Hebei Sinopack Electronic Technolog (003031) - Total Liabilities

Latest as of September 2025: CN¥1.50 Billion CNY ≈ $219.45 Million USD

Based on the latest financial reports, Hebei Sinopack Electronic Technolog (003031) has total liabilities worth CN¥1.50 Billion CNY (≈ $219.45 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore 003031 shareholders equity momentum to track the company's year-over-year net asset growth rate.

Hebei Sinopack Electronic Technolog - Total Liabilities Trend (2016–2024)

This chart illustrates how Hebei Sinopack Electronic Technolog's total liabilities have evolved over time, based on quarterly financial data. See 003031 FCF generation index to measure how efficiently the company converts operating cash flow to free cash.

Hebei Sinopack Electronic Technolog Competitors by Total Liabilities

The table below lists competitors of Hebei Sinopack Electronic Technolog ranked by their total liabilities.

Company Country Total Liabilities
Cleveland-Cliffs Inc
NYSE:CLF
USA $14.10 Billion
Archrock Inc
NYSE:AROC
USA $2.87 Billion
First International Bank of Israel Ltd
TA:FIBI
Israel ILA262.63 Billion
Open Text Corp
NASDAQ:OTEX
USA $9.52 Billion
Paylocity Holding Corporation
NASDAQ:PCTY
USA $4.26 Billion
PGE Polska Grupa Energetyczna SA
WAR:PGE
Poland zł61.79 Billion
Loongson Technology Corp. Ltd. A
SHG:688047
China CN¥609.38 Million
Apogee Therapeutics, Inc. Common Stock
NASDAQ:APGE
USA $37.86 Million

Liability Composition Analysis (2016–2024)

This chart breaks down Hebei Sinopack Electronic Technolog's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of Hebei Sinopack Electronic Technolog.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 4.79 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.24 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.18 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hebei Sinopack Electronic Technolog's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hebei Sinopack Electronic Technolog (2016–2024)

The table below shows the annual total liabilities of Hebei Sinopack Electronic Technolog from 2016 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥1.21 Billion
≈ $176.50 Million
-10.11%
2023-12-31 CN¥1.34 Billion
≈ $196.35 Million
+156.18%
2022-12-31 CN¥523.77 Million
≈ $76.64 Million
+27.08%
2021-12-31 CN¥412.17 Million
≈ $60.31 Million
+3.58%
2020-12-31 CN¥397.94 Million
≈ $58.23 Million
+55.52%
2019-12-31 CN¥255.87 Million
≈ $37.44 Million
+32.54%
2018-12-31 CN¥193.05 Million
≈ $28.25 Million
-12.99%
2017-12-31 CN¥221.87 Million
≈ $32.47 Million
+55.53%
2016-12-31 CN¥142.65 Million
≈ $20.87 Million
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About Hebei Sinopack Electronic Technolog

SHE:003031 China Electronic Components
Market Cap
$6.25 Billion
CN¥42.71 Billion CNY
Market Cap Rank
#3074 Global
#378 in China
Share Price
CN¥94.70
Change (1 day)
+3.95%
52-Week Range
CN¥50.37 - CN¥195.57
All Time High
CN¥195.57
About

Hebei Sinopack Electronic Technology Co.,Ltd. develops, produces, and sells electronic ceramic products in China and internationally. The company operates in two segments, Third-Generation Semiconductor Devices and Modules, and Electronic Ceramic Materials and Components. The Third-Generation Semiconductor Devices and Modules provides nitride-based communication base station RF chips and devices … Read more