Suzhou Delphi Laser Co. Ltd. A Total Liabilities

Latest as of June 2026: CN¥715.71 Million CNY ≈ $104.73 Million USD

Suzhou Delphi Laser Co. Ltd. A total liabilities. Based on the latest financial reports, Suzhou Delphi Laser Co. Ltd. A (688170) has total liabilities worth CN¥715.71 Million CNY (≈ $104.73 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check 688170 cash and liquid asset ratio to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Suzhou Delphi Laser Co. Ltd. A (2020–2025)

Total liabilities of Suzhou Delphi Laser Co. Ltd. A from 2020 to 2025. This chart illustrates how Suzhou Delphi Laser Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data.

Suzhou Delphi Laser Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Suzhou Delphi Laser Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Great-Sun Foods Co Ltd
SHG:603336
China CN¥341.42 Million
EcoRodovias Infraestrutura e Logística S.A
SA:ECOR3
Brazil R$35.19 Billion
Foosung
KO:093370
Korea ₩438.14 Billion
TSRC Corp
TW:2103
Taiwan NT$24.13 Billion
JSE Limited
JSE:JSE
South Africa ZAC62.48 Billion
Shenzhen Anche Technologies Co Ltd
SHE:300572
China CN¥650.57 Million
Dilip Buildcon Limited
NSE:DBL
India Rs144.99 Billion

Liability Composition Analysis (2020–2025)

This chart breaks down Suzhou Delphi Laser Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Suzhou Delphi Laser Co. Ltd. A total assets.

Liquidity & Leverage Metrics

Suzhou Delphi Laser Co. Ltd. A Total Liabilities Ratios Explained

Suzhou Delphi Laser Co. Ltd. A total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 2.07 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.59 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.37 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Suzhou Delphi Laser Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Suzhou Delphi Laser Co. Ltd. A (2020–2025)

The table below shows the annual total liabilities of Suzhou Delphi Laser Co. Ltd. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥514.82 Million
≈ $75.33 Million
-14.46%
2024-12-31 CN¥601.83 Million
≈ $88.07 Million
+37.53%
2023-12-31 CN¥437.59 Million
≈ $64.03 Million
+43.80%
2022-12-31 CN¥304.30 Million
≈ $44.53 Million
-22.07%
2021-12-31 CN¥390.47 Million
≈ $57.14 Million
+18.58%
2020-12-31 CN¥329.30 Million
≈ $48.19 Million
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About Suzhou Delphi Laser Co. Ltd. A

SHG:688170 China Specialty Industrial Machinery
Market Cap
$668.52 Million
CN¥4.57 Billion CNY
Market Cap Rank
#10423 Global
#2734 in China
Share Price
CN¥44.20
Change (1 day)
-6.10%
52-Week Range
CN¥30.02 - CN¥96.01
All Time High
CN¥96.01
About

Suzhou Delphi Laser Co., Ltd. engages in the research, development, manufacture, and sale of industrial precision laser processing equipment and lasers in China and internationally. The company offers laser scribing, laser grooving, silicon carbide ingot slicing, silicon carbide laser annealing, and laser blind dicing equipment for various wafer materials; laser cutting, marking, drilling, etchin… Read more