Shenzhen Edadoc Technology Co. Ltd. A - Asset Resilience Ratio

Latest as of June 2025: 21.51%

Shenzhen Edadoc Technology Co. Ltd. A (301366) has an Asset Resilience Ratio of 21.51% as of June 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.

Liquid Assets

CN¥590.25 Million
≈ $86.37 Million USD Cash + Short-term Investments

Total Assets

CN¥2.74 Billion
≈ $401.63 Million USD All company assets

Resilience Assessment

Good
Financial Resilience Level

Asset Resilience Ratio Trend (2019–2024)

This chart shows how Shenzhen Edadoc Technology Co. Ltd. A's Asset Resilience Ratio has changed over time. See Shenzhen Edadoc Technology Co. Ltd. A financial flexibility index to measure the company's free cash flow as a share of total liabilities.

Liquid Assets Composition Over Time

This chart breaks down Shenzhen Edadoc Technology Co. Ltd. A's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see market value of Shenzhen Edadoc Technology Co. Ltd. A.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥590.25 Million 21.51%
Total Liquid Assets CN¥590.25 Million 21.51%

Asset Resilience Insights

  • Good Liquidity Position: Shenzhen Edadoc Technology Co. Ltd. A maintains a healthy 21.51% of assets in liquid form.
  • This level provides good financial flexibility while maintaining productive asset deployment.
  • The company has significant short-term investments, indicating active treasury management.

Shenzhen Edadoc Technology Co. Ltd. A Industry Peers by Asset Resilience Ratio

Compare Shenzhen Edadoc Technology Co. Ltd. A's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Taiwan Union Technology
TWO:6274
Electronic Components 8.46%
Anhui Tongguan Copper Foil Group Co. Ltd.
SHE:301217
Electronic Components 6.54%
Guangdong Fenghua Advanced Technology Holding Co Ltd
SHE:000636
Electronic Components 0.29%
WT Microelectronics Co Ltd
TW:3036
Electronic Components 0.05%
Zhejiang Crystal Optech Co Ltd
SHE:002273
Electronic Components 4.91%
Olympic Circuit Technology Co Ltd
SHG:603920
Electronic Components 23.19%
Guangdong Kingshine Electronic Tech
SHE:300903
Electronic Components 3.02%
Poco Holding Co Ltd
SHE:300811
Electronic Components 6.41%

Annual Asset Resilience Ratio for Shenzhen Edadoc Technology Co. Ltd. A (2019–2024)

The table below shows the annual Asset Resilience Ratio data for Shenzhen Edadoc Technology Co. Ltd. A.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 14.96% CN¥419.47 Million
≈ $61.38 Million
CN¥2.80 Billion
≈ $410.43 Million
-3.78pp
2023-12-31 18.74% CN¥507.99 Million
≈ $74.33 Million
CN¥2.71 Billion
≈ $396.74 Million
-31.45pp
2022-12-31 50.19% CN¥1.18 Billion
≈ $172.49 Million
CN¥2.35 Billion
≈ $343.67 Million
+39.03pp
2021-12-31 11.16% CN¥110.80 Million
≈ $16.21 Million
CN¥992.72 Million
≈ $145.27 Million
-15.01pp
2020-12-31 26.18% CN¥194.47 Million
≈ $28.46 Million
CN¥742.94 Million
≈ $108.72 Million
-2.46pp
2019-12-31 28.64% CN¥141.00 Million
≈ $20.63 Million
CN¥492.34 Million
≈ $72.04 Million
--
pp = percentage points

About Shenzhen Edadoc Technology Co. Ltd. A

SHE:301366 China Electronic Components
Market Cap
$1.34 Billion
CN¥9.17 Billion CNY
Market Cap Rank
#7566 Global
#1644 in China
Share Price
CN¥43.75
Change (1 day)
+7.81%
52-Week Range
CN¥30.01 - CN¥62.84
All Time High
CN¥72.30
About

Shenzhen Edadoc Technology Co.,Ltd. provides printed circuit board (PCB) design and PCB assembly manufacturing services in China and internationally. The company also offers simulation analysis services, such as DDRx simulation, high speed serial interface, power integrity simulation, SiP design, universal standard fixtures, and customized test fixtures; PCB board making; SMT welding products, in… Read more