Hefei Chipmore Technology Co. Ltd. A (688352) - Total Liabilities

Latest as of June 2025: CN¥856.38 Million CNY ≈ $125.31 Million USD

Based on the latest financial reports, Hefei Chipmore Technology Co. Ltd. A (688352) has total liabilities worth CN¥856.38 Million CNY (≈ $125.31 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Hefei Chipmore Technology Co. Ltd. A (688352) cash conversion ratio to assess how effectively this company generates cash.

Hefei Chipmore Technology Co. Ltd. A - Total Liabilities Trend (2021–2024)

This chart illustrates how Hefei Chipmore Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. Check how resilient are Hefei Chipmore Technology Co. Ltd. A's assets to evaluate the company's liquid asset resilience ratio.

Hefei Chipmore Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Hefei Chipmore Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
China Kings Resources Group Co
SHG:603505
China CN¥4.84 Billion
Zillow Group Inc
NASDAQ:ZG
USA $801.00 Million
HORNBACH Baumarkt AG
HM:HBM
Germany €2.65 Billion
Aksa Enerji Uretim AS
IS:AKSEN
Turkey TL57.90 Billion
Talos Energy
NYSE:TALO
USA $3.32 Billion
Insight Enterprises Inc
NASDAQ:NSIT
USA $7.44 Billion
Gansu Jingyuan Coal Industry and Electricity Power Co Ltd
SHE:000552
China CN¥17.67 Billion
Shandong Iron and Steel Co Ltd
SHG:600022
China CN¥37.99 Billion

Liability Composition Analysis (2021–2024)

This chart breaks down Hefei Chipmore Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of Hefei Chipmore Technology Co. Ltd. A.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.41 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.14 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.12 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hefei Chipmore Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hefei Chipmore Technology Co. Ltd. A (2021–2024)

The table below shows the annual total liabilities of Hefei Chipmore Technology Co. Ltd. A from 2021 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥987.72 Million
≈ $144.53 Million
-25.35%
2023-12-31 CN¥1.32 Billion
≈ $193.63 Million
-17.29%
2022-12-31 CN¥1.60 Billion
≈ $234.10 Million
+6.14%
2021-12-31 CN¥1.51 Billion
≈ $220.56 Million
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About Hefei Chipmore Technology Co. Ltd. A

SHG:688352 China Semiconductor Equipment & Materials
Market Cap
$2.26 Billion
CN¥15.42 Billion CNY
Market Cap Rank
#5835 Global
#1231 in China
Share Price
CN¥12.97
Change (1 day)
+1.33%
52-Week Range
CN¥10.46 - CN¥16.68
All Time High
CN¥17.21
About

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more