Shenzhen Jove Enterprise Co. Ltd. (300814) - Total Liabilities

Latest as of March 2026: CN¥1.61 Billion CNY ≈ $234.91 Million USD

Based on the latest financial reports, Shenzhen Jove Enterprise Co. Ltd. (300814) has total liabilities worth CN¥1.61 Billion CNY (≈ $234.91 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Shenzhen Jove Enterprise Co. Ltd. - Total Liabilities Trend (2017–2025)

This chart illustrates how Shenzhen Jove Enterprise Co. Ltd.'s total liabilities have evolved over time, based on quarterly financial data. See 300814 current assets to equity ratio to evaluate short-term liquidity relative to the company's equity base.

Shenzhen Jove Enterprise Co. Ltd. Competitors by Total Liabilities

The table below lists competitors of Shenzhen Jove Enterprise Co. Ltd. ranked by their total liabilities.

Company Country Total Liabilities
USA Rare Earth, Inc.
NASDAQ:USAR
USA $200.71 Million
Kanzhun Ltd ADR
NASDAQ:BZ
USA $4.49 Billion
Vipshop Holdings Limited
F:1VPA
Germany €34.40 Billion
Ningbo Ginlong Technologies Co Ltd Class A
SHE:300763
China CN¥9.85 Billion
Taiwan Business Bank
TW:2834
Taiwan NT$2.36 Trillion
Wangsu Science Tech
SHE:300017
China CN¥1.85 Billion
Virtu Financial, Inc.
NYSE:VIRT
USA $18.18 Billion
Geovis Technology Co Ltd
SHG:688568
China CN¥3.79 Billion

Liability Composition Analysis (2017–2025)

This chart breaks down Shenzhen Jove Enterprise Co. Ltd.'s total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 300814 market cap.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.22 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.98 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.49 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Shenzhen Jove Enterprise Co. Ltd.'s debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Shenzhen Jove Enterprise Co. Ltd. (2017–2025)

The table below shows the annual total liabilities of Shenzhen Jove Enterprise Co. Ltd. from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥1.62 Billion
≈ $237.32 Million
-9.44%
2024-12-31 CN¥1.79 Billion
≈ $262.06 Million
+62.76%
2023-12-31 CN¥1.10 Billion
≈ $161.01 Million
+51.83%
2022-12-31 CN¥724.71 Million
≈ $106.05 Million
-5.54%
2021-12-31 CN¥767.23 Million
≈ $112.27 Million
+87.40%
2020-12-31 CN¥409.42 Million
≈ $59.91 Million
-18.09%
2019-12-31 CN¥499.86 Million
≈ $73.14 Million
+35.78%
2018-12-31 CN¥368.15 Million
≈ $53.87 Million
-11.06%
2017-12-31 CN¥413.93 Million
≈ $60.57 Million
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About Shenzhen Jove Enterprise Co. Ltd.

SHE:300814 China Electronic Components
Market Cap
$5.36 Billion
CN¥36.62 Billion CNY
Market Cap Rank
#3458 Global
#504 in China
Share Price
CN¥191.30
Change (1 day)
+6.13%
52-Week Range
CN¥32.26 - CN¥191.30
All Time High
CN¥191.30
About

Shenzhen Jove Enterprise Limited, together with its subsidiaries, engages in the research and development, production, and sales of printed circuit boards (PCB) in China and internationally. The company offers multilayer PCBs, which are used in power control systems, servers, electric vehicles, medical devices, and 5G base stations; high-density interconnect PCBs to connect various components in … Read more