Suzhou Delphi Laser Co. Ltd. A (688170) - Total Liabilities

Latest as of June 2025: CN¥566.84 Million CNY ≈ $82.95 Million USD

Based on the latest financial reports, Suzhou Delphi Laser Co. Ltd. A (688170) has total liabilities worth CN¥566.84 Million CNY (≈ $82.95 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Suzhou Delphi Laser Co. Ltd. A cash conversion from operations to assess how effectively this company generates cash.

Suzhou Delphi Laser Co. Ltd. A - Total Liabilities Trend (2020–2024)

This chart illustrates how Suzhou Delphi Laser Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. Check Suzhou Delphi Laser Co. Ltd. A liquid asset ratio to evaluate the company's liquid asset resilience ratio.

Suzhou Delphi Laser Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Suzhou Delphi Laser Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
MORIMATSU INT.H.C. (HK)
F:1S5
Germany €4.14 Billion
Hunan Airbluer Environmental Protection Technology Co. Ltd.
SHE:301259
China CN¥712.45 Million
New Pacific Metals Corp
TO:NUAG
Canada CA$1.33 Million
Jastrzebska Spotka Weglowa SA
WAR:JSW
Poland zł9.54 Billion
Cydsa S.A.B. de C.V
MX:CYDSASAA
Mexico MX$19.40 Billion
Emei Shan Tourism Co Ltd
SHE:000888
China CN¥875.52 Million
Dongfeng Electronic Technology Co Ltd
SHG:600081
China CN¥4.54 Billion
Shenzhen Zhongzhuang Construction Group Co Ltd
SHE:002822
China CN¥4.44 Billion

Liability Composition Analysis (2020–2024)

This chart breaks down Suzhou Delphi Laser Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Suzhou Delphi Laser Co. Ltd. A market cap and net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.51 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.47 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.32 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Suzhou Delphi Laser Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Suzhou Delphi Laser Co. Ltd. A (2020–2024)

The table below shows the annual total liabilities of Suzhou Delphi Laser Co. Ltd. A from 2020 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥601.83 Million
≈ $88.07 Million
+37.53%
2023-12-31 CN¥437.59 Million
≈ $64.03 Million
+43.80%
2022-12-31 CN¥304.30 Million
≈ $44.53 Million
-22.07%
2021-12-31 CN¥390.47 Million
≈ $57.14 Million
+18.58%
2020-12-31 CN¥329.30 Million
≈ $48.19 Million
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About Suzhou Delphi Laser Co. Ltd. A

SHG:688170 China Specialty Industrial Machinery
Market Cap
$914.45 Million
CN¥6.25 Billion CNY
Market Cap Rank
#9500 Global
#2629 in China
Share Price
CN¥60.46
Change (1 day)
+3.09%
52-Week Range
CN¥21.10 - CN¥63.10
All Time High
CN¥67.48
About

Suzhou Delphi Laser Co., Ltd. engages in the research and development, manufacture, and sale of precision laser processing equipment and its components, and lasers in China and internationally. The company offers laser scribing, wafer laser grooving, silicon carbide ingot slicing, and silicon carbide laser annealing of various wafer materials; laser cutting, marking, drilling, etching, repairing,… Read more