Aurelius Technologies Bhd Total Liabilities

Latest as of April 2026: RM179.97 Million MYR ≈ $45.19 Million USD

Aurelius Technologies Bhd total liabilities. Based on the latest financial reports, Aurelius Technologies Bhd (5302) has total liabilities worth RM179.97 Million MYR (≈ $45.19 Million USD) as of April 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Aurelius Technologies Bhd liquidity resilience to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Aurelius Technologies Bhd (2019–2026)

Total liabilities of Aurelius Technologies Bhd from 2019 to 2026. This chart illustrates how Aurelius Technologies Bhd's total liabilities have evolved over time, based on quarterly financial data.

Aurelius Technologies Bhd Competitors by Total Liabilities

The table below lists competitors of Aurelius Technologies Bhd ranked by their total liabilities.

Company Country Total Liabilities
Bus Online Co Ltd
SHE:002188
China CN¥223.64 Million
Sinocat Environmental Technology Co Ltd
SHG:688737
China CN¥1.96 Billion
Cybin Inc. Common Stock
NYSE MKT:HELP
USA $22.20 Million
UNID Company Ltd
KO:014830
Korea ₩517.45 Billion
Dentium
KO:145720
Korea ₩371.58 Billion
Eaton Vance California MBF
NYSE MKT:EVM
USA $120.49 Million
Shanghai Jin Jiang International Hotels Development Co Ltd B
SHG:900934
China $30.00 Billion
Tanvex BioPharma Inc
TW:6541
Taiwan NT$2.27 Billion

Liability Composition Analysis (2019–2026)

This chart breaks down Aurelius Technologies Bhd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Aurelius Technologies Bhd asset portfolio.

Liquidity & Leverage Metrics

Aurelius Technologies Bhd Total Liabilities Ratios Explained

Aurelius Technologies Bhd total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 2.87 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.36 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.26 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Aurelius Technologies Bhd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Aurelius Technologies Bhd (2019–2026)

The table below shows the annual total liabilities of Aurelius Technologies Bhd from 2019 to 2026.

Year Total Liabilities Change
2026-01-31 RM200.52 Million
≈ $50.34 Million
+10.68%
2025-01-31 RM181.17 Million
≈ $45.49 Million
+13.89%
2024-01-31 RM159.08 Million
≈ $39.94 Million
-15.28%
2023-01-31 RM187.78 Million
≈ $47.14 Million
-10.55%
2022-01-31 RM209.93 Million
≈ $52.71 Million
+6.30%
2021-01-31 RM197.49 Million
≈ $49.58 Million
+11.52%
2020-01-31 RM177.08 Million
≈ $44.46 Million
+8.48%
2019-01-31 RM163.23 Million
≈ $40.98 Million
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About Aurelius Technologies Bhd

KLSE:5302 Malaysia Semiconductor Equipment & Materials
Market Cap
$233.49 Million
RM929.98 Million MYR
Market Cap Rank
#15760 Global
#193 in Malaysia
Share Price
RM0.72
Change (1 day)
+0.00%
52-Week Range
RM0.58 - RM1.05
All Time High
RM3.78
About

Aurelius Technologies Berhad, an investment holding company, offers electronic manufacturing services for industrial electronic products in the United States, Malaysia, the Asia-Pacific, and Europe. It offers manufacturing services, including printed circuit board assembly, sub-assembly, and box-build services; and system build products, as well as test development and testing, proto and NPI supp… Read more