Hefei Chipmore Technology Co. Ltd. A Total Liabilities

Latest as of March 2026: CN¥2.14 Billion CNY ≈ $313.42 Million USD

Hefei Chipmore Technology Co. Ltd. A total liabilities. Based on the latest financial reports, Hefei Chipmore Technology Co. Ltd. A (688352) has total liabilities worth CN¥2.14 Billion CNY (≈ $313.42 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check asset resilience ratio of Hefei Chipmore Technology Co. Ltd. A to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Hefei Chipmore Technology Co. Ltd. A (2021–2025)

Total liabilities of Hefei Chipmore Technology Co. Ltd. A from 2021 to 2025. This chart illustrates how Hefei Chipmore Technology Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data.

Hefei Chipmore Technology Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Hefei Chipmore Technology Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Bank of N.T. Butterfield & Son Ltd
NYSE:NTB
USA $13.29 Billion
Treasury Wine Estates Limited
F:T7W
Germany €3.51 Billion
BTG Hotels Group Co Ltd
SHG:600258
China CN¥12.28 Billion
Remy Cointreau
PA:RCO
France €1.54 Billion
Auren Energia S.A.
SA:AURE3
Brazil R$33.96 Billion
TAV Havalimanlari Holding
IS:TAVHL
Turkey TL3.45 Billion
Ultra Clean Holdings Inc
NASDAQ:UCTT
USA $1.20 Billion
Flywire Corp
NASDAQ:FLYW
USA $346.40 Million

Liability Composition Analysis (2021–2025)

This chart breaks down Hefei Chipmore Technology Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Hefei Chipmore Technology Co. Ltd. A (688352) total assets.

Liquidity & Leverage Metrics

Hefei Chipmore Technology Co. Ltd. A Total Liabilities Ratios Explained

Hefei Chipmore Technology Co. Ltd. A total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 3.98 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.37 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.27 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hefei Chipmore Technology Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hefei Chipmore Technology Co. Ltd. A (2021–2025)

The table below shows the annual total liabilities of Hefei Chipmore Technology Co. Ltd. A from 2021 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥1.89 Billion
≈ $275.88 Million
+90.87%
2024-12-31 CN¥987.72 Million
≈ $144.53 Million
-25.35%
2023-12-31 CN¥1.32 Billion
≈ $193.63 Million
-17.29%
2022-12-31 CN¥1.60 Billion
≈ $234.10 Million
+6.14%
2021-12-31 CN¥1.51 Billion
≈ $220.56 Million
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About Hefei Chipmore Technology Co. Ltd. A

SHG:688352 China Semiconductor Equipment & Materials
Market Cap
$2.17 Billion
CN¥14.86 Billion CNY
Market Cap Rank
#5648 Global
#975 in China
Share Price
CN¥12.50
Change (1 day)
-1.42%
52-Week Range
CN¥11.87 - CN¥24.18
All Time High
CN¥24.18
About

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more