Suzhou Delphi Laser Co. Ltd. A (688170) - Total Liabilities

Latest as of March 2026: CN¥554.96 Million CNY ≈ $81.21 Million USD

Based on the latest financial reports, Suzhou Delphi Laser Co. Ltd. A (688170) has total liabilities worth CN¥554.96 Million CNY (≈ $81.21 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore 688170 net asset momentum to track the company's year-over-year net asset growth rate.

Suzhou Delphi Laser Co. Ltd. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Suzhou Delphi Laser Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See Suzhou Delphi Laser Co. Ltd. A free cash flow ratio to measure how efficiently the company converts operating cash flow to free cash.

Suzhou Delphi Laser Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Suzhou Delphi Laser Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Shenzhen Worldunion Properties Consultancy Inc
SHE:002285
China CN¥1.03 Billion
Tungkong Inc
SHE:002117
China CN¥458.23 Million
First Hi-tec Enterprise Co Ltd
TWO:5439
Taiwan NT$7.77 Billion
HomeTrust Bancshares, Inc.
NASDAQ:HTB
USA $3.99 Billion
Total Energy Services Inc.
TO:TOT
Canada CA$446.23 Million
COFCO Engineering & Technology Co Ltd
SHE:301058
China CN¥2.26 Billion
Akfen Yenilenebilir Enerji A.S.
IS:AKFYE
Turkey TL16.84 Billion
Personalis Inc
NASDAQ:PSNL
USA $70.63 Million

Liability Composition Analysis (2020–2025)

This chart breaks down Suzhou Delphi Laser Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 688170 stock market capitalisation.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.47 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.45 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.31 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Suzhou Delphi Laser Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Suzhou Delphi Laser Co. Ltd. A (2020–2025)

The table below shows the annual total liabilities of Suzhou Delphi Laser Co. Ltd. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥514.82 Million
≈ $75.33 Million
-14.46%
2024-12-31 CN¥601.83 Million
≈ $88.07 Million
+37.53%
2023-12-31 CN¥437.59 Million
≈ $64.03 Million
+43.80%
2022-12-31 CN¥304.30 Million
≈ $44.53 Million
-22.07%
2021-12-31 CN¥390.47 Million
≈ $57.14 Million
+18.58%
2020-12-31 CN¥329.30 Million
≈ $48.19 Million
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About Suzhou Delphi Laser Co. Ltd. A

SHG:688170 China Specialty Industrial Machinery
Market Cap
$626.77 Million
CN¥4.28 Billion CNY
Market Cap Rank
#10969 Global
#2979 in China
Share Price
CN¥41.44
Change (1 day)
-5.24%
52-Week Range
CN¥30.02 - CN¥96.01
All Time High
CN¥96.01
About

Suzhou Delphi Laser Co., Ltd. engages in the research and development, manufacture, and sale of precision laser processing equipment and its components, and lasers in China and internationally. The company offers laser scribing, wafer laser grooving, silicon carbide ingot slicing, and silicon carbide laser annealing of various wafer materials; laser cutting, marking, drilling, etching, repairing,… Read more