Hebei Sinopack Electronic Technolog Asset Resilience Ratio

Latest as of September 2025: 8.84%

Hebei Sinopack Electronic Technolog asset resilience ratio. Hebei Sinopack Electronic Technolog (003031) has an Asset Resilience Ratio of 8.84% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read total liabilities of Hebei Sinopack Electronic Technolog for a breakdown of total debt and financial obligations.

Liquid Assets

CN¥722.74 Million
≈ $105.76 Million USD Cash + Short-term Investments

Total Assets

CN¥8.17 Billion
≈ $1.20 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio of Hebei Sinopack Electronic Technolog (2021–2024)

Asset resilience ratio of Hebei Sinopack Electronic Technolog from 2021 to 2024. This chart shows how Hebei Sinopack Electronic Technolog's Asset Resilience Ratio has changed over time. See cash generation quality of Hebei Sinopack Electronic Technolog to measure how efficiently the company converts operating cash flow to free cash.

Liquid Assets Composition Over Time

This chart breaks down Hebei Sinopack Electronic Technolog's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see Hebei Sinopack Electronic Technolog total assets.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥722.74 Million 8.84%
Total Liquid Assets CN¥722.74 Million 8.84%

Asset Resilience Insights

  • Limited Liquidity: Hebei Sinopack Electronic Technolog maintains only 8.84% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Hebei Sinopack Electronic Technolog Industry Peers by Asset Resilience Ratio

Compare Hebei Sinopack Electronic Technolog's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Tripod Technology Corp
TW:3044
Electronic Components 5.33%
Shenzhen Everwin Precision Tech
SHE:300115
Electronic Components 1.01%
FOSITEK CORP
TW:6805
Electronic Components 4.17%
Shanghai Wanye Enterprises Co Ltd
SHG:600641
Electronic Components 0.06%
Guizhou Space Appliance Co Ltd
SHE:002025
Electronic Components -0.32%
Shenzhen Suntak Circuit Technology Co Ltd
SHE:002815
Electronic Components 9.06%
TXC Corp
TW:3042
Electronic Components 6.15%
Shenzhen Jame Technology Corp Ltd
SHE:300868
Electronic Components 30.64%

Hebei Sinopack Electronic Technolog Asset Resilience Ratio by Year (2021–2024)

Hebei Sinopack Electronic Technolog asset resilience ratio by year from 2021 to 2024. The table below shows the annual Asset Resilience Ratio data for Hebei Sinopack Electronic Technolog.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 13.58% CN¥1.03 Billion
≈ $150.85 Million
CN¥7.59 Billion
≈ $1.11 Billion
+10.82pp
2023-12-31 2.76% CN¥200.03 Million
≈ $29.27 Million
CN¥7.25 Billion
≈ $1.06 Billion
-1.18pp
2022-12-31 3.94% CN¥70.12 Million
≈ $10.26 Million
CN¥1.78 Billion
≈ $260.39 Million
-11.32pp
2021-12-31 15.26% CN¥235.25 Million
≈ $34.42 Million
CN¥1.54 Billion
≈ $225.58 Million
--
pp = percentage points

About Hebei Sinopack Electronic Technolog

SHE:003031 China Electronic Components
Market Cap
$6.35 Billion
CN¥43.37 Billion CNY
Market Cap Rank
#2984 Global
#345 in China
Share Price
CN¥96.15
Change (1 day)
+0.23%
52-Week Range
CN¥50.37 - CN¥195.57
All Time High
CN¥195.57
About

Hebei Sinopack Electronic Technology Co.,Ltd. develops, produces, and sells electronic ceramic products in China and internationally. The company operates in two segments, Third-Generation Semiconductor Devices and Modules, and Electronic Ceramic Materials and Components. The Third-Generation Semiconductor Devices and Modules provides nitride-based communication base station RF chips and devices … Read more