market Cap Rank
#22935 Global
#117 in Finland
Share Price
€5.10
Change (1 day)
+5.59%
52-Week Range
€4.42 - €6.06
All Time High
€8.02
About

Aspocomp Group Oyj manufactures and sells printed circuit boards (PCBs) in Finland, Europe, and internationally. The company offers high speed digital, advanced high density interconnection, high layer count multilayer, heavy copper, and high frequency PCBs, as well as PCBs with component cooling for thermal management. It also provides quick turn around, design support, logistics, and global sup… Read more