Shenzhen Jove Enterprise Co. Ltd. (300814) - Total Liabilities
Based on the latest financial reports, Shenzhen Jove Enterprise Co. Ltd. (300814) has total liabilities worth CN¥1.61 Billion CNY (≈ $234.91 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore 300814 net assets growth trend to track the company's year-over-year net asset growth rate.
Shenzhen Jove Enterprise Co. Ltd. - Total Liabilities Trend (2017–2025)
This chart illustrates how Shenzhen Jove Enterprise Co. Ltd.'s total liabilities have evolved over time, based on quarterly financial data. See cash generation quality of Shenzhen Jove Enterprise Co. Ltd. to measure how efficiently the company converts operating cash flow to free cash.
Shenzhen Jove Enterprise Co. Ltd. Competitors by Total Liabilities
The table below lists competitors of Shenzhen Jove Enterprise Co. Ltd. ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
ArcBest Corp
NASDAQ:ARCB
|
USA | $1.17 Billion |
|
Indah Kiat Pulp & Paper Tbk
JK:INKP
|
Indonesia | Rp5.77 Billion |
|
ATS Corporation
NYSE:ATS
|
USA | $2.70 Billion |
|
Gold Road Resources Ltd
AU:GOR
|
Australia | AU$382.05 Million |
|
Viscofan
MC:VIS
|
Spain | €573.61 Million |
|
HMT(Xiamen)New Technical
SHG:603306
|
China | CN¥2.33 Billion |
|
Allos S.A.
SA:ALOS3
|
Brazil | R$11.81 Billion |
|
Sprott Inc.
TO:SII
|
Canada | CA$217.31 Million |
Liability Composition Analysis (2017–2025)
This chart breaks down Shenzhen Jove Enterprise Co. Ltd.'s total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 300814 market cap.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.22 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.98 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.49 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Shenzhen Jove Enterprise Co. Ltd.'s debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Shenzhen Jove Enterprise Co. Ltd. (2017–2025)
The table below shows the annual total liabilities of Shenzhen Jove Enterprise Co. Ltd. from 2017 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥1.62 Billion ≈ $237.32 Million |
-9.44% |
| 2024-12-31 | CN¥1.79 Billion ≈ $262.06 Million |
+62.76% |
| 2023-12-31 | CN¥1.10 Billion ≈ $161.01 Million |
+51.83% |
| 2022-12-31 | CN¥724.71 Million ≈ $106.05 Million |
-5.54% |
| 2021-12-31 | CN¥767.23 Million ≈ $112.27 Million |
+87.40% |
| 2020-12-31 | CN¥409.42 Million ≈ $59.91 Million |
-18.09% |
| 2019-12-31 | CN¥499.86 Million ≈ $73.14 Million |
+35.78% |
| 2018-12-31 | CN¥368.15 Million ≈ $53.87 Million |
-11.06% |
| 2017-12-31 | CN¥413.93 Million ≈ $60.57 Million |
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About Shenzhen Jove Enterprise Co. Ltd.
Shenzhen Jove Enterprise Limited, together with its subsidiaries, engages in the research and development, production, and sales of printed circuit boards (PCB) in China and internationally. The company offers multilayer PCBs, which are used in power control systems, servers, electric vehicles, medical devices, and 5G base stations; high-density interconnect PCBs to connect various components in … Read more