Aspocomp Group Oyj Asset Resilience Ratio
Aspocomp Group Oyj asset resilience ratio. Aspocomp Group Oyj (ACG1V) has an Asset Resilience Ratio of 7.39% as of September 2022. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Aspocomp Group Oyj defensive liquidity buffer to measure how many days the company can operate on defensive assets alone.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio of Aspocomp Group Oyj (2000–2020)
Asset resilience ratio of Aspocomp Group Oyj from 2000 to 2020. This chart shows how Aspocomp Group Oyj's Asset Resilience Ratio has changed over time. Read Aspocomp Group Oyj (ACG1V) financial obligations for a breakdown of total debt and financial obligations.
Liquid Assets Composition Over Time
This chart breaks down Aspocomp Group Oyj's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see Aspocomp Group Oyj assets under control.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | €2.37 Million | 7.39% |
| Short-term Investments | €0.00 | 0% |
| Total Liquid Assets | €2.37 Million | 7.39% |
Asset Resilience Insights
- Limited Liquidity: Aspocomp Group Oyj maintains only 7.39% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company primarily holds liquidity in cash and equivalents rather than short-term investments.
Aspocomp Group Oyj Industry Peers by Asset Resilience Ratio
Compare Aspocomp Group Oyj's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Nanya New Material Technology Co Ltd
SHG:688519 |
Electronic Components | 1.80% |
|
Guobo Electronics Co. Ltd. A
SHG:688375 |
Electronic Components | 2.57% |
|
Founder Technology Group Co Ltd
SHG:600601 |
Electronic Components | 0.00% |
|
Guangdong Kingshine Electronic Tech
SHE:300903 |
Electronic Components | 0.57% |
|
Leyard Optoelectronic
SHE:300296 |
Electronic Components | 0.10% |
|
Long Young Electronic (Kunshan) Co. Ltd. A
SHE:301389 |
Electronic Components | 27.28% |
|
Sichuan Furong Technology Co Ltd
SHG:603327 |
Electronic Components | 4.54% |
|
Ganzhou Yihao New Materials Co. Ltd. A
SHE:301176 |
Electronic Components | 0.03% |
Aspocomp Group Oyj Asset Resilience Ratio by Year (2000–2020)
Aspocomp Group Oyj asset resilience ratio by year from 2000 to 2020. The table below shows the annual Asset Resilience Ratio data for Aspocomp Group Oyj.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2020-12-31 | 10.39% | €2.80 Million ≈ $3.27 Million |
€26.95 Million ≈ $31.51 Million |
+41.94pp |
| 2018-12-31 | -31.55% | €-8.15 Million ≈ $-9.53 Million |
€25.83 Million ≈ $30.20 Million |
-33.76pp |
| 2017-12-31 | 2.20% | €384.00K ≈ $448.94K |
€17.41 Million ≈ $20.36 Million |
+2.20pp |
| 2015-12-31 | 0.01% | €1.00K ≈ $1.17K |
€13.80 Million ≈ $16.13 Million |
+0.01pp |
| 2013-12-31 | -0.01% | €-1.00K ≈ $-1.17K |
€17.81 Million ≈ $20.82 Million |
+5.60pp |
| 2005-12-31 | -5.61% | €-10.41 Million ≈ $-12.17 Million |
€185.61 Million ≈ $217.00 Million |
-18.17pp |
| 2004-12-31 | 12.56% | €25.03 Million ≈ $29.26 Million |
€199.25 Million ≈ $232.94 Million |
+2.83pp |
| 2003-12-31 | 9.73% | €20.84 Million ≈ $24.36 Million |
€214.23 Million ≈ $250.45 Million |
-1.89pp |
| 2000-12-31 | 11.62% | €29.10 Million ≈ $34.02 Million |
€250.46 Million ≈ $292.81 Million |
-- |
About Aspocomp Group Oyj
Aspocomp Group Oyj manufactures and sells printed circuit boards (PCBs) in Finland, Europe, and internationally. The company offers high speed digital, advanced high density interconnection, high layer count multilayer, heavy copper, and high frequency PCBs, as well as PCBs with component cooling for thermal management. It also provides quick turn around, design support, logistics, and global sup… Read more