Hefei Chipmore Technology Co. Ltd. A (688352) - Total Liabilities

Latest as of March 2026: CN¥2.14 Billion CNY ≈ $313.42 Million USD

Based on the latest financial reports, Hefei Chipmore Technology Co. Ltd. A (688352) has total liabilities worth CN¥2.14 Billion CNY (≈ $313.42 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Hefei Chipmore Technology Co. Ltd. A (688352) asset resilience to evaluate the company's liquid asset resilience ratio.

Hefei Chipmore Technology Co. Ltd. A - Total Liabilities Trend (2021–2025)

This chart illustrates how Hefei Chipmore Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see Hefei Chipmore Technology Co. Ltd. A (688352) total assets.

Hefei Chipmore Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Hefei Chipmore Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Universal Microwave Technology
TWO:3491
Taiwan NT$2.24 Billion
American States Water Company
NYSE:AWR
USA $1.65 Billion
GZ Port
SHG:601228
China CN¥29.16 Billion
Honeywell Automation India Limited
NSE:HONAUT
India Rs-44.63 Billion
Sims Ltd
AU:SGM
Australia AU$1.84 Billion
Towne Bank
NASDAQ:TOWN
USA $19.62 Billion
Jiangxi Hongdu Aviation Industry Co Ltd
SHG:600316
China CN¥10.94 Billion
Nuvama Wealth
NSE:NUVAMA
India Rs303.68 Billion

Liability Composition Analysis (2021–2025)

This chart breaks down Hefei Chipmore Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Hefei Chipmore Technology Co. Ltd. A net asset quality index to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.98 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.37 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.27 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hefei Chipmore Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hefei Chipmore Technology Co. Ltd. A (2021–2025)

The table below shows the annual total liabilities of Hefei Chipmore Technology Co. Ltd. A from 2021 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥1.89 Billion
≈ $275.88 Million
+90.87%
2024-12-31 CN¥987.72 Million
≈ $144.53 Million
-25.35%
2023-12-31 CN¥1.32 Billion
≈ $193.63 Million
-17.29%
2022-12-31 CN¥1.60 Billion
≈ $234.10 Million
+6.14%
2021-12-31 CN¥1.51 Billion
≈ $220.56 Million
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About Hefei Chipmore Technology Co. Ltd. A

SHG:688352 China Semiconductor Equipment & Materials
Market Cap
$3.39 Billion
CN¥23.15 Billion CNY
Market Cap Rank
#4582 Global
#735 in China
Share Price
CN¥19.47
Change (1 day)
+0.78%
52-Week Range
CN¥11.87 - CN¥24.18
All Time High
CN¥24.18
About

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more