Hebei Sinopack Electronic Technolog

SHE:003031 China Electronic Components
Market Cap
$5.29 Billion
CN¥38.80 Billion CNY
Market Cap Rank
#6182 Global
#919 in China
Share Price
CN¥86.03
Change (1 day)
+2.66%
52-Week Range
CN¥40.87 - CN¥86.03
All Time High
CN¥147.52
About

Hebei Sinopack Electronic Technology Co.,Ltd. develops, produces, and sells electronic ceramic products in China and internationally. The company operates in two segments, Third-Generation Semiconductor Devices and Modules, and Electronic Ceramic Materials and Components. The Third-Generation Semiconductor Devices and Modules provides nitride-based communication base station RF chips and devices … Read more

Hebei Sinopack Electronic Technolog (003031) - Total Liabilities

Latest total liabilities as of September 2025: CN¥1.50 Billion CNY

Based on the latest financial reports, Hebei Sinopack Electronic Technolog (003031) has total liabilities worth CN¥1.50 Billion CNY as of September 2025.

Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Hebei Sinopack Electronic Technolog - Total Liabilities Trend (2016–2024)

This chart illustrates how Hebei Sinopack Electronic Technolog's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.

Hebei Sinopack Electronic Technolog Competitors by Total Liabilities

The table below lists competitors of Hebei Sinopack Electronic Technolog ranked by their total liabilities.

Company Country Total Liabilities
Dime Community Bancshares Inc
NASDAQ:DCOM
USA $13.87 Billion
Shenzhen Clou Electronics Co Ltd
SHE:002121
China CN¥7.52 Billion
Shenzhen Jufei Optoelectronics
SHE:300303
China CN¥2.53 Billion
Asker Healthcare Group AB
F:I88
Germany €8.78 Billion
Lien Hwa Industrial Corp
TW:1229
Taiwan NT$19.38 Billion
Hamilton Insurance Group, Ltd.
NYSE:HG
USA $6.47 Billion
Pandox AB Series B
LSE:0R8U
UK Skr40.85 Billion

Liability Composition Analysis (2016–2024)

This chart breaks down Hebei Sinopack Electronic Technolog's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 4.79 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.24 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.18 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hebei Sinopack Electronic Technolog's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hebei Sinopack Electronic Technolog (2016–2024)

The table below shows the annual total liabilities of Hebei Sinopack Electronic Technolog from 2016 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥1.21 Billion -10.11%
2023-12-31 CN¥1.34 Billion +156.18%
2022-12-31 CN¥523.77 Million +27.08%
2021-12-31 CN¥412.17 Million +3.58%
2020-12-31 CN¥397.94 Million +55.52%
2019-12-31 CN¥255.87 Million +32.54%
2018-12-31 CN¥193.05 Million -12.99%
2017-12-31 CN¥221.87 Million +55.53%
2016-12-31 CN¥142.65 Million --