Hefei Chipmore Technology Co. Ltd. A (688352) - Total Liabilities
Based on the latest financial reports, Hefei Chipmore Technology Co. Ltd. A (688352) has total liabilities worth CN¥2.14 Billion CNY (≈ $313.42 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Hefei Chipmore Technology Co. Ltd. A - Total Liabilities Trend (2021–2025)
This chart illustrates how Hefei Chipmore Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See 688352 working capital efficiency to evaluate short-term liquidity relative to the company's equity base.
Hefei Chipmore Technology Co. Ltd. A Competitors by Total Liabilities
The table below lists competitors of Hefei Chipmore Technology Co. Ltd. A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
ATHENS INTERNATIONAL AIRPORT S.
AT:AIA
|
Greece | €1.41 Billion |
|
Loomis AB ser. B
ST:LOOMIS
|
Sweden | Skr25.51 Billion |
|
Beam Therapeutics Inc
NASDAQ:BEAM
|
USA | $316.36 Million |
|
China Railway Construction Heavy Industry Corp Ltd
SHG:688425
|
China | CN¥8.48 Billion |
|
Guangdong HongDa Blasting Co Ltd
SHE:002683
|
China | CN¥16.94 Billion |
|
PPB Group Bhd
KLSE:4065
|
Malaysia | RM1.37 Billion |
|
Amedisys Inc
NASDAQ:AMED
|
USA | $940.48 Million |
|
Shanghai Suochen Information Technology Co. Ltd. A
SHG:688507
|
China | CN¥545.11 Million |
Liability Composition Analysis (2021–2025)
This chart breaks down Hefei Chipmore Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of Hefei Chipmore Technology Co. Ltd. A.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 3.98 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.37 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.27 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Hefei Chipmore Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Hefei Chipmore Technology Co. Ltd. A (2021–2025)
The table below shows the annual total liabilities of Hefei Chipmore Technology Co. Ltd. A from 2021 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥1.89 Billion ≈ $275.88 Million |
+90.87% |
| 2024-12-31 | CN¥987.72 Million ≈ $144.53 Million |
-25.35% |
| 2023-12-31 | CN¥1.32 Billion ≈ $193.63 Million |
-17.29% |
| 2022-12-31 | CN¥1.60 Billion ≈ $234.10 Million |
+6.14% |
| 2021-12-31 | CN¥1.51 Billion ≈ $220.56 Million |
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About Hefei Chipmore Technology Co. Ltd. A
Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more