Suzhou Delphi Laser Co. Ltd. A (688170) - Total Liabilities

Latest as of June 2026: CN¥715.71 Million CNY ≈ $104.73 Million USD

Based on the latest financial reports, Suzhou Delphi Laser Co. Ltd. A (688170) has total liabilities worth CN¥715.71 Million CNY (≈ $104.73 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Suzhou Delphi Laser Co. Ltd. A (688170) liquid assets ratio to evaluate the company's liquid asset resilience ratio.

Suzhou Delphi Laser Co. Ltd. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Suzhou Delphi Laser Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see balance sheet size of Suzhou Delphi Laser Co. Ltd. A.

Suzhou Delphi Laser Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Suzhou Delphi Laser Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Lumexa Imaging Holdings, Inc. Common Stock
NASDAQ:LMRI
USA $1.19 Billion
Olectra Greentech Limited
NSE:OLECTRA
India Rs12.39 Billion
Tekla Healthcare Investors
NYSE:HQH
USA $3.43 Million
Jupiter Wagons Limited
NSE:JWL
India Rs17.26 Billion
Dongwon Ind
KO:006040
Korea ₩4.13 Trillion
Metsa Board Oyj B
HE:METSB
Finland €1.14 Billion
AcadeMedia AB (publ)
ST:ACAD
Sweden Skr16.12 Billion
Asseco South Eastern Europe S.A.
WAR:ASE
Poland zł1.30 Billion

Liability Composition Analysis (2020–2025)

This chart breaks down Suzhou Delphi Laser Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Suzhou Delphi Laser Co. Ltd. A net asset quality index to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.07 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.59 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.37 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Suzhou Delphi Laser Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Suzhou Delphi Laser Co. Ltd. A (2020–2025)

The table below shows the annual total liabilities of Suzhou Delphi Laser Co. Ltd. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥514.82 Million
≈ $75.33 Million
-14.46%
2024-12-31 CN¥601.83 Million
≈ $88.07 Million
+37.53%
2023-12-31 CN¥437.59 Million
≈ $64.03 Million
+43.80%
2022-12-31 CN¥304.30 Million
≈ $44.53 Million
-22.07%
2021-12-31 CN¥390.47 Million
≈ $57.14 Million
+18.58%
2020-12-31 CN¥329.30 Million
≈ $48.19 Million
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About Suzhou Delphi Laser Co. Ltd. A

SHG:688170 China Specialty Industrial Machinery
Market Cap
$1.06 Billion
CN¥7.27 Billion CNY
Market Cap Rank
#8667 Global
#2079 in China
Share Price
CN¥70.32
Change (1 day)
-1.47%
52-Week Range
CN¥30.02 - CN¥96.01
All Time High
CN¥96.01
About

Suzhou Delphi Laser Co., Ltd. engages in the research, development, manufacture, and sale of industrial precision laser processing equipment and lasers in China and internationally. The company offers laser scribing, laser grooving, silicon carbide ingot slicing, silicon carbide laser annealing, and laser blind dicing equipment for various wafer materials; laser cutting, marking, drilling, etchin… Read more