Shenzhen Edadoc Technology Co. Ltd. A
Shenzhen Edadoc Technology Co.,Ltd. provides printed circuit board (PCB) design and PCB assembly manufacturing services in China and internationally. The company also offers simulation analysis services, such as DDRx simulation, high speed serial interface, power integrity simulation, SiP design, universal standard fixtures, and customized test fixtures; PCB board making; SMT welding products, in… Read more
Shenzhen Edadoc Technology Co. Ltd. A (301366) - Total Liabilities
Latest total liabilities as of June 2025: CN¥621.62 Million CNY
Based on the latest financial reports, Shenzhen Edadoc Technology Co. Ltd. A (301366) has total liabilities worth CN¥621.62 Million CNY as of June 2025.
Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Shenzhen Edadoc Technology Co. Ltd. A - Total Liabilities Trend (2019–2024)
This chart illustrates how Shenzhen Edadoc Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.
Shenzhen Edadoc Technology Co. Ltd. A Competitors by Total Liabilities
The table below lists competitors of Shenzhen Edadoc Technology Co. Ltd. A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Lotte Chemical Corp
KO:011170
|
Korea | ₩14.51 Trillion |
|
Standard Foods Corp
TW:1227
|
Taiwan | NT$9.26 Billion |
|
Weave Communications Inc
NYSE:WEAV
|
USA | $127.85 Million |
|
KAISA JiaYun Technology Inc
SHE:300242
|
China | CN¥144.03 Million |
|
Anyang Iron & Steel Inc
SHG:600569
|
China | CN¥41.67 Billion |
|
uPI Semiconductor Corp
TW:6719
|
Taiwan | NT$2.87 Billion |
Liability Composition Analysis (2019–2024)
This chart breaks down Shenzhen Edadoc Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 3.74 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.29 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.23 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Shenzhen Edadoc Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Shenzhen Edadoc Technology Co. Ltd. A (2019–2024)
The table below shows the annual total liabilities of Shenzhen Edadoc Technology Co. Ltd. A from 2019 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥555.13 Million | +14.58% |
| 2023-12-31 | CN¥484.50 Million | +87.55% |
| 2022-12-31 | CN¥258.34 Million | +3.85% |
| 2021-12-31 | CN¥248.76 Million | +60.32% |
| 2020-12-31 | CN¥155.16 Million | +25.23% |
| 2019-12-31 | CN¥123.90 Million | -- |