Shenzhen Jove Enterprise Co. Ltd. - Asset Resilience Ratio
Shenzhen Jove Enterprise Co. Ltd. (300814) has an Asset Resilience Ratio of 0.62% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Shenzhen Jove Enterprise Co. Ltd. leverage flexibility ratio to measure the company's free cash flow as a share of total liabilities.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2017–2025)
This chart shows how Shenzhen Jove Enterprise Co. Ltd.'s Asset Resilience Ratio has changed over time. See Shenzhen Jove Enterprise Co. Ltd. balance sheet independence to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Shenzhen Jove Enterprise Co. Ltd.'s liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Shenzhen Jove Enterprise Co. Ltd. (300814) total market value.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥20.00 Million | 0.62% |
| Total Liquid Assets | CN¥20.00 Million | 0.62% |
Asset Resilience Insights
- Limited Liquidity: Shenzhen Jove Enterprise Co. Ltd. maintains only 0.62% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Shenzhen Jove Enterprise Co. Ltd. Industry Peers by Asset Resilience Ratio
Compare Shenzhen Jove Enterprise Co. Ltd.'s asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Lens Technology Co Ltd
SHE:300433 |
Electronic Components | 1.43% |
|
Elite Material Co Ltd
TW:2383 |
Electronic Components | 0.00% |
|
FangDa Carbon New Material Co Ltd
SHG:600516 |
Electronic Components | 4.27% |
|
Holitech Technology Co Ltd
SHE:002217 |
Electronic Components | 0.87% |
|
Shenzhen Jufei Optoelectronics
SHE:300303 |
Electronic Components | 19.39% |
|
TXC Corp
TW:3042 |
Electronic Components | 6.15% |
|
Guangdong Ellington Electronics Technology Co Ltd
SHG:603328 |
Electronic Components | 4.13% |
|
Suzhou GYZ Electronic Technology Co. Ltd. A
SHG:688260 |
Electronic Components | 3.19% |
Annual Asset Resilience Ratio for Shenzhen Jove Enterprise Co. Ltd. (2017–2025)
The table below shows the annual Asset Resilience Ratio data for Shenzhen Jove Enterprise Co. Ltd..
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 0.61% | CN¥20.00 Million ≈ $2.93 Million |
CN¥3.27 Billion ≈ $478.75 Million |
+0.37pp |
| 2024-12-31 | 0.24% | CN¥7.19 Million ≈ $1.05 Million |
CN¥2.99 Billion ≈ $436.98 Million |
-11.03pp |
| 2023-12-31 | 11.27% | CN¥255.07 Million ≈ $37.32 Million |
CN¥2.26 Billion ≈ $331.06 Million |
+8.79pp |
| 2022-12-31 | 2.48% | CN¥46.00 Million ≈ $6.73 Million |
CN¥1.85 Billion ≈ $271.15 Million |
-4.76pp |
| 2021-12-31 | 7.24% | CN¥132.00 Million ≈ $19.32 Million |
CN¥1.82 Billion ≈ $266.64 Million |
+4.23pp |
| 2019-12-31 | 3.01% | CN¥31.00 Million ≈ $4.54 Million |
CN¥1.03 Billion ≈ $150.58 Million |
-1.45pp |
| 2018-12-31 | 4.46% | CN¥34.83 Million ≈ $5.10 Million |
CN¥780.43 Million ≈ $114.20 Million |
+1.34pp |
| 2017-12-31 | 3.13% | CN¥23.18 Million ≈ $3.39 Million |
CN¥741.15 Million ≈ $108.45 Million |
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About Shenzhen Jove Enterprise Co. Ltd.
Shenzhen Jove Enterprise Limited, together with its subsidiaries, engages in the research and development, production, and sales of printed circuit boards (PCB) in China and internationally. The company offers multilayer PCBs, which are used in power control systems, servers, electric vehicles, medical devices, and 5G base stations; high-density interconnect PCBs to connect various components in … Read more