Hebei Sinopack Electronic Technolog (003031) - Total Liabilities
Based on the latest financial reports, Hebei Sinopack Electronic Technolog (003031) has total liabilities worth CN¥1.50 Billion CNY (≈ $219.45 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 003031 cash flow conversion to assess how effectively this company generates cash.
Hebei Sinopack Electronic Technolog - Total Liabilities Trend (2016–2024)
This chart illustrates how Hebei Sinopack Electronic Technolog's total liabilities have evolved over time, based on quarterly financial data. Check 003031 financial resilience to evaluate the company's liquid asset resilience ratio.
Hebei Sinopack Electronic Technolog Competitors by Total Liabilities
The table below lists competitors of Hebei Sinopack Electronic Technolog ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Zhejiang Jingsheng Mech Electric
SHE:300316
|
China | CN¥9.51 Billion |
|
StandardAero, Inc.
NYSE:SARO
|
USA | $3.89 Billion |
|
Snap Inc
NYSE:SNAP
|
USA | $5.40 Billion |
|
WT Microelectronics Co Ltd
TW:3036
|
Taiwan | NT$409.62 Billion |
|
Nordex SE
F:NDX1
|
Germany | €4.65 Billion |
|
NH Investment & Securities Co Ltd
KO:005940
|
Korea | ₩72.54 Trillion |
|
Persistent Systems Limited
NSE:PERSISTENT
|
India | Rs31.39 Billion |
Liability Composition Analysis (2016–2024)
This chart breaks down Hebei Sinopack Electronic Technolog's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 003031 market cap overview.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 4.79 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.24 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.18 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Hebei Sinopack Electronic Technolog's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Hebei Sinopack Electronic Technolog (2016–2024)
The table below shows the annual total liabilities of Hebei Sinopack Electronic Technolog from 2016 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥1.21 Billion ≈ $176.50 Million |
-10.11% |
| 2023-12-31 | CN¥1.34 Billion ≈ $196.35 Million |
+156.18% |
| 2022-12-31 | CN¥523.77 Million ≈ $76.64 Million |
+27.08% |
| 2021-12-31 | CN¥412.17 Million ≈ $60.31 Million |
+3.58% |
| 2020-12-31 | CN¥397.94 Million ≈ $58.23 Million |
+55.52% |
| 2019-12-31 | CN¥255.87 Million ≈ $37.44 Million |
+32.54% |
| 2018-12-31 | CN¥193.05 Million ≈ $28.25 Million |
-12.99% |
| 2017-12-31 | CN¥221.87 Million ≈ $32.47 Million |
+55.53% |
| 2016-12-31 | CN¥142.65 Million ≈ $20.87 Million |
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About Hebei Sinopack Electronic Technolog
Hebei Sinopack Electronic Technology Co.,Ltd. develops, produces, and sells electronic ceramic products in China and internationally. The company operates in two segments, Third-Generation Semiconductor Devices and Modules, and Electronic Ceramic Materials and Components. The Third-Generation Semiconductor Devices and Modules provides nitride-based communication base station RF chips and devices … Read more