Shenzhen Edadoc Technology Co. Ltd. A (301366) - Total Liabilities

Latest as of June 2025: CN¥621.62 Million CNY ≈ $90.96 Million USD

Based on the latest financial reports, Shenzhen Edadoc Technology Co. Ltd. A (301366) has total liabilities worth CN¥621.62 Million CNY (≈ $90.96 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Shenzhen Edadoc Technology Co. Ltd. A - Total Liabilities Trend (2019–2024)

This chart illustrates how Shenzhen Edadoc Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See 301366 working capital efficiency to evaluate short-term liquidity relative to the company's equity base.

Shenzhen Edadoc Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Shenzhen Edadoc Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
SALZGITTER UNSP.ADR 1/10
F:SZGA
Germany €6.16 Billion
TX Group AG
SW:TXGN
Switzerland CHF797.00 Million
Shenzhen Heungkong Holding Co Ltd
SHG:600162
China CN¥10.77 Billion
Viridian Therapeutics Inc
NASDAQ:VRDN
USA $153.01 Million
Natco Pharma Limited
NSE:NATCOPHARM
India Rs17.76 Billion
Companhia Siderurgica Nacional ADR
NYSE:SID
USA $15.67 Billion
YY Inc Class A
NASDAQ:YY
USA $2.76 Billion
Federal Agricultural Mortgage Corporation
NYSE:AGM
USA $35.01 Billion

Liability Composition Analysis (2019–2024)

This chart breaks down Shenzhen Edadoc Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 301366 market cap.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.74 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.29 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.23 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Shenzhen Edadoc Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Shenzhen Edadoc Technology Co. Ltd. A (2019–2024)

The table below shows the annual total liabilities of Shenzhen Edadoc Technology Co. Ltd. A from 2019 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥555.13 Million
≈ $81.23 Million
+14.58%
2023-12-31 CN¥484.50 Million
≈ $70.90 Million
+87.55%
2022-12-31 CN¥258.34 Million
≈ $37.80 Million
+3.85%
2021-12-31 CN¥248.76 Million
≈ $36.40 Million
+60.32%
2020-12-31 CN¥155.16 Million
≈ $22.70 Million
+25.23%
2019-12-31 CN¥123.90 Million
≈ $18.13 Million
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About Shenzhen Edadoc Technology Co. Ltd. A

SHE:301366 China Electronic Components
Market Cap
$1.71 Billion
CN¥11.70 Billion CNY
Market Cap Rank
#6847 Global
#1528 in China
Share Price
CN¥55.82
Change (1 day)
-4.09%
52-Week Range
CN¥30.01 - CN¥58.20
All Time High
CN¥72.30
About

Shenzhen Edadoc Technology Co.,Ltd. provides printed circuit board (PCB) design and PCB assembly manufacturing services in China and internationally. The company also offers simulation analysis services, such as DDRx simulation, high speed serial interface, power integrity simulation, SiP design, universal standard fixtures, and customized test fixtures; PCB board making; SMT welding products, in… Read more